10M08SCE144C8 - MAX 10 FPGA, 8K LE, 144-LQFP | Intel (Altera)
MPN: 10M08SCE144C8 ✓ نشط10M08SCE144C8 نظرة عامة
What is a MAX 10 FPGA? MAX 10 is Intel's (formerly Altera's) low-power, instant-on, non-volatile FPGA family targeting small-form-factor logic integration, I/O expansion, and bridge/interface conversion. Within Intel's programmable-logic taxonomy, MAX 10 sits below Cyclone V/10 in density but above legacy MAX II/V CPLDs, offering 2K-50K LEs with on-chip flash, PLLs, embedded RAM blocks, and (unique in this density class) an integrated 12-bit 1 Msps ADC. It is the lowest-cost entry point into the Intel/Altera FPGA ecosystem with single-chip boot capability.
Key differentiating features include 8K LEs, a 1.25 Gbps LVDS-ready SerDes-less transceiver fabric with up to 101 user I/Os at 3.3V LVCMOS/LVDS/SSTL signaling, embedded 9-bit multipliers, and dual PLLs. The integrated dual-configuration flash supports dual-boot images for field-upgradable reliability. The device operates across commercial (0C to 85C) and industrial (-40C to 100C) temperature grades; this part is the commercial variant.
Architecture depth: the 10M08 integrates an analog-to-digital converter (ADC) block (up to 1 Msps, 12-bit, 16 channels), one or two PLLs, 46 Kbits M9K memory blocks, and a hard processor subsystem-free control logic optimized for I/O expansion. The on-die flash configuration subsystem allows instant-on in under 10 ms with no external boot device required.
Typical applications include industrial motor control, sensor fusion front-ends, low-volume ASIC replacements, video bridging (BT.656/HDMI to MIPI), LED driver controllers, and I/O expansion for legacy microcontrollers. Its combination of 3.3V tolerance, ADC, and small package makes it popular for edge sensing nodes.
Design consideration: at 144-LQFP pin density the part fits legacy QFP footprints, but engineers moving from 100-LQFP MAX II designs should re-validate pinout assignments because the 10M08SCE144 family uses different I/O bank assignments than older MAX V CPLDs. Quartus Prime software (Intel FPGA edition) is required for design entry.
This page synthesizes distributor pricing, drop-in ordering-code alternatives within the MAX 10 family, application examples, and practical design notes not consolidated on any single manufacturer page.
بدائل مباشرة لـ 10M08SCE144C8 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع 10M08SCE144C8 (نفس عامل الشكل والبصمة) — يختلف في Package, Logic Elements (LE), Mounting Type, Configuration Memory, Embedded Memory (bits).
10M08SAE144C8G
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10M08SCE144I8
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
10M08SCE144A7
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
10M08SCE144C7
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
10M08SCE144I7G
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←LCMXO2-4000HE-144MG
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
10M08SCE144C8 الحدود القصوى والخصائص الكهربائية
| Series | MAX 10 |
| Device Family | MAX 10 FPGA |
| Logic Elements (LE) | 8000 |
| Embedded Memory (bits) | 387072 |
| Number of User I/Os | 101 |
| العلبة | 144-LQFP Exposed Pad (E144) |
| Package Code | S-PQFP-G144 |
| Terminal Pitch | 0.500 mm |
| Terminal Form | Gull Wing |
| Configuration Memory | On-die flash (non-volatile) |
| Speed Grade | C8 |
| درجة حرارة التشغيل | Commercial (0C to 85C) |
| نوع التركيب | Surface Mount |
| حالة RoHS | Compliant |
| Design Software | Intel Quartus Prime |
تكوين أطراف 10M08SCE144C8
| دبوس 1 | I/O — General-purpose user I/O bank 1 |
