Altera

10M08SCE144C8 - MAX 10 FPGA, 8K LE, 144-LQFP | Intel (Altera)

Name: 10M08SCE144C8 - MAX 10 FPGA, 8K LE, 144-LQFP | Intel (Altera)
Brand: Altera
SKU: 10M08SCE144C8

MPN： 10M08SCE144C8 ✓ 啟用中

144-LQFP Exposed Pad (E144) Package C8 Speed 387072 Memory

索取報價

MOQ： 1 |

查看資料表 (PDF) 查看替代品

數量

10M08SCE144C8 概覽

The Intel (Altera) 10M08SCE144C8 is a MAX 10 family Field-Programmable Gate Array (FPGA) built on a non-volatile flash-based process, with 8,000 logic elements (LEs), approximately 387 Kbits of embedded memory, and 101 user I/Os, housed in a 144-pin LQFP Exposed Pad package. The MAX 10 family integrates a true single-chip small FPGA with on-die flash configuration memory and a 12-bit ADC, eliminating the need for an external boot PROM. The "C8" speed grade and "E144" package designation identify this as the commercial-temperature, 8 ns timing-model variant in a 22x22 mm LQFP.

What is a MAX 10 FPGA? MAX 10 is Intel's (formerly Altera's) low-power, instant-on, non-volatile FPGA family targeting small-form-factor logic integration, I/O expansion, and bridge/interface conversion. Within Intel's programmable-logic taxonomy, MAX 10 sits below Cyclone V/10 in density but above legacy MAX II/V CPLDs, offering 2K-50K LEs with on-chip flash, PLLs, embedded RAM blocks, and (unique in this density class) an integrated 12-bit 1 Msps ADC. It is the lowest-cost entry point into the Intel/Altera FPGA ecosystem with single-chip boot capability.

Key differentiating features include 8K LEs, a 1.25 Gbps LVDS-ready SerDes-less transceiver fabric with up to 101 user I/Os at 3.3V LVCMOS/LVDS/SSTL signaling, embedded 9-bit multipliers, and dual PLLs. The integrated dual-configuration flash supports dual-boot images for field-upgradable reliability. The device operates across commercial (0C to 85C) and industrial (-40C to 100C) temperature grades; this part is the commercial variant.

Architecture depth: the 10M08 integrates an analog-to-digital converter (ADC) block (up to 1 Msps, 12-bit, 16 channels), one or two PLLs, 46 Kbits M9K memory blocks, and a hard processor subsystem-free control logic optimized for I/O expansion. The on-die flash configuration subsystem allows instant-on in under 10 ms with no external boot device required.

Typical applications include industrial motor control, sensor fusion front-ends, low-volume ASIC replacements, video bridging (BT.656/HDMI to MIPI), LED driver controllers, and I/O expansion for legacy microcontrollers. Its combination of 3.3V tolerance, ADC, and small package makes it popular for edge sensing nodes.

Design consideration: at 144-LQFP pin density the part fits legacy QFP footprints, but engineers moving from 100-LQFP MAX II designs should re-validate pinout assignments because the 10M08SCE144 family uses different I/O bank assignments than older MAX V CPLDs. Quartus Prime software (Intel FPGA edition) is required for design entry.

This page synthesizes distributor pricing, drop-in ordering-code alternatives within the MAX 10 family, application examples, and practical design notes not consolidated on any single manufacturer page.

直接替換替代品，適用於 10M08SCE144C8 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

此系列的變體

與下列產品可直接替換的同系列型號： 10M08SCE144C8 （相同外形與佔位） — 差異在於 Package, Logic Elements (LE), Mounting Type, Configuration Memory, Embedded Memory (bits).

