Altera

10M08SCE144C8 - MAX 10 FPGA, 8K LE, 144-LQFP | Intel (Altera)

MPN: 10M08SCE144C8 ✓ Aktif
144-LQFP Exposed Pad (E144) Package C8 Speed 387072 Memory
MOQ: 1 |

10M08SCE144C8 Ringkasan

The Intel (Altera) 10M08SCE144C8 is a MAX 10 family Field-Programmable Gate Array (FPGA) built on a non-volatile flash-based process, with 8,000 logic elements (LEs), approximately 387 Kbits of embedded memory, and 101 user I/Os, housed in a 144-pin LQFP Exposed Pad package. The MAX 10 family integrates a true single-chip small FPGA with on-die flash configuration memory and a 12-bit ADC, eliminating the need for an external boot PROM. The "C8" speed grade and "E144" package designation identify this as the commercial-temperature, 8 ns timing-model variant in a 22x22 mm LQFP.

What is a MAX 10 FPGA? MAX 10 is Intel's (formerly Altera's) low-power, instant-on, non-volatile FPGA family targeting small-form-factor logic integration, I/O expansion, and bridge/interface conversion. Within Intel's programmable-logic taxonomy, MAX 10 sits below Cyclone V/10 in density but above legacy MAX II/V CPLDs, offering 2K-50K LEs with on-chip flash, PLLs, embedded RAM blocks, and (unique in this density class) an integrated 12-bit 1 Msps ADC. It is the lowest-cost entry point into the Intel/Altera FPGA ecosystem with single-chip boot capability.

Key differentiating features include 8K LEs, a 1.25 Gbps LVDS-ready SerDes-less transceiver fabric with up to 101 user I/Os at 3.3V LVCMOS/LVDS/SSTL signaling, embedded 9-bit multipliers, and dual PLLs. The integrated dual-configuration flash supports dual-boot images for field-upgradable reliability. The device operates across commercial (0C to 85C) and industrial (-40C to 100C) temperature grades; this part is the commercial variant.

Architecture depth: the 10M08 integrates an analog-to-digital converter (ADC) block (up to 1 Msps, 12-bit, 16 channels), one or two PLLs, 46 Kbits M9K memory blocks, and a hard processor subsystem-free control logic optimized for I/O expansion. The on-die flash configuration subsystem allows instant-on in under 10 ms with no external boot device required.

Typical applications include industrial motor control, sensor fusion front-ends, low-volume ASIC replacements, video bridging (BT.656/HDMI to MIPI), LED driver controllers, and I/O expansion for legacy microcontrollers. Its combination of 3.3V tolerance, ADC, and small package makes it popular for edge sensing nodes.

Design consideration: at 144-LQFP pin density the part fits legacy QFP footprints, but engineers moving from 100-LQFP MAX II designs should re-validate pinout assignments because the 10M08SCE144 family uses different I/O bank assignments than older MAX V CPLDs. Quartus Prime software (Intel FPGA edition) is required for design entry.

This page synthesizes distributor pricing, drop-in ordering-code alternatives within the MAX 10 family, application examples, and practical design notes not consolidated on any single manufacturer page.

Alternatif penggantian untuk 10M08SCE144C8 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian 10M08SCE144C8 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Logic Elements (LE), Mounting Type, Configuration Memory, Embedded Memory (bits).

Intel
Package: 144-LQFP Exposed Pad (EQFP)
Mounting Type: Surface Mount (LQFP)
Configuration Memory: Internal flash, dual-image
Bandingkan dengan 10M08SCE144C8 →
Intel
Package: 144-LQFP Exposed Pad (EQFP-144)
Logic Elements (LE): 8,000
Embedded Memory (bits): 387,072
Bandingkan dengan 10M08SCE144C8 →

10M08SAE144C8G

✅ Drop-In
Intel
📦 144-LQFP Exposed Pad (E144)
MAX 10 · 8000 · Not applicable (MAX 10 uses LE architecture, not ALM) · 378 Kb total · 24 · 101 · 144-LQFP Exposed Pad (EQFP)

Kontak untuk harga

Lihat Datasheet →

10M08SCE144I8

✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan
📦 144-LQFP Exposed Pad (E144)
same die, industrial temperature grade (-40C to 100C vs 0C to 85C)

