MW7IC2220NR1 vs MW7IC2220NBR1 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MW7IC2220NR1 بواسطة NXP Semiconductors و MW7IC2220NBR1 بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
NXP Semiconductors
MW7IC2220NR1 - 2W W-CDMA RF LDMOS PA, 2110-2170 MHz, 28V | NXP
MW7IC2220NR1 ✓ نشطNXP Semiconductors
MW7IC2220NBR1 - 2W W-CDMA RF Power Amplifier 2.11-2.17 GHz | NXP
MW7IC2220NBR1 ✓ نشطمقارنة المواصفات
| المعامل | MW7IC2220NR1 | MW7IC2220NBR1 |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | RF Amplifiers | RF Amplifiers |
| حالة دورة الحياة | نشط | نشط |
| Technology | LDMOS (Laterally Diffused MOSFET) | RF LDMOS (Laterally Diffused MOSFET) |
| RF Type | W-CDMA / Wideband Integrated Power Amplifier | — |
| Frequency Range | 2000 MHz to 2200 MHz | 2000 MHz to 2200 MHz (usable), 2110-2170 MHz (W-CDMA band) |
| Operating Band (W-CDMA) | 2110 MHz to 2170 MHz | — |
| Test Frequency | 2167.5 MHz | — |
| Output Power (Avg, W-CDMA) | 2 W Avg. | — |
| Supply Voltage (VDD) | 28 V typical | — |
| Drain Voltage Rating | 24 V to 32 V operational range | — |
| Quiescent Current (IDQ1) | 80 mA | — |
| Quiescent Current (IDQ2) | 300 mA | — |
| Small-Signal Gain | 31 dB | 31 dB (typical at 2.17 GHz) |
| Input/Output Matching | On-chip, 50 ohm nominal | — |
| Stages | Two-stage integrated amplifier | — |
| العلبة / الحالة | TO-270-16 Variant, Flat Leads (TO-270WB-16) | — |
| نوع التركيب | Surface Mount (with bolted flange/heatsink tab) | Surface Mount (flange/over-molded) |
| درجة حرارة التشغيل | -40C to +150C (junction) | — |
| Packaging | Tape & Reel (R1 suffix) | — |
| Modulation Formats Supported | W-CDMA, TD-SCDMA, single-carrier W-CDMA | — |
| الوظيفة | — | W-CDMA Wideband Integrated Power Amplifier |
| Operating Frequency (typical) | — | 2167.5 MHz |
| Average Output Power | — | 2 W (33 dBm) |
| Drain Supply Voltage (VDD) | — | 28 V (24 V to 32 V operating range) |
| Quiescent Current Stage 1 (IDQ1) | — | 80 mA |
| Quiescent Current Stage 2 (IDQ2) | — | 300 mA |
| Package Type | — | TO-272WB-16 (over-molded plastic) |
| Input Matching | — | On-chip (50 ohm nominal) |
| Output Matching | — | On-chip (50 ohm nominal) |
| Characteristic Impedance | — | 50 ohm |
| Maximum Operating Temperature | — | 150 C |
| Modulation Support | — | W-CDMA, TD-SCDMA, LTE, multi-carrier |
| Test Signal | — | Single-Carrier W-CDMA, IQ Magnitude Clipping, PAR = 7.5 dB |
| ACPR Measurement | — | 3.84 MHz channel bandwidth at +/-5 MHz offset |