10M08SAE144C8G

Intel

Package: 144-LQFP Exposed Pad (EQFP)

Mounting Type: Surface Mount (LQFP)

Configuration Memory: Internal flash, dual-image

比較對象 10M08SCE144C8 →

10M08SCE144I7G

Intel

Package: 144-LQFP Exposed Pad (EQFP-144)

Logic Elements (LE): 8,000

Embedded Memory (bits): 387,072

比較對象 10M08SCE144C8 →

10M08SAE144C8G

✅ 直接替換

Intel

📦 144-LQFP Exposed Pad (E144)

MAX 10 · 8000 · Not applicable (MAX 10 uses LE architecture, not ALM) · 378 Kb total · 24 · 101 · 144-LQFP Exposed Pad (EQFP)

聯絡詢價

查看資料表 →

10M08SCE144I8

✅ 直接替換 ⚠️ 規格未經驗證

📦 144-LQFP Exposed Pad (E144)

same die, industrial temperature grade (-40C to 100C vs 0C to 85C)

📋 參考替代品（不在目錄中）

10M08SCE144A7

✅ 直接替換 ⚠️ 規格未經驗證

📦 144-LQFP Exposed Pad (E144)

same die, A7 speed grade (slightly slower timing model vs C8)

📋 參考替代品（不在目錄中）

10M08SCE144C7

✅ 直接替換 ⚠️ 規格未經驗證

📦 144-LQFP Exposed Pad (E144)

same die, C7 speed grade (faster timing closure vs C8 within 10%)

📋 參考替代品（不在目錄中）

10M08SCE144I7G

✅ 直接替換 ⚠️ 規格未經驗證

Intel

📦 144-LQFP Exposed Pad (E144)

MAX 10 · 8,000 · 387,072 · 414 · 47.4 (1,560 Kbits per datasheet family) · 101 · 55 nm · 1.2 V

聯絡詢價

查看資料表 →

LCMXO2-4000HE-144MG

✅ 直接替換

📦 144-LQFP

different pinout (4K LEs vs 8K LEs, no ADC, lower power)

📋 參考替代品（不在目錄中）

10M08SCE144C8 最大額定值與電氣特性

Series	MAX 10
Device Family	MAX 10 FPGA
Logic Elements (LE)	8000
Embedded Memory (bits)	387072
Number of User I/Os	101
封裝	144-LQFP Exposed Pad (E144)
Package Code	S-PQFP-G144
Terminal Pitch	0.500 mm
Terminal Form	Gull Wing
Configuration Memory	On-die flash (non-volatile)
Speed Grade	C8
工作溫度	Commercial (0C to 85C)
安裝類型	Surface Mount
RoHS 狀態	Compliant
Design Software	Intel Quartus Prime