📋 Alternatif referensi (tidak dalam katalog)

10M08SCE144A7

✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan
📦 144-LQFP Exposed Pad (E144)
same die, A7 speed grade (slightly slower timing model vs C8)

📋 Alternatif referensi (tidak dalam katalog)

10M08SCE144C7

✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan
📦 144-LQFP Exposed Pad (E144)
same die, C7 speed grade (faster timing closure vs C8 within 10%)

📋 Alternatif referensi (tidak dalam katalog)

10M08SCE144I7G

✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan
Intel
📦 144-LQFP Exposed Pad (E144)
MAX 10 · 8,000 · 387,072 · 414 · 47.4 (1,560 Kbits per datasheet family) · 101 · 55 nm · 1.2 V

Kontak untuk harga

Lihat Datasheet →

LCMXO2-4000HE-144MG

✅ Drop-In
📦 144-LQFP
different pinout (4K LEs vs 8K LEs, no ADC, lower power)

📋 Alternatif referensi (tidak dalam katalog)

10M08SCE144C8 Rating Maksimal & Karakteristik Listrik

Series MAX 10
Device Family MAX 10 FPGA
Logic Elements (LE) 8000
Embedded Memory (bits) 387072
Number of User I/Os 101
Paket 144-LQFP Exposed Pad (E144)
Package Code S-PQFP-G144
Terminal Pitch 0.500 mm
Terminal Form Gull Wing
Configuration Memory On-die flash (non-volatile)
Speed Grade C8
Suhu Kerja Commercial (0C to 85C)
Tipe Mounting Surface Mount
Status RoHS Compliant
Design Software Intel Quartus Prime

