EP2AGZ300FH29I4G vs EP2AGZ300FH29C4G مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP2AGZ300FH29I4G بواسطة Intel و EP2AGZ300FH29C4G بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP2AGZ300FH29I4G | EP2AGZ300FH29C4G |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Family | Arria II GZ (AGZ) | — |
| Logic Elements (LE) | 300,000 (approx., per family member) | — |
| Number of I/O | 281 | [DATA_NEEDED: max user I/O count] |
| Package Type | 780-ball Flip-Chip BGA (FineLine) | — |
| Package Code | FH29 (29x29 mm) | — |
| نطاق درجة حرارة التشغيل | -40C to +100C (industrial, I-grade) | — |
| Speed Grade | I4 | — |
| Process Node | 40 nm TSMC | — |
| Supply Voltage (Core) | 0.9 V (typical) | — |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel | — |
| Transceivers | Embedded multi-gigabit transceivers (per family) | — |
| DSP Blocks | Yes (variable-precision, per family) | — |
| Block RAM | Embedded M9K / M144K blocks | — |
| حالة RoHS | Compliant | Compliant |
| نوع التركيب | Surface Mount (BGA) | Surface Mount |
| مستوى MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL moisture sensitivity level] |
| Lead-Free | Yes (per RoHS) | Yes |
| Series | — | Arria II GZ |
| Logic Elements | — | 300,000 (approx.) |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| Total RAM Bits | — | [DATA_NEEDED: embedded memory bits] |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count and rate] |
| Number of Multipliers (18x18) | — | [DATA_NEEDED: DSP block count] |
| Voltage - Supply | — | [DATA_NEEDED: core and I/O supply rails] |
| درجة حرارة التشغيل | — | 0C to +85C (commercial grade, suffix C) |
| Grade | — | C4 (commercial, speed grade 4) |
| العلبة / الحالة | — | 780-BGA (Fine-pitch BGA, FH29) |
| Process Technology | — | 40 nm |
| Manufacturer | — | Intel (formerly Altera) |