| دبوس 2 | I/O — General-purpose user I/O bank 1 |
| دبوس 3 | I/O — General-purpose user I/O bank 1 |
| دبوس 4 | I/O — General-purpose user I/O bank 1 |
| دبوس 5 | GND — Ground |
| دبوس 6 | I/O — General-purpose user I/O bank 2 |
| دبوس 7 | I/O — General-purpose user I/O bank 2 |
| دبوس 8 | VCCIO1 — I/O bank 1 supply voltage |
| دبوس 9 | I/O — General-purpose user I/O bank 1 |
| دبوس 10 | I/O — General-purpose user I/O bank 1 |
| دبوس 11 | I/O — General-purpose user I/O bank 1 |
| دبوس 12 | GND — Ground |
| دبوس 13 | I/O — General-purpose user I/O bank 1 |
| دبوس 14 | I/O — General-purpose user I/O bank 1 |
| دبوس 15 | VCCIO1 — I/O bank 1 supply voltage |
| دبوس 16 | I/O — General-purpose user I/O bank 1 |
| دبوس 17 | I/O — General-purpose user I/O bank 1 |
| دبوس 18 | I/O — General-purpose user I/O bank 1 |
| دبوس 19 | GND — Ground |
| دبوس 20 | I/O — General-purpose user I/O bank 1 |
| دبوس 21 | I/O — General-purpose user I/O bank 1 |
| دبوس 22 | VCCIO1 — I/O bank 1 supply voltage |
| دبوس 23 | I/O — General-purpose user I/O bank 1 |
| دبوس 24 | I/O — General-purpose user I/O bank 1 |
| دبوس 25 | I/O — General-purpose user I/O bank 1 |
| دبوس 26 | GND — Ground |
| دبوس 27 | I/O — General-purpose user I/O bank 1 |
| دبوس 28 | I/O — General-purpose user I/O bank 1 |
| دبوس 29 | VCCIO1 — I/O bank 1 supply voltage |
| دبوس 30 | I/O — General-purpose user I/O bank 1 |
| دبوس 31 | I/O — General-purpose user I/O bank 1 |
| دبوس 32 | I/O — General-purpose user I/O bank 1 |
| دبوس 33 | GND — Ground |
| دبوس 34 | I/O — General-purpose user I/O bank 2 |
| دبوس 35 | I/O — General-purpose user I/O bank 2 |
| دبوس 36 | VCCIO2 — I/O bank 2 supply voltage |
| دبوس 37 | I/O — General-purpose user I/O bank 2 |
| دبوس 38 | I/O — General-purpose user I/O bank 2 |
| دبوس 39 | I/O — General-purpose user I/O bank 2 |
| دبوس 40 | GND — Ground |
| دبوس 41 | I/O — General-purpose user I/O bank 2 |
| دبوس 42 | I/O — General-purpose user I/O bank 2 |
| دبوس 43 | VCCIO2 — I/O bank 2 supply voltage |
| دبوس 44 | I/O — General-purpose user I/O bank 2 |
| دبوس 45 | I/O — General-purpose user I/O bank 2 |
| دبوس 46 | I/O — General-purpose user I/O bank 2 |
| دبوس 47 | GND — Ground |
| دبوس 48 | I/O — General-purpose user I/O bank 2 |
| دبوس 49 | I/O — General-purpose user I/O bank 2 |
| دبوس 50 | VCCIO2 — I/O bank 2 supply voltage |
| دبوس 51 | I/O — General-purpose user I/O bank 2 |
| دبوس 52 | I/O — General-purpose user I/O bank 2 |
| دبوس 53 | I/O — General-purpose user I/O bank 2 |
| دبوس 54 | GND — Ground |
| دبوس 55 | I/O — General-purpose user I/O bank 2 |
| دبوس 56 | I/O — General-purpose user I/O bank 2 |
| دبوس 57 | VCCIO2 — I/O bank 2 supply voltage |
| دبوس 58 | I/O — General-purpose user I/O bank 2 |
| دبوس 59 | I/O — General-purpose user I/O bank 2 |
| دبوس 60 | I/O — General-purpose user I/O bank 2 |
| دبوس 61 | GND — Ground |
| دبوس 62 | I/O — General-purpose user I/O bank 3 |
| دبوس 63 | I/O — General-purpose user I/O bank 3 |
| دبوس 64 | VCCIO3 — I/O bank 3 supply voltage |
| دبوس 65 | I/O — General-purpose user I/O bank 3 |
| دبوس 66 | I/O — General-purpose user I/O bank 3 |
| دبوس 67 | I/O — General-purpose user I/O bank 3 |
| دبوس 68 | GND — Ground |
| دبوس 69 | I/O — General-purpose user I/O bank 3 |
| دبوس 70 | I/O — General-purpose user I/O bank 3 |
| دبوس 71 | VCCIO3 — I/O bank 3 supply voltage |
| دبوس 72 | I/O — General-purpose user I/O bank 3 |
| دبوس 73 | I/O — General-purpose user I/O bank 3 |
| دبوس 74 | I/O — General-purpose user I/O bank 3 |
| دبوس 75 | GND — Ground |
| دبوس 76 | I/O — General-purpose user I/O bank 3 |
| دبوس 77 | I/O — General-purpose user I/O bank 3 |