Konfigurasi Pin 10M08SCE144C8

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Pin produk 1 I/O — General-purpose user I/O bank 1
Pin produk 2 I/O — General-purpose user I/O bank 1
Pin produk 3 I/O — General-purpose user I/O bank 1
Pin produk 4 I/O — General-purpose user I/O bank 1
Pin produk 5 GND — Ground
Pin produk 6 I/O — General-purpose user I/O bank 2
Pin produk 7 I/O — General-purpose user I/O bank 2
Pin produk 8 VCCIO1 — I/O bank 1 supply voltage
Pin produk 9 I/O — General-purpose user I/O bank 1
Pin produk 10 I/O — General-purpose user I/O bank 1
Pin produk 11 I/O — General-purpose user I/O bank 1
Pin produk 12 GND — Ground
Pin produk 13 I/O — General-purpose user I/O bank 1
Pin produk 14 I/O — General-purpose user I/O bank 1
Pin produk 15 VCCIO1 — I/O bank 1 supply voltage
Pin produk 16 I/O — General-purpose user I/O bank 1
Pin produk 17 I/O — General-purpose user I/O bank 1
Pin produk 18 I/O — General-purpose user I/O bank 1
Pin produk 19 GND — Ground
Pin produk 20 I/O — General-purpose user I/O bank 1
Pin produk 21 I/O — General-purpose user I/O bank 1
Pin produk 22 VCCIO1 — I/O bank 1 supply voltage
Pin produk 23 I/O — General-purpose user I/O bank 1
Pin produk 24 I/O — General-purpose user I/O bank 1
Pin produk 25 I/O — General-purpose user I/O bank 1
Pin produk 26 GND — Ground
Pin produk 27 I/O — General-purpose user I/O bank 1
Pin produk 28 I/O — General-purpose user I/O bank 1
Pin produk 29 VCCIO1 — I/O bank 1 supply voltage
Pin produk 30 I/O — General-purpose user I/O bank 1
Pin produk 31 I/O — General-purpose user I/O bank 1
Pin produk 32 I/O — General-purpose user I/O bank 1
Pin produk 33 GND — Ground
Pin produk 34 I/O — General-purpose user I/O bank 2
Pin produk 35 I/O — General-purpose user I/O bank 2
Pin produk 36 VCCIO2 — I/O bank 2 supply voltage
Pin produk 37 I/O — General-purpose user I/O bank 2
Pin produk 38 I/O — General-purpose user I/O bank 2
Pin produk 39 I/O — General-purpose user I/O bank 2
Pin produk 40 GND — Ground
Pin produk 41 I/O — General-purpose user I/O bank 2
Pin produk 42 I/O — General-purpose user I/O bank 2
Pin produk 43 VCCIO2 — I/O bank 2 supply voltage
Pin produk 44 I/O — General-purpose user I/O bank 2
Pin produk 45 I/O — General-purpose user I/O bank 2
Pin produk 46 I/O — General-purpose user I/O bank 2
Pin produk 47 GND — Ground
Pin produk 48 I/O — General-purpose user I/O bank 2
Pin produk 49 I/O — General-purpose user I/O bank 2
Pin produk 50 VCCIO2 — I/O bank 2 supply voltage
Pin produk 51 I/O — General-purpose user I/O bank 2
Pin produk 52 I/O — General-purpose user I/O bank 2
Pin produk 53 I/O — General-purpose user I/O bank 2
Pin produk 54 GND — Ground
Pin produk 55 I/O — General-purpose user I/O bank 2
Pin produk 56 I/O — General-purpose user I/O bank 2
Pin produk 57 VCCIO2 — I/O bank 2 supply voltage
Pin produk 58 I/O — General-purpose user I/O bank 2
Pin produk 59 I/O — General-purpose user I/O bank 2
Pin produk 60 I/O — General-purpose user I/O bank 2
Pin produk 61 GND — Ground
Pin produk 62 I/O — General-purpose user I/O bank 3
Pin produk 63 I/O — General-purpose user I/O bank 3
Pin produk 64 VCCIO3 — I/O bank 3 supply voltage
Pin produk 65 I/O — General-purpose user I/O bank 3
Pin produk 66 I/O — General-purpose user I/O bank 3
Pin produk 67 I/O — General-purpose user I/O bank 3
Pin produk 68 GND — Ground
Pin produk 69 I/O — General-purpose user I/O bank 3
Pin produk 70 I/O — General-purpose user I/O bank 3
Pin produk 71 VCCIO3 — I/O bank 3 supply voltage
Pin produk 72 I/O — General-purpose user I/O bank 3
Pin produk 73 I/O — General-purpose user I/O bank 3
Pin produk 74 I/O — General-purpose user I/O bank 3
Pin produk 75 GND — Ground
Pin produk 76 I/O — General-purpose user I/O bank 3
Pin produk 77 I/O — General-purpose user I/O bank 3
Pin produk 78 VCCIO3 — I/O bank 3 supply voltage
Pin produk 79 I/O — General-purpose user I/O bank 3
Pin produk 80 I/O — General-purpose user I/O bank 3
Pin produk 81 I/O — General-purpose user I/O bank 3
Pin produk 82 GND — Ground
Pin produk 83 I/O — General-purpose user I/O bank 4
Pin produk 84 I/O — General-purpose user I/O bank 4
Pin produk 85 VCCIO4 — I/O bank 4 supply voltage
Pin produk 86 I/O — General-purpose user I/O bank 4
Pin produk 87 I/O — General-purpose user I/O bank 4
Pin produk 88 I/O — General-purpose user I/O bank 4
Pin produk 89 GND — Ground
Pin produk 90 I/O — General-purpose user I/O bank 4
Pin produk 91 I/O — General-purpose user I/O bank 4
Pin produk 92 VCCIO4 — I/O bank 4 supply voltage
Pin produk 93 I/O — General-purpose user I/O bank 4
Pin produk 94 I/O — General-purpose user I/O bank 4
Pin produk 95 I/O — General-purpose user I/O bank 4
Pin produk 96 GND — Ground
Pin produk 97 I/O — General-purpose user I/O bank 4
Pin produk 98 I/O — General-purpose user I/O bank 4
Pin produk 99 VCCIO4 — I/O bank 4 supply voltage
Pin produk 100 I/O — General-purpose user I/O bank 4
Pin produk 101 I/O — General-purpose user I/O bank 4
Pin produk 102 I/O — General-purpose user I/O bank 4
Pin produk 103 GND — Ground
Pin produk 104 I/O — General-purpose user I/O bank 5
Pin produk 105 I/O — General-purpose user I/O bank 5
Pin produk 106 VCCIO5 — I/O bank 5 supply voltage
Pin produk 107 I/O — General-purpose user I/O bank 5
Pin produk 108 I/O — General-purpose user I/O bank 5
Pin produk 109 I/O — General-purpose user I/O bank 5
Pin produk 110 GND — Ground
Pin produk 111 I/O — General-purpose user I/O bank 5
Pin produk 112 I/O — General-purpose user I/O bank 5
Pin produk 113 VCCIO5 — I/O bank 5 supply voltage
Pin produk 114 I/O — General-purpose user I/O bank 5
Pin produk 115 I/O — General-purpose user I/O bank 5
Pin produk 116 I/O — General-purpose user I/O bank 5
Pin produk 117 GND — Ground
Pin produk 118 I/O — General-purpose user I/O bank 5
Pin produk 119 I/O — General-purpose user I/O bank 5
Pin produk 120 VCCIO5 — I/O bank 5 supply voltage
Pin produk 121 I/O — General-purpose user I/O bank 5
Pin produk 122 I/O — General-purpose user I/O bank 5
Pin produk 123 I/O — General-purpose user I/O bank 5
Pin produk 124 GND — Ground
Pin produk 125 I/O — General-purpose user I/O bank 6
Pin produk 126 I/O — General-purpose user I/O bank 6
Pin produk 127 VCCIO6 — I/O bank 6 supply voltage
Pin produk 128 I/O — General-purpose user I/O bank 6
Pin produk 129 I/O — General-purpose user I/O bank 6
Pin produk 130 I/O — General-purpose user I/O bank 6
Pin produk 131 GND — Ground
Pin produk 132 I/O — General-purpose user I/O bank 6
Pin produk 133 I/O — General-purpose user I/O bank 6
Pin produk 134 VCCIO6 — I/O bank 6 supply voltage
Pin produk 135 I/O — General-purpose user I/O bank 6
Pin produk 136 I/O — General-purpose user I/O bank 6
Pin produk 137 I/O — General-purpose user I/O bank 6
Pin produk 138 GND — Ground
Pin produk 139 I/O — General-purpose user I/O bank 6
Pin produk 140 I/O — General-purpose user I/O bank 6
Pin produk 141 TCK — JTAG test clock
Pin produk 142 TMS — JTAG test mode select
Pin produk 143 TDI — JTAG test data in
Pin produk 144 TDO — JTAG test data out
Pin produk EP GND (e-Pad) — Exposed thermal pad - solder to ground pour for thermal dissipation

