EP2AGZ300FH29I4G vs EP2AGZ300FH29C4G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300FH29I4G sa pamamagitan ng Intel at EP2AGZ300FH29C4G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ300FH29I4G | EP2AGZ300FH29C4G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GZ (AGZ) | — |
| Logic Elements (LE) | 300,000 (approx., per family member) | — |
| Number of I/O | 281 | [DATA_NEEDED: max user I/O count] |
| Package Type | 780-ball Flip-Chip BGA (FineLine) | — |
| Package Code | FH29 (29x29 mm) | — |
| Hanay ng Temperature na Operasyon | -40C to +100C (industrial, I-grade) | — |
| Speed Grade | I4 | — |
| Process Node | 40 nm TSMC | — |
| Supply Voltage (Core) | 0.9 V (typical) | — |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel | — |
| Transceivers | Embedded multi-gigabit transceivers (per family) | — |
| DSP Blocks | Yes (variable-precision, per family) | — |
| Block RAM | Embedded M9K / M144K blocks | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL moisture sensitivity level] |
| Lead-Free | Yes (per RoHS) | Yes |
| Series | — | Arria II GZ |
| Logic Elements | — | 300,000 (approx.) |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| Total RAM Bits | — | [DATA_NEEDED: embedded memory bits] |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count and rate] |
| Number of Multipliers (18x18) | — | [DATA_NEEDED: DSP block count] |
| Voltage - Supply | — | [DATA_NEEDED: core and I/O supply rails] |
| Temperature na Operasyon | — | 0C to +85C (commercial grade, suffix C) |
| Grade | — | C4 (commercial, speed grade 4) |
| Packhaging / Kaso | — | 780-BGA (Fine-pitch BGA, FH29) |
| Process Technology | — | 40 nm |
| Manufacturer | — | Intel (formerly Altera) |