MC9RS08KB12CWJ vs MC9RS08KA8CWJ مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MC9RS08KB12CWJ بواسطة NXP Semiconductors و MC9RS08KA8CWJ بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
NXP Semiconductors
MC9RS08KB12CWJ - 8-bit RS08 MCU, 12KB Flash, 20MHz | NXP SOIC-20
MC9RS08KB12CWJ ✓ نشطNXP Semiconductors
MC9RS08KA8CWJ - 8-bit RS08 MCU, 8KB Flash, 20MHz | NXP
MC9RS08KA8CWJ ⚠ آخر فرصة للشراءمقارنة المواصفات
| المعامل | MC9RS08KB12CWJ | MC9RS08KA8CWJ |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | نشط | آخر فرصة للشراء |
| Core | RS08 (8-bit, HC08-compatible instruction subset) | — |
| Program Memory (Flash) | 12 KB (12K x 8) | — |
| RAM | 126 bytes | — |
| Maximum CPU Frequency | 20 MHz | 20 MHz |
| Operating Voltage Range | 2.5 V / 3.3 V / 5 V | 2.5 V to 5.5 V (also stated as 2.5V/3.3V/5V) |
| ADC | [DATA_NEEDED: ADC channels and resolution] | — |
| Timers | 8-bit timer with PWM channel | — |
| Analog Comparator | Integrated | — |
| Interrupt Architecture | Single global interrupt vector | — |
| Instruction Set Features | HC08 subset + BGND (background debug) | — |
| العلبة | 20-SOIC (0.295 inch / 7.50 mm body width) | 20-SOIC Wide (20-SOIC W, Tube) |
| نوع التركيب | Surface Mount | Surface Mount (SMD/SMT) |
| نطاق درجة حرارة التشغيل | [DATA_NEEDED: temperature grade from datasheet] | -40 C to +85 C (Industrial) |
| Debug Interface | Background Debug Mode (BDM) | — |
| حالة RoHS | [DATA_NEEDED: RoHS status from official source] | [DATA_NEEDED: RoHS status from data] |
| Lead-Free | [DATA_NEEDED: lead-free reflow compatibility] | — |
| Core Architecture | — | RS08 (8-bit, HC08 subset) |
| عرض ناقل البيانات | — | 8 bit |
| Program Memory Size | — | 8 KB Flash |
| Number of I/O Pins | — | 18 |
| Pin/Package Count | — | 20 pins |
| Instruction Set | — | Subset of HC08 with added BGND instruction |
| Peripherals | — | Keyboard Interface (KBI), Timers, Internal Clock Source |
| Packaging Method | — | Tube |
| مستوى MSL | — | [DATA_NEEDED: MSL level] |