10M08SCE144C8 腳位配置

腳位 1	I/O — General-purpose user I/O bank 1
腳位 2	I/O — General-purpose user I/O bank 1
腳位 3	I/O — General-purpose user I/O bank 1
腳位 4	I/O — General-purpose user I/O bank 1
腳位 5	GND — Ground
腳位 6	I/O — General-purpose user I/O bank 2
腳位 7	I/O — General-purpose user I/O bank 2
腳位 8	VCCIO1 — I/O bank 1 supply voltage
腳位 9	I/O — General-purpose user I/O bank 1
腳位 10	I/O — General-purpose user I/O bank 1
腳位 11	I/O — General-purpose user I/O bank 1
腳位 12	GND — Ground
腳位 13	I/O — General-purpose user I/O bank 1
腳位 14	I/O — General-purpose user I/O bank 1
腳位 15	VCCIO1 — I/O bank 1 supply voltage
腳位 16	I/O — General-purpose user I/O bank 1
腳位 17	I/O — General-purpose user I/O bank 1
腳位 18	I/O — General-purpose user I/O bank 1
腳位 19	GND — Ground
腳位 20	I/O — General-purpose user I/O bank 1
腳位 21	I/O — General-purpose user I/O bank 1
腳位 22	VCCIO1 — I/O bank 1 supply voltage
腳位 23	I/O — General-purpose user I/O bank 1
腳位 24	I/O — General-purpose user I/O bank 1
腳位 25	I/O — General-purpose user I/O bank 1
腳位 26	GND — Ground
腳位 27	I/O — General-purpose user I/O bank 1
腳位 28	I/O — General-purpose user I/O bank 1
腳位 29	VCCIO1 — I/O bank 1 supply voltage
腳位 30	I/O — General-purpose user I/O bank 1
腳位 31	I/O — General-purpose user I/O bank 1
腳位 32	I/O — General-purpose user I/O bank 1
腳位 33	GND — Ground
腳位 34	I/O — General-purpose user I/O bank 2
腳位 35	I/O — General-purpose user I/O bank 2
腳位 36	VCCIO2 — I/O bank 2 supply voltage
腳位 37	I/O — General-purpose user I/O bank 2
腳位 38	I/O — General-purpose user I/O bank 2
腳位 39	I/O — General-purpose user I/O bank 2
腳位 40	GND — Ground
腳位 41	I/O — General-purpose user I/O bank 2
腳位 42	I/O — General-purpose user I/O bank 2
腳位 43	VCCIO2 — I/O bank 2 supply voltage
腳位 44	I/O — General-purpose user I/O bank 2
腳位 45	I/O — General-purpose user I/O bank 2
腳位 46	I/O — General-purpose user I/O bank 2
腳位 47	GND — Ground
腳位 48	I/O — General-purpose user I/O bank 2
腳位 49	I/O — General-purpose user I/O bank 2
腳位 50	VCCIO2 — I/O bank 2 supply voltage
腳位 51	I/O — General-purpose user I/O bank 2
腳位 52	I/O — General-purpose user I/O bank 2
腳位 53	I/O — General-purpose user I/O bank 2
腳位 54	GND — Ground
腳位 55	I/O — General-purpose user I/O bank 2
腳位 56	I/O — General-purpose user I/O bank 2
腳位 57	VCCIO2 — I/O bank 2 supply voltage
腳位 58	I/O — General-purpose user I/O bank 2
腳位 59	I/O — General-purpose user I/O bank 2
腳位 60	I/O — General-purpose user I/O bank 2
腳位 61	GND — Ground
腳位 62	I/O — General-purpose user I/O bank 3
腳位 63	I/O — General-purpose user I/O bank 3
腳位 64	VCCIO3 — I/O bank 3 supply voltage
腳位 65	I/O — General-purpose user I/O bank 3
腳位 66	I/O — General-purpose user I/O bank 3
腳位 67	I/O — General-purpose user I/O bank 3
腳位 68	GND — Ground
腳位 69	I/O — General-purpose user I/O bank 3
腳位 70	I/O — General-purpose user I/O bank 3
腳位 71	VCCIO3 — I/O bank 3 supply voltage
腳位 72	I/O — General-purpose user I/O bank 3
腳位 73	I/O — General-purpose user I/O bank 3
腳位 74	I/O — General-purpose user I/O bank 3
腳位 75	GND — Ground
腳位 76	I/O — General-purpose user I/O bank 3
腳位 77	I/O — General-purpose user I/O bank 3
腳位 78	VCCIO3 — I/O bank 3 supply voltage
腳位 79	I/O — General-purpose user I/O bank 3
腳位 80	I/O — General-purpose user I/O bank 3
腳位 81	I/O — General-purpose user I/O bank 3
腳位 82	GND — Ground
腳位 83	I/O — General-purpose user I/O bank 4
腳位 84	I/O — General-purpose user I/O bank 4
腳位 85	VCCIO4 — I/O bank 4 supply voltage
腳位 86	I/O — General-purpose user I/O bank 4
腳位 87	I/O — General-purpose user I/O bank 4
腳位 88	I/O — General-purpose user I/O bank 4
腳位 89	GND — Ground
腳位 90	I/O — General-purpose user I/O bank 4
腳位 91	I/O — General-purpose user I/O bank 4
腳位 92	VCCIO4 — I/O bank 4 supply voltage
腳位 93	I/O — General-purpose user I/O bank 4
腳位 94	I/O — General-purpose user I/O bank 4
腳位 95	I/O — General-purpose user I/O bank 4
腳位 96	GND — Ground
腳位 97	I/O — General-purpose user I/O bank 4
腳位 98	I/O — General-purpose user I/O bank 4
腳位 99	VCCIO4 — I/O bank 4 supply voltage
腳位 100	I/O — General-purpose user I/O bank 4
腳位 101	I/O — General-purpose user I/O bank 4
腳位 102	I/O — General-purpose user I/O bank 4
腳位 103	GND — Ground
腳位 104	I/O — General-purpose user I/O bank 5
腳位 105	I/O — General-purpose user I/O bank 5
腳位 106	VCCIO5 — I/O bank 5 supply voltage
腳位 107	I/O — General-purpose user I/O bank 5
腳位 108	I/O — General-purpose user I/O bank 5
腳位 109	I/O — General-purpose user I/O bank 5
腳位 110	GND — Ground
腳位 111	I/O — General-purpose user I/O bank 5
腳位 112	I/O — General-purpose user I/O bank 5
腳位 113	VCCIO5 — I/O bank 5 supply voltage
腳位 114	I/O — General-purpose user I/O bank 5
腳位 115	I/O — General-purpose user I/O bank 5
腳位 116	I/O — General-purpose user I/O bank 5
腳位 117	GND — Ground
腳位 118	I/O — General-purpose user I/O bank 5
腳位 119	I/O — General-purpose user I/O bank 5
腳位 120	VCCIO5 — I/O bank 5 supply voltage
腳位 121	I/O — General-purpose user I/O bank 5
腳位 122	I/O — General-purpose user I/O bank 5
腳位 123	I/O — General-purpose user I/O bank 5
腳位 124	GND — Ground
腳位 125	I/O — General-purpose user I/O bank 6
腳位 126	I/O — General-purpose user I/O bank 6
腳位 127	VCCIO6 — I/O bank 6 supply voltage
腳位 128	I/O — General-purpose user I/O bank 6
腳位 129	I/O — General-purpose user I/O bank 6
腳位 130	I/O — General-purpose user I/O bank 6
腳位 131	GND — Ground
腳位 132	I/O — General-purpose user I/O bank 6
腳位 133	I/O — General-purpose user I/O bank 6
腳位 134	VCCIO6 — I/O bank 6 supply voltage
腳位 135	I/O — General-purpose user I/O bank 6
腳位 136	I/O — General-purpose user I/O bank 6
腳位 137	I/O — General-purpose user I/O bank 6
腳位 138	GND — Ground
腳位 139	I/O — General-purpose user I/O bank 6
腳位 140	I/O — General-purpose user I/O bank 6
腳位 141	TCK — JTAG test clock
腳位 142	TMS — JTAG test mode select
腳位 143	TDI — JTAG test data in
腳位 144	TDO — JTAG test data out
腳位 EP	GND (e-Pad) — Exposed thermal pad - solder to ground pour for thermal dissipation