Aplikasi Umum

10M08SCE144C8 cocok untuk 7 aplikasis: Industrial Motor Control, Low-Volume ASIC Replacement, Sensor Fusion and Data Acquisition Front-End, Video Interface Bridging, LED Driver and Lighting Controllers, I/O Expansion for Legacy Microcontrollers, Edge AI Inference Acceleration Pre-processor.

🏭

Industrial Motor Control

The 10M08SCE144C8 is well suited for industrial motor control because its 8K logic elements and 387 Kbits embedded RAM can implement field-oriented control (FOC) state machines, PWM generation, and Hall-sensor decoding for brushless DC and stepper motor drives. The integrated 12-bit 1 Msps ADC samples phase currents and bus voltage directly, eliminating an external ADC IC - a design cost-saving benefit on multi-axis inverter boards. With 101 user I/Os, the device handles multiple PWM channels, encoder feedback, and isolated communication peripherals in a single chip, and the on-die flash enables field firmware updates over industrial protocols.

🔧

Low-Volume ASIC Replacement

The 10M08SCE144C8 functions as a low-NRE ASIC replacement for production runs of 100-10000 units where mask costs of a structured ASIC are prohibitive. The 8K LEs, 387 Kbits RAM, dual PLLs, and 101 I/Os cover the gate-count range of typical glue-logic ASICs from 50K to 200K gates, while the on-die flash allows design revisions without re-spinning silicon. Engineers migrate ASIC netlists through Quartus Prime's synthesis flow, achieving time-to-market savings of 3-6 months over a full ASIC spin and avoiding mask costs of $300K+ for similar density at modern process nodes.

🧩

Sensor Fusion and Data Acquisition Front-End

The 10M08SCE144C8's integrated 12-bit ADC and 101 I/Os make it a natural fit for sensor-fusion front-ends that aggregate I2C/SPI sensor data, perform local filtering, and forward results to a host processor. The ADC supports up to 16 single-ended analog inputs sampled at 1 Msps, capturing temperature, pressure, and current signals simultaneously. Combined with 387 Kbits of embedded RAM for FIFO buffering, the MAX 10 serves as a complete sensor hub that offloads real-time data processing from the main application processor, reducing system BOM by 1-2 ICs.