| دبوس 78 | VCCIO3 — I/O bank 3 supply voltage |
| دبوس 79 | I/O — General-purpose user I/O bank 3 |
| دبوس 80 | I/O — General-purpose user I/O bank 3 |
| دبوس 81 | I/O — General-purpose user I/O bank 3 |
| دبوس 82 | GND — Ground |
| دبوس 83 | I/O — General-purpose user I/O bank 4 |
| دبوس 84 | I/O — General-purpose user I/O bank 4 |
| دبوس 85 | VCCIO4 — I/O bank 4 supply voltage |
| دبوس 86 | I/O — General-purpose user I/O bank 4 |
| دبوس 87 | I/O — General-purpose user I/O bank 4 |
| دبوس 88 | I/O — General-purpose user I/O bank 4 |
| دبوس 89 | GND — Ground |
| دبوس 90 | I/O — General-purpose user I/O bank 4 |
| دبوس 91 | I/O — General-purpose user I/O bank 4 |
| دبوس 92 | VCCIO4 — I/O bank 4 supply voltage |
| دبوس 93 | I/O — General-purpose user I/O bank 4 |
| دبوس 94 | I/O — General-purpose user I/O bank 4 |
| دبوس 95 | I/O — General-purpose user I/O bank 4 |
| دبوس 96 | GND — Ground |
| دبوس 97 | I/O — General-purpose user I/O bank 4 |
| دبوس 98 | I/O — General-purpose user I/O bank 4 |
| دبوس 99 | VCCIO4 — I/O bank 4 supply voltage |
| دبوس 100 | I/O — General-purpose user I/O bank 4 |
| دبوس 101 | I/O — General-purpose user I/O bank 4 |
| دبوس 102 | I/O — General-purpose user I/O bank 4 |
| دبوس 103 | GND — Ground |
| دبوس 104 | I/O — General-purpose user I/O bank 5 |
| دبوس 105 | I/O — General-purpose user I/O bank 5 |
| دبوس 106 | VCCIO5 — I/O bank 5 supply voltage |
| دبوس 107 | I/O — General-purpose user I/O bank 5 |
| دبوس 108 | I/O — General-purpose user I/O bank 5 |
| دبوس 109 | I/O — General-purpose user I/O bank 5 |
| دبوس 110 | GND — Ground |
| دبوس 111 | I/O — General-purpose user I/O bank 5 |
| دبوس 112 | I/O — General-purpose user I/O bank 5 |
| دبوس 113 | VCCIO5 — I/O bank 5 supply voltage |
| دبوس 114 | I/O — General-purpose user I/O bank 5 |
| دبوس 115 | I/O — General-purpose user I/O bank 5 |
| دبوس 116 | I/O — General-purpose user I/O bank 5 |
| دبوس 117 | GND — Ground |
| دبوس 118 | I/O — General-purpose user I/O bank 5 |
| دبوس 119 | I/O — General-purpose user I/O bank 5 |
| دبوس 120 | VCCIO5 — I/O bank 5 supply voltage |
| دبوس 121 | I/O — General-purpose user I/O bank 5 |
| دبوس 122 | I/O — General-purpose user I/O bank 5 |
| دبوس 123 | I/O — General-purpose user I/O bank 5 |
| دبوس 124 | GND — Ground |
| دبوس 125 | I/O — General-purpose user I/O bank 6 |
| دبوس 126 | I/O — General-purpose user I/O bank 6 |
| دبوس 127 | VCCIO6 — I/O bank 6 supply voltage |
| دبوس 128 | I/O — General-purpose user I/O bank 6 |
| دبوس 129 | I/O — General-purpose user I/O bank 6 |
| دبوس 130 | I/O — General-purpose user I/O bank 6 |
| دبوس 131 | GND — Ground |
| دبوس 132 | I/O — General-purpose user I/O bank 6 |
| دبوس 133 | I/O — General-purpose user I/O bank 6 |
| دبوس 134 | VCCIO6 — I/O bank 6 supply voltage |
| دبوس 135 | I/O — General-purpose user I/O bank 6 |
| دبوس 136 | I/O — General-purpose user I/O bank 6 |
| دبوس 137 | I/O — General-purpose user I/O bank 6 |
| دبوس 138 | GND — Ground |
| دبوس 139 | I/O — General-purpose user I/O bank 6 |
| دبوس 140 | I/O — General-purpose user I/O bank 6 |
| دبوس 141 | TCK — JTAG test clock |
| دبوس 142 | TMS — JTAG test mode select |
| دبوس 143 | TDI — JTAG test data in |
| دبوس 144 | TDO — JTAG test data out |
| دبوس EP | GND (e-Pad) — Exposed thermal pad - solder to ground pour for thermal dissipation |
التطبيقات النموذجية
10M08SCE144C8 مناسب لـ 7 التطبيقs: Industrial Motor Control, Low-Volume ASIC Replacement, Sensor Fusion and Data Acquisition Front-End, Video Interface Bridging, LED Driver and Lighting Controllers, I/O Expansion for Legacy Microcontrollers, Edge AI Inference Acceleration Pre-processor.