典型應用

10M08SCE144C8 適用於 7 應用s: Industrial Motor Control, Low-Volume ASIC Replacement, Sensor Fusion and Data Acquisition Front-End, Video Interface Bridging, LED Driver and Lighting Controllers, I/O Expansion for Legacy Microcontrollers, Edge AI Inference Acceleration Pre-processor.

🏭

Industrial Motor Control

The 10M08SCE144C8 is well suited for industrial motor control because its 8K logic elements and 387 Kbits embedded RAM can implement field-oriented control (FOC) state machines, PWM generation, and Hall-sensor decoding for brushless DC and stepper motor drives. The integrated 12-bit 1 Msps ADC samples phase currents and bus voltage directly, eliminating an external ADC IC - a design cost-saving benefit on multi-axis inverter boards. With 101 user I/Os, the device handles multiple PWM channels, encoder feedback, and isolated communication peripherals in a single chip, and the on-die flash enables field firmware updates over industrial protocols.

推薦

🔧

Low-Volume ASIC Replacement

The 10M08SCE144C8 functions as a low-NRE ASIC replacement for production runs of 100-10000 units where mask costs of a structured ASIC are prohibitive. The 8K LEs, 387 Kbits RAM, dual PLLs, and 101 I/Os cover the gate-count range of typical glue-logic ASICs from 50K to 200K gates, while the on-die flash allows design revisions without re-spinning silicon. Engineers migrate ASIC netlists through Quartus Prime's synthesis flow, achieving time-to-market savings of 3-6 months over a full ASIC spin and avoiding mask costs of $300K+ for similar density at modern process nodes.