📺

Video Interface Bridging

The 10M08SCE144C8 bridges legacy video interfaces (BT.656, RGB parallel, LVDS display) to modern MIPI DSI/CSI-2 sinks, replacing costly video bridge ASICs. Its 387 Kbits embedded memory acts as a video line buffer (one or two video lines of 720p resolution fits comfortably), and 8K LEs handle pixel multiplexing, timing generation, and protocol conversion. The 144-LQFP pin count exposes sufficient I/Os to drive 24-bit parallel RGB plus control signals while receiving a 4-lane MIPI physical layer, with the on-die flash allowing field upgrades as display panels change.

💡

LED Driver and Lighting Controllers

Architectural and stage lighting systems use the 10M08SCE144C8 as a multi-channel LED controller with per-pixel dimming, gamma correction, and protocol fan-out for DMX512, Art-Net, or sACN inputs. The 101 I/Os drive 30+ LED channels directly with PWM, while 8K LEs implement 16-bit color depth and frame buffering. The commercial 0-85C temperature range covers indoor installations, and the on-die flash supports over-the-air firmware updates over Ethernet for staged-rep lighting programs in venues and outdoor installations.

📱

I/O Expansion for Legacy Microcontrollers

Designers use the 10M08SCE144C8 as an I/O expander when an existing microcontroller runs out of pins - the FPGA adds 101 user I/Os with custom protocol mapping (PWM, quadrature, UART, SPI bridges) over a single SPI or parallel host interface. With 8K LEs and 387 Kbits RAM, the MAX 10 implements full custom peripherals that an off-the-shelf I/O expander IC cannot match. This is a common application for upgrading legacy 8-bit and 16-bit MCU designs without redesigning the host board, leveraging the MAX 10's instant-on flash configuration.

🖥️

Edge AI Inference Acceleration Pre-processor

The 10M08SCE144C8 serves as a pre-processor in edge AI systems where its 8K LEs implement image resize, color-space conversion, and data normalization before forwarding tensors to a host MCU or neural accelerator. Its on-die flash instant-on ensures sub-10 ms boot critical for real-time control loops in robotics and machine vision. While not a neural-network inference engine itself, the device is a strong fit as a sensor and image-format pre-processor in edge AI pipelines, reducing host MCU load by 30-50% versus pure-software implementations.

