EPF10K50VFC484-3N vs EPF10K130EFC484-3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K50VFC484-3N sa pamamagitan ng Intel at EPF10K130EFC484-3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K50VFC484-3N EPF10K130EFC484-3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND NRND
Family FLEX-10K —
Logic Elements 2,880 —
Typical Gates 50,000 —
Total RAM Bits 40,960 65536
Embedded Array Blocks (EABs) 12 —
Logic Array Blocks (LABs) 10 —
Maximum User I/Os 291 —
Supply Voltage (VCCINT) 3.0 V to 3.6 V (3.3 V nominal) —
I/O Voltage Standards 5.0 V, 3.3 V, 2.5 V (MultiVolt) —
Internal Frequency 125 MHz —
Propagation Delay (per LE) 0.6 ns —
Process Technology 0.42 µm CMOS, SRAM-based 0.22 µm CMOS
Packhaging 484-FBGA (23 x 23 mm, 1.27 mm pitch) —
Temperature na Operasyon 0 °C to +70 °C (commercial) —
Configuration Modes Passive Serial, Passive Parallel (Sync/Async), Active Serial, JTAG —
JTAG Support IEEE 1149.1 Boundary Scan —
Tindminan RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Series — FLEX-10KE
Number of Logic Elements / Cells — 6656
Typical Gate Count — 130000
Number of I/O — 369
Number of LABs/CLBs — 832
Number of Embedded Array Blocks (EABs) — 72
Speed Grade — -3 (faster timing bin)
Operating Temperature Grade — Commercial (0C to +70C)
Core Voltage — 2.5 V
Package Type — 484-BBGA (FineLine BGA)
Package Dimensions — 23 x 23 mm
Ball Pitch — 1.0 mm
Configuration Memory — SRAM-based (volatile, requires config device)
Configuration Interface — JTAG / PS / PPS / Altera serial

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