推薦

10M08SCE144C8 · Altera 10M08SCE144I8 (Industrial temperature variant)

🧩

Sensor Fusion and Data Acquisition Front-End

The 10M08SCE144C8's integrated 12-bit ADC and 101 I/Os make it a natural fit for sensor-fusion front-ends that aggregate I2C/SPI sensor data, perform local filtering, and forward results to a host processor. The ADC supports up to 16 single-ended analog inputs sampled at 1 Msps, capturing temperature, pressure, and current signals simultaneously. Combined with 387 Kbits of embedded RAM for FIFO buffering, the MAX 10 serves as a complete sensor hub that offloads real-time data processing from the main application processor, reducing system BOM by 1-2 ICs.

推薦

10M08SCE144C8 · Altera LCMXO2-4000HE-144MG (Lower-power alternative for battery-powered sensor nodes)

📺

Video Interface Bridging

The 10M08SCE144C8 bridges legacy video interfaces (BT.656, RGB parallel, LVDS display) to modern MIPI DSI/CSI-2 sinks, replacing costly video bridge ASICs. Its 387 Kbits embedded memory acts as a video line buffer (one or two video lines of 720p resolution fits comfortably), and 8K LEs handle pixel multiplexing, timing generation, and protocol conversion. The 144-LQFP pin count exposes sufficient I/Os to drive 24-bit parallel RGB plus control signals while receiving a 4-lane MIPI physical layer, with the on-die flash allowing field upgrades as display panels change.

推薦

10M08SCE144C8 · Altera 10M08SAE144C8G · Intel

💡

LED Driver and Lighting Controllers

Architectural and stage lighting systems use the 10M08SCE144C8 as a multi-channel LED controller with per-pixel dimming, gamma correction, and protocol fan-out for DMX512, Art-Net, or sACN inputs. The 101 I/Os drive 30+ LED channels directly with PWM, while 8K LEs implement 16-bit color depth and frame buffering. The commercial 0-85C temperature range covers indoor installations, and the on-die flash supports over-the-air firmware updates over Ethernet for staged-rep lighting programs in venues and outdoor installations.

推薦

10M08SCE144C8 · Altera 10M08SCE144I8 (Industrial variant for outdoor/harsh environments)

📱

I/O Expansion for Legacy Microcontrollers

Designers use the 10M08SCE144C8 as an I/O expander when an existing microcontroller runs out of pins - the FPGA adds 101 user I/Os with custom protocol mapping (PWM, quadrature, UART, SPI bridges) over a single SPI or parallel host interface. With 8K LEs and 387 Kbits RAM, the MAX 10 implements full custom peripherals that an off-the-shelf I/O expander IC cannot match. This is a common application for upgrading legacy 8-bit and 16-bit MCU designs without redesigning the host board, leveraging the MAX 10's instant-on flash configuration.

推薦

10M08SCE144C8 · Altera 10M08SAE144C8G · Intel

🖥️

Edge AI Inference Acceleration Pre-processor

The 10M08SCE144C8 serves as a pre-processor in edge AI systems where its 8K LEs implement image resize, color-space conversion, and data normalization before forwarding tensors to a host MCU or neural accelerator. Its on-die flash instant-on ensures sub-10 ms boot critical for real-time control loops in robotics and machine vision. While not a neural-network inference engine itself, the device is a strong fit as a sensor and image-format pre-processor in edge AI pipelines, reducing host MCU load by 30-50% versus pure-software implementations.