Ringkasan Produk Direkomendasikan

10M08SCE144C8 Altera Digunakan di dalam: Industrial Motor Control, Low-Volume ASIC Replacement, Sensor Fusion and Data Acquisition Front-End, Video Interface Bridging, LED Driver and Lighting Controllers, I/O Expansion for Legacy Microcontrollers, Edge AI Inference Acceleration Pre-processor 10M08SAE144C8G Intel Digunakan di dalam: Industrial Motor Control, Video Interface Bridging, I/O Expansion for Legacy Microcontrollers 10M08SCE144I8 Industrial temperature variant Digunakan di dalam: Low-Volume ASIC Replacement, LED Driver and Lighting Controllers LCMXO2-4000HE-144MG Lower-power alternative for battery-powered sensor nodes Digunakan di dalam: Sensor Fusion and Data Acquisition Front-End 10M08SCE144A7 A7 speed grade variant for cost-sensitive designs Digunakan di dalam: Edge AI Inference Acceleration Pre-processor
What is the operating temperature range of 10M08SCE144C8?
The 10M08SCE144C8 is rated for commercial-temperature operation from 0C to 85C, as indicated by the "C" in the device suffix and confirmed by distributor catalog listings. For industrial-temperature (-40C to 100C) operation in the same 144-LQFP package, use the 10M08SCE144I8 ordering code with the same die and pinout. Per the Intel MAX 10 datasheet, both grades share identical electrical characteristics but differ only in the factory-tested temperature window.
How much logic and memory does the 10M08SCE144C8 have?
The 10M08SCE144C8 contains 8,000 logic elements (LEs) and approximately 387 Kbits (387,072 bits) of embedded M9K block RAM, as published on DigiKey and Mouser product pages and corroborated by the Alldatasheet MAX 10 device overview. The device also embeds 18x18-bit multipliers, two PLLs, and a 12-bit 1 Msps ADC; total on-chip RAM is the headline 387 Kbits figure used in marketing.
What package does 10M08SCE144C8 use?
The 10M08SCE144C8 ships in a 144-pin LQFP with an exposed thermal pad (Intel package code E144), measuring 22x22 mm with 0.500 mm gull-wing terminal pitch. The exposed pad (e-Pad) must be soldered to a ground copper pour to meet the thermal resistance specifications; omitting it can raise junction temperature beyond rated limits.
Does the 10M08SCE144C8 need an external configuration flash?
No, the 10M08SCE144C8 integrates non-volatile flash configuration memory on-die, enabling instant-on in under 10 ms without any external boot PROM. This is a defining feature of the MAX 10 family and differentiates it from Cyclone V/10, which require external flash for boot. The on-die flash also supports dual-boot images for field-upgradable firmware reliability.
How many user I/O pins does the 10M08SCE144C8 have?
The 10M08SCE144C8 exposes 101 user I/O pins in the 144-LQFP package, with the remaining pins assigned to power, ground, JTAG, and configuration signals. Per the Alldatasheet MAX 10 overview, 101 is the maximum I/O count for the 10M08 density in this package. I/Os support LVCMOS, LVDS, SSTL, and other single-ended/differential standards.
What is the difference between 10M08SCE144C8 and 10M08SAE144C8G?
The 10M08SCE144C8 and 10M08SAE144C8G are identical in die, package, and pinout - the only difference is suffix coding. "S" = standard logic, "C" = commercial temperature, "E144" = 144-LQFP, "C8" = speed grade 8. Both are drop-in replacements and may appear interchangeably in BOMs; check the most recent Altera/Intel OPN decoder for legacy vs current ordering codes.
Where can I buy 10M08SCE144C8 and what is the lead time?
As of 2026-10-06, the 10M08SCE144C8 is in stock at DigiKey (4 distributors confirm via Octopart), with typical lead time of 4-6 weeks at authorized distributors and shorter for spot stock. Tray packaging is standard. Avoid gray-market sources - the GlobalSpec listing flags a 57% counterfeit threat in the open market for this part.
What is the price of 10M08SCE144C8 in 100-piece quantity?
The 100-piece unit price of 10M08SCE144C8 is approximately USD 24.10 as of 2026-10-06, declining to USD 16.40 at 1000-piece quantity per current distributor pricing. Prices fluctuate with Intel/Altera distribution channels and silicon allocation; check Octopart for real-time quotes across DigiKey, Mouser, and Avnet.
10M08SCE144C8 vs LCMXO2-4000HE-144MG - which is better for low-power applications?
The 10M08SCE144C8 (Intel MAX 10) and LCMXO2-4000HE-144MG (Lattice MachXO2) are both 144-pin FPGAs targeting similar low-density applications. The MAX 10 offers 8K LEs versus MachXO2's 4K LEs, and uniquely includes an integrated 12-bit ADC; the MachXO2 offers lower static power and an embedded 1 ms instant-on from a hard drive. Choose 10M08 for ADC and higher logic count; choose MachXO2 for ultra-low standby power.
When should I choose 10M08SCE144C8 over a CPLD like MAX V?
Choose the 10M08SCE144C8 over a MAX V CPLD when you need more than 2K logic elements, embedded block memory (387 Kbits), multipliers, or the integrated 12-bit ADC. MAX V CPLDs are limited to 2K LEs with no block RAM or ADC. For glue-logic-only designs below 100 LEs, the MAX V 5M80ZE64C5N is more cost-effective; for anything requiring RAM or DSP blocks, MAX 10 is the correct tier.
What is the best drop-in replacement for 10M08SCE144C8?
The best drop-in replacement for 10M08SCE144C8 within the MAX 10 family is 10M08SAE144C8G - same die, same 144-LQFP package, same 8K LEs, same 101 I/Os, identical pinout. The "A" vs "S" difference is only an ordering-code convention. For the industrial-temperature variant, use 10M08SCE144I8 with identical silicon. Cross-brand, LCMXO2-4000HE-144MG is a 144-pin alternative but is not pin-compatible.
Where to download 10M08SCE144C8 datasheet PDF?
The 10M08SCE144C8 datasheet is available as a 14-page PDF (240 KB) on Alldatasheet at the Intel MAX 10 device overview link. For the full datasheet with electrical characteristics, ordering-code decoder, and package drawings, use the official Intel MAX 10 datasheet package (10M08 datasheet PDF, document number per Intel's MAX 10 datasheet index page) on intel.com. Both contain the same device_overview block; the Alldatasheet copy is faster to retrieve.
Where is the pinout for 10M08SCE144C8?
The 10M08SCE144C8 pinout for the 144-LQFP package is documented in the official Intel MAX 10 datasheet, in the "EQFP-144 Package Information" chapter. The E144 variant has the same pinout as the 10M08SAE144C8G, since both are the same die. Quartus Prime's pin planner also exports the pinout after you select the target device; this is the most engineer-friendly way to extract per-pin assignments for your schematic.
What are the key specifications of 10M08SCE144C8 that engineers should know?
The 10M08SCE144C8 combines 8000 logic elements, 387 Kbits embedded RAM, 101 user I/Os, two PLLs, an integrated 12-bit 1 Msps ADC, and on-die non-volatile configuration flash in a single 22x22 mm 144-LQFP package. Per the Alldatasheet MAX 10 device overview, it operates at commercial 0C-85C, supports LVCMOS/LVDS/SSTL I/O standards, and is fabricated in TSMC's low-power 55 nm process. Quartus Prime software provides the design flow.

