EPF10K50VFC484-3N vs EPF10K130EFC484-3N مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EPF10K50VFC484-3N بواسطة Intel و EPF10K130EFC484-3N بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EPF10K50VFC484-3N | EPF10K130EFC484-3N |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | NRND | NRND |
| Family | FLEX-10K | — |
| Logic Elements | 2,880 | — |
| Typical Gates | 50,000 | — |
| Total RAM Bits | 40,960 | 65536 |
| Embedded Array Blocks (EABs) | 12 | — |
| Logic Array Blocks (LABs) | 10 | — |
| Maximum User I/Os | 291 | — |
| Supply Voltage (VCCINT) | 3.0 V to 3.6 V (3.3 V nominal) | — |
| I/O Voltage Standards | 5.0 V, 3.3 V, 2.5 V (MultiVolt) | — |
| Internal Frequency | 125 MHz | — |
| Propagation Delay (per LE) | 0.6 ns | — |
| Process Technology | 0.42 µm CMOS, SRAM-based | 0.22 µm CMOS |
| العلبة | 484-FBGA (23 x 23 mm, 1.27 mm pitch) | — |
| درجة حرارة التشغيل | 0 °C to +70 °C (commercial) | — |
| Configuration Modes | Passive Serial, Passive Parallel (Sync/Async), Active Serial, JTAG | — |
| JTAG Support | IEEE 1149.1 Boundary Scan | — |
| حالة RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| نوع التركيب | Surface Mount (BGA) | Surface Mount |
| Series | — | FLEX-10KE |
| Number of Logic Elements / Cells | — | 6656 |
| Typical Gate Count | — | 130000 |
| Number of I/O | — | 369 |
| Number of LABs/CLBs | — | 832 |
| Number of Embedded Array Blocks (EABs) | — | 72 |
| Speed Grade | — | -3 (faster timing bin) |
| Operating Temperature Grade | — | Commercial (0C to +70C) |
| Core Voltage | — | 2.5 V |
| Package Type | — | 484-BBGA (FineLine BGA) |
| Package Dimensions | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Configuration Memory | — | SRAM-based (volatile, requires config device) |
| Configuration Interface | — | JTAG / PS / PPS / Altera serial |