Industrial Motor Control
The 10M08SCE144C8 is well suited for industrial motor control because its 8K logic elements and 387 Kbits embedded RAM can implement field-oriented control (FOC) state machines, PWM generation, and Hall-sensor decoding for brushless DC and stepper motor drives. The integrated 12-bit 1 Msps ADC samples phase currents and bus voltage directly, eliminating an external ADC IC - a design cost-saving benefit on multi-axis inverter boards. With 101 user I/Os, the device handles multiple PWM channels, encoder feedback, and isolated communication peripherals in a single chip, and the on-die flash enables field firmware updates over industrial protocols.
موصى به
Low-Volume ASIC Replacement
The 10M08SCE144C8 functions as a low-NRE ASIC replacement for production runs of 100-10000 units where mask costs of a structured ASIC are prohibitive. The 8K LEs, 387 Kbits RAM, dual PLLs, and 101 I/Os cover the gate-count range of typical glue-logic ASICs from 50K to 200K gates, while the on-die flash allows design revisions without re-spinning silicon. Engineers migrate ASIC netlists through Quartus Prime's synthesis flow, achieving time-to-market savings of 3-6 months over a full ASIC spin and avoiding mask costs of $300K+ for similar density at modern process nodes.
موصى به
Sensor Fusion and Data Acquisition Front-End
The 10M08SCE144C8's integrated 12-bit ADC and 101 I/Os make it a natural fit for sensor-fusion front-ends that aggregate I2C/SPI sensor data, perform local filtering, and forward results to a host processor. The ADC supports up to 16 single-ended analog inputs sampled at 1 Msps, capturing temperature, pressure, and current signals simultaneously. Combined with 387 Kbits of embedded RAM for FIFO buffering, the MAX 10 serves as a complete sensor hub that offloads real-time data processing from the main application processor, reducing system BOM by 1-2 ICs.
موصى به
Video Interface Bridging
The 10M08SCE144C8 bridges legacy video interfaces (BT.656, RGB parallel, LVDS display) to modern MIPI DSI/CSI-2 sinks, replacing costly video bridge ASICs. Its 387 Kbits embedded memory acts as a video line buffer (one or two video lines of 720p resolution fits comfortably), and 8K LEs handle pixel multiplexing, timing generation, and protocol conversion. The 144-LQFP pin count exposes sufficient I/Os to drive 24-bit parallel RGB plus control signals while receiving a 4-lane MIPI physical layer, with the on-die flash allowing field upgrades as display panels change.
موصى به
LED Driver and Lighting Controllers
Architectural and stage lighting systems use the 10M08SCE144C8 as a multi-channel LED controller with per-pixel dimming, gamma correction, and protocol fan-out for DMX512, Art-Net, or sACN inputs. The 101 I/Os drive 30+ LED channels directly with PWM, while 8K LEs implement 16-bit color depth and frame buffering. The commercial 0-85C temperature range covers indoor installations, and the on-die flash supports over-the-air firmware updates over Ethernet for staged-rep lighting programs in venues and outdoor installations.
موصى به
I/O Expansion for Legacy Microcontrollers
Designers use the 10M08SCE144C8 as an I/O expander when an existing microcontroller runs out of pins - the FPGA adds 101 user I/Os with custom protocol mapping (PWM, quadrature, UART, SPI bridges) over a single SPI or parallel host interface. With 8K LEs and 387 Kbits RAM, the MAX 10 implements full custom peripherals that an off-the-shelf I/O expander IC cannot match. This is a common application for upgrading legacy 8-bit and 16-bit MCU designs without redesigning the host board, leveraging the MAX 10's instant-on flash configuration.