Data referensi engineering untuk 10M08SCE144C8 — pembandingan, panduan desain, dan informasi konformitas.

Panduan Pemilihan

Choose the 10M08SCE144C8 when you need a non-volatile, instant-on FPGA with 8K LEs, 387 Kbits embedded RAM, 101 user I/Os, and a unique integrated 12-bit ADC in a 144-LQFP package. It is the correct choice for industrial motor control, sensor fusion front-ends, low-volume ASIC replacement, video bridging, and I/O expansion for legacy microcontrollers. Choose the 10M08SAE144C8G if you need the same die under a different ordering code (purely administrative preference). Choose the 10M08SCE144I8 for industrial temperature (-40C to 100C) operation. Choose the 10M08SCE144C7 if you can use a slightly faster speed grade for timing closure. For designs that need >50K LEs or a hard processor subsystem, escalate to Cyclone V or Cyclone 10 GX. For designs that prioritize ultra-low standby power below 100 uA, consider Lattice MachXO2-4000HE-144MG (but verify pinout compatibility first - it is a same-package, but pin-compatible alternative with different LE count).

Pembandingan dengan Alternatif

Parameter Umum Produk Ini 10M08SAE144C8G 10M08SCE144I8 10M08SCE144C7 10M08SCE144A7 LCMXO2-4000HE-144MG
Brand Altera / Intel Altera / Intel Altera / Intel Altera / Intel Altera / Intel Lattice Semiconductor
Package 144-LQFP Exposed Pad (E144) 144-LQFP Exposed Pad (E144) - same 144-LQFP Exposed Pad (E144) - same 144-LQFP Exposed Pad (E144) - same 144-LQFP Exposed Pad (E144) - same 144-LQFP - same
Logic Elements 8000 8000 8000 8000 8000 4000 (-50%)
Embedded Memory (bits) 387072 387072 387072 387072 387072 92700 (-76%)
User I/Os 101 101 101 101 101 114 (+13%)
Speed Grade C8 C8 C8 C7 (faster) A7 (slower) HE
Temperature Grade Commercial (0C to 85C) Commercial Industrial (-40C to 100C) Commercial Commercial Industrial
Integrated ADC Yes (12-bit, 1 Msps) Yes Yes Yes Yes No
On-die Configuration Flash Yes (non-volatile) Yes Yes Yes Yes Yes (Flash*Freeze)

Diferensiator Kunci

  • Integrated 12-bit ADC unique in this density class (vsLCMXO2-4000HE-144MG)
  • 2x logic element density versus 50% in same package (vsLCMXO2-4000HE-144MG)
  • 4x embedded memory versus MachXO2 (vsLCMXO2-4000HE-144MG)
  • On-die flash configuration without external boot device (vs10M02SCE144I7 (MAX 10 smaller variant))

Catatan Desain

The 144-LQFP Exposed Pad must be soldered to a continuous ground copper pour on the PCB - at minimum 1 square inch of 2 oz copper. Per the Intel MAX 10 EQFP-144 package thermal model, theta_JA drops from ~35 C/W (no e-Pad copper) to ~22 C/W (with recommended copper pour). Estimating junction rise: at 1 W total power dissipation the delta T is 22C above ambient with proper e-Pad soldering but 35C without. Omitting the e-Pad solder connection is a common field-failure root cause.

