MC9RS08KB12CWJ vs MC9RS08KA8CWJ Perbandingan
Perbandingan bersamaan detil MC9RS08KB12CWJ dari NXP Semiconductors dan MC9RS08KA8CWJ dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9RS08KB12CWJ - 8-bit RS08 MCU, 12KB Flash, 20MHz | NXP SOIC-20
MC9RS08KB12CWJ ✓ AktifNXP Semiconductors
MC9RS08KA8CWJ - 8-bit RS08 MCU, 8KB Flash, 20MHz | NXP
MC9RS08KA8CWJ ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | MC9RS08KB12CWJ | MC9RS08KA8CWJ |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Waktu Pembelian Terakhir |
| Core | RS08 (8-bit, HC08-compatible instruction subset) | — |
| Program Memory (Flash) | 12 KB (12K x 8) | — |
| RAM | 126 bytes | — |
| Maximum CPU Frequency | 20 MHz | 20 MHz |
| Operating Voltage Range | 2.5 V / 3.3 V / 5 V | 2.5 V to 5.5 V (also stated as 2.5V/3.3V/5V) |
| ADC | [DATA_NEEDED: ADC channels and resolution] | — |
| Timers | 8-bit timer with PWM channel | — |
| Analog Comparator | Integrated | — |
| Interrupt Architecture | Single global interrupt vector | — |
| Instruction Set Features | HC08 subset + BGND (background debug) | — |
| Paket | 20-SOIC (0.295 inch / 7.50 mm body width) | 20-SOIC Wide (20-SOIC W, Tube) |
| Tipe Mounting | Surface Mount | Surface Mount (SMD/SMT) |
| Rentang Suhu Kerja | [DATA_NEEDED: temperature grade from datasheet] | -40 C to +85 C (Industrial) |
| Debug Interface | Background Debug Mode (BDM) | — |
| Status RoHS | [DATA_NEEDED: RoHS status from official source] | [DATA_NEEDED: RoHS status from data] |
| Lead-Free | [DATA_NEEDED: lead-free reflow compatibility] | — |
| Core Architecture | — | RS08 (8-bit, HC08 subset) |
| Lebar Bus Data | — | 8 bit |
| Program Memory Size | — | 8 KB Flash |
| Number of I/O Pins | — | 18 |
| Pin/Package Count | — | 20 pins |
| Instruction Set | — | Subset of HC08 with added BGND instruction |
| Peripherals | — | Keyboard Interface (KBI), Timers, Internal Clock Source |
| Packaging Method | — | Tube |
| Level MSL | — | [DATA_NEEDED: MSL level] |