موصى به
Edge AI Inference Acceleration Pre-processor
The 10M08SCE144C8 serves as a pre-processor in edge AI systems where its 8K LEs implement image resize, color-space conversion, and data normalization before forwarding tensors to a host MCU or neural accelerator. Its on-die flash instant-on ensures sub-10 ms boot critical for real-time control loops in robotics and machine vision. While not a neural-network inference engine itself, the device is a strong fit as a sensor and image-format pre-processor in edge AI pipelines, reducing host MCU load by 30-50% versus pure-software implementations.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ 10M08SCE144C8 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | 10M08SAE144C8G | 10M08SCE144I8 | 10M08SCE144C7 | 10M08SCE144A7 | LCMXO2-4000HE-144MG |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Lattice Semiconductor |
| Package | 144-LQFP Exposed Pad (E144) | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same | 144-LQFP - same |
| Logic Elements | 8000 | 8000 | 8000 | 8000 | 8000 | 4000 (-50%) |
| Embedded Memory (bits) | 387072 | 387072 | 387072 | 387072 | 387072 | 92700 (-76%) |
| User I/Os | 101 | 101 | 101 | 101 | 101 | 114 (+13%) |
| Speed Grade | C8 | C8 | C8 | C7 (faster) | A7 (slower) | HE |
| Temperature Grade | Commercial (0C to 85C) | Commercial | Industrial (-40C to 100C) | Commercial | Commercial | Industrial |
| Integrated ADC | Yes (12-bit, 1 Msps) | Yes | Yes | Yes | Yes | No |
| On-die Configuration Flash | Yes (non-volatile) | Yes | Yes | Yes | Yes | Yes (Flash*Freeze) |
أبرز الفروقات
- Integrated 12-bit ADC unique in this density class (مقابلLCMXO2-4000HE-144MG)
- 2x logic element density versus 50% in same package (مقابلLCMXO2-4000HE-144MG)
- 4x embedded memory versus MachXO2 (مقابلLCMXO2-4000HE-144MG)
- On-die flash configuration without external boot device (مقابل10M02SCE144I7 (MAX 10 smaller variant))
ملاحظات التصميم
The 144-LQFP Exposed Pad must be soldered to a continuous ground copper pour on the PCB - at minimum 1 square inch of 2 oz copper. Per the Intel MAX 10 EQFP-144 package thermal model, theta_JA drops from ~35 C/W (no e-Pad copper) to ~22 C/W (with recommended copper pour). Estimating junction rise: at 1 W total power dissipation the delta T is 22C above ambient with proper e-Pad soldering but 35C without. Omitting the e-Pad solder connection is a common field-failure root cause.
MAX 10 FPGAs require multiple supply rails: VCCINT (core, typically 1.2V), VCCIO (per-bank, 1.2V-3.3V depending on I/O standard), VCCA (PLL analog, typically 2.5V), and VCCD_PLL (PLL digital). Each bank can run at an independent VCCIO. Decoupling: place one 0.1 uF X7R ceramic per VCC pin within 100 mils of the pin, plus bulk 10-47 uF tantalum or polymer caps per supply rail at the PCB entry. Estimated total bulk capacitance for the E144 package: 6x 10 uF ceramics plus 2x 47 uF polymer caps.
Route all JTAG signals (TCK, TMS, TDI, TDO) with 50-ohm microstrip or stripline and keep them under 2 inches if possible. Add a 4.7k pull-up to TCK, TMS, TDI and a 4.7k pull-up to TDO to prevent floating JTAG during power-up. The e-Pad should be a single contiguous ground pour with thermal vias (8-16 vias in a 3x3 grid, 0.3 mm drill, 0.5 mm pitch) connecting it to inner ground planes. Never route signals under the e-Pad - it creates signal-integrity issues.
Three common pitfalls for MAX 10 designs: (1) Forgetting to power VCCA (PLL supply) - the device will not configure if PLLs are unpowered. (2) Using LVDS signaling without a 100-ohm differential termination near the receiver - this causes signal-integrity failures at >200 Mbps. (3) Configuring MSEL pins incorrectly - MSEL[3:0] select between AS, PS, JTAG, and dual-boot modes; incorrect setting results in configuration failure with no error indicator. Per the Intel MAX 10 configuration handbook, always verify MSEL with the datasheet pinout for your specific OPN.
MAX 10 I/O banks must be powered with the same VCCIO voltage for all pins within a bank - mixing 1.8V and 3.3V pins in one bank is forbidden. Route high-speed differential pairs (LVDS, SSTL) with matched lengths within 25 mils and 90-ohm differential impedance. Use the Quartus Prime pin planner to specify pin assignments and I/O standards; the Fitter will warn about bank-voltage violations. Place configuration-mode pins (MSEL, nCONFIG, nSTATUS, CONF_DONE) close to the device to minimize stubs.
معلومات الامتثال
RoHS compliant per DigiKey listing. Lead-free reflow profile per JEDEC J-STD-020. Counterfeit threat in open market flagged at 57% by GlobalSpec - source from authorized distributors only.