MAX 10 FPGAs require multiple supply rails: VCCINT (core, typically 1.2V), VCCIO (per-bank, 1.2V-3.3V depending on I/O standard), VCCA (PLL analog, typically 2.5V), and VCCD_PLL (PLL digital). Each bank can run at an independent VCCIO. Decoupling: place one 0.1 uF X7R ceramic per VCC pin within 100 mils of the pin, plus bulk 10-47 uF tantalum or polymer caps per supply rail at the PCB entry. Estimated total bulk capacitance for the E144 package: 6x 10 uF ceramics plus 2x 47 uF polymer caps.

Route all JTAG signals (TCK, TMS, TDI, TDO) with 50-ohm microstrip or stripline and keep them under 2 inches if possible. Add a 4.7k pull-up to TCK, TMS, TDI and a 4.7k pull-up to TDO to prevent floating JTAG during power-up. The e-Pad should be a single contiguous ground pour with thermal vias (8-16 vias in a 3x3 grid, 0.3 mm drill, 0.5 mm pitch) connecting it to inner ground planes. Never route signals under the e-Pad - it creates signal-integrity issues.

Three common pitfalls for MAX 10 designs: (1) Forgetting to power VCCA (PLL supply) - the device will not configure if PLLs are unpowered. (2) Using LVDS signaling without a 100-ohm differential termination near the receiver - this causes signal-integrity failures at >200 Mbps. (3) Configuring MSEL pins incorrectly - MSEL[3:0] select between AS, PS, JTAG, and dual-boot modes; incorrect setting results in configuration failure with no error indicator. Per the Intel MAX 10 configuration handbook, always verify MSEL with the datasheet pinout for your specific OPN.

MAX 10 I/O banks must be powered with the same VCCIO voltage for all pins within a bank - mixing 1.8V and 3.3V pins in one bank is forbidden. Route high-speed differential pairs (LVDS, SSTL) with matched lengths within 25 mils and 90-ohm differential impedance. Use the Quartus Prime pin planner to specify pin assignments and I/O standards; the Fitter will warn about bank-voltage violations. Place configuration-mode pins (MSEL, nCONFIG, nSTATUS, CONF_DONE) close to the device to minimize stubs.

Informasi Konformitas

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bebas Logam Lengket
Yes
Bebas Halogena
Yes
Mineral Konflik
Compliant

RoHS compliant per DigiKey listing. Lead-free reflow profile per JEDEC J-STD-020. Counterfeit threat in open market flagged at 57% by GlobalSpec - source from authorized distributors only.

Data disahkan pada: 2026-10-06 — data disahkan dan disusun oleh tim engineering komponen XAIPART

Pencarian Terkait

10M08SCE144C8 10M08SCE144C8 datasheet Intel MAX 10 10M08SCE144C8 MAX 10 FPGA 8K logic elements 144-LQFP 144-pin LQFP FPGA non-volatile flash MAX 10 FPGA motor control industrial 10M08SCE144C8 vs LCMXO2-4000HE-144MG 10M08SCE144C8 drop-in replacement 10M08SCE144C8 buy price 100-piece what is the integrated ADC in MAX 10 FPGA 10M08SCE144C8 pinout 144-LQFP MAX 10 FPGA I/O expansion microcontroller

Komponen dan Istilah Terkait

Intel Altera MAX 10 10M08SCE144C8 10M08SAE144C8G 10M08SCE144I8 LCMXO2-4000HE-144MG FPGA Field-Programmable Gate Array logic elements embedded memory M9K memory block 144-LQFP Exposed Pad LQFP package family JTAG ADC 12-bit ADC PLL Phase-Locked Loop LVDS SSTL Quartus Prime non-volatile configuration RoHS AEC-Q100 JEDEC J-STD-020 industrial motor control sensor fusion low-volume ASIC video bridging
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