EP2AGZ300FH29I4G vs EP2AGZ300FH29C4G Perbandingan

Perbandingan bersamaan detil EP2AGZ300FH29I4G dari Intel dan EP2AGZ300FH29C4G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP2AGZ300FH29I4G EP2AGZ300FH29C4G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Arria II GZ (AGZ) —
Logic Elements (LE) 300,000 (approx., per family member) —
Number of I/O 281 [DATA_NEEDED: max user I/O count]
Package Type 780-ball Flip-Chip BGA (FineLine) —
Package Code FH29 (29x29 mm) —
Rentang Suhu Kerja -40C to +100C (industrial, I-grade) —
Speed Grade I4 —
Process Node 40 nm TSMC —
Supply Voltage (Core) 0.9 V (typical) —
Configuration Method JTAG / Passive Serial / Fast Passive Parallel —
Transceivers Embedded multi-gigabit transceivers (per family) —
DSP Blocks Yes (variable-precision, per family) —
Block RAM Embedded M9K / M144K blocks —
Status RoHS Compliant Compliant
Tipe Mounting Surface Mount (BGA) Surface Mount
Level MSL [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL moisture sensitivity level]
Lead-Free Yes (per RoHS) Yes
Series — Arria II GZ
Logic Elements — 300,000 (approx.)
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
Total RAM Bits — [DATA_NEEDED: embedded memory bits]
Number of Transceivers — [DATA_NEEDED: transceiver count and rate]
Number of Multipliers (18x18) — [DATA_NEEDED: DSP block count]
Voltage - Supply — [DATA_NEEDED: core and I/O supply rails]
Suhu Kerja — 0C to +85C (commercial grade, suffix C)
Grade — C4 (commercial, speed grade 4)
Paket / Case — 780-BGA (Fine-pitch BGA, FH29)
Process Technology — 40 nm
Manufacturer — Intel (formerly Altera)

Spek dan Sumber

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