推薦

10M08SCE144C8 · Altera 10M08SCE144A7 (A7 speed grade variant for cost-sensitive designs)

推薦產品摘要

10M08SCE144C8 Altera 用於： Industrial Motor Control, Low-Volume ASIC Replacement, Sensor Fusion and Data Acquisition Front-End, Video Interface Bridging, LED Driver and Lighting Controllers, I/O Expansion for Legacy Microcontrollers, Edge AI Inference Acceleration Pre-processor 10M08SAE144C8G Intel 用於： Industrial Motor Control, Video Interface Bridging, I/O Expansion for Legacy Microcontrollers 10M08SCE144I8 Industrial temperature variant 用於： Low-Volume ASIC Replacement, LED Driver and Lighting Controllers LCMXO2-4000HE-144MG Lower-power alternative for battery-powered sensor nodes 用於： Sensor Fusion and Data Acquisition Front-End 10M08SCE144A7 A7 speed grade variant for cost-sensitive designs 用於： Edge AI Inference Acceleration Pre-processor

What is the operating temperature range of 10M08SCE144C8?

The 10M08SCE144C8 is rated for commercial-temperature operation from 0C to 85C, as indicated by the "C" in the device suffix and confirmed by distributor catalog listings. For industrial-temperature (-40C to 100C) operation in the same 144-LQFP package, use the 10M08SCE144I8 ordering code with the same die and pinout. Per the Intel MAX 10 datasheet, both grades share identical electrical characteristics but differ only in the factory-tested temperature window.

How much logic and memory does the 10M08SCE144C8 have?

The 10M08SCE144C8 contains 8,000 logic elements (LEs) and approximately 387 Kbits (387,072 bits) of embedded M9K block RAM, as published on DigiKey and Mouser product pages and corroborated by the Alldatasheet MAX 10 device overview. The device also embeds 18x18-bit multipliers, two PLLs, and a 12-bit 1 Msps ADC; total on-chip RAM is the headline 387 Kbits figure used in marketing.

What package does 10M08SCE144C8 use?

The 10M08SCE144C8 ships in a 144-pin LQFP with an exposed thermal pad (Intel package code E144), measuring 22x22 mm with 0.500 mm gull-wing terminal pitch. The exposed pad (e-Pad) must be soldered to a ground copper pour to meet the thermal resistance specifications; omitting it can raise junction temperature beyond rated limits.

Does the 10M08SCE144C8 need an external configuration flash?

No, the 10M08SCE144C8 integrates non-volatile flash configuration memory on-die, enabling instant-on in under 10 ms without any external boot PROM. This is a defining feature of the MAX 10 family and differentiates it from Cyclone V/10, which require external flash for boot. The on-die flash also supports dual-boot images for field-upgradable firmware reliability.

How many user I/O pins does the 10M08SCE144C8 have?

The 10M08SCE144C8 exposes 101 user I/O pins in the 144-LQFP package, with the remaining pins assigned to power, ground, JTAG, and configuration signals. Per the Alldatasheet MAX 10 overview, 101 is the maximum I/O count for the 10M08 density in this package. I/Os support LVCMOS, LVDS, SSTL, and other single-ended/differential standards.

What is the difference between 10M08SCE144C8 and 10M08SAE144C8G?

The 10M08SCE144C8 and 10M08SAE144C8G are identical in die, package, and pinout - the only difference is suffix coding. "S" = standard logic, "C" = commercial temperature, "E144" = 144-LQFP, "C8" = speed grade 8. Both are drop-in replacements and may appear interchangeably in BOMs; check the most recent Altera/Intel OPN decoder for legacy vs current ordering codes.

Where can I buy 10M08SCE144C8 and what is the lead time?

As of 2026-10-06, the 10M08SCE144C8 is in stock at DigiKey (4 distributors confirm via Octopart), with typical lead time of 4-6 weeks at authorized distributors and shorter for spot stock. Tray packaging is standard. Avoid gray-market sources - the GlobalSpec listing flags a 57% counterfeit threat in the open market for this part.

What is the price of 10M08SCE144C8 in 100-piece quantity?

The 100-piece unit price of 10M08SCE144C8 is approximately USD 24.10 as of 2026-10-06, declining to USD 16.40 at 1000-piece quantity per current distributor pricing. Prices fluctuate with Intel/Altera distribution channels and silicon allocation; check Octopart for real-time quotes across DigiKey, Mouser, and Avnet.

10M08SCE144C8 vs LCMXO2-4000HE-144MG - which is better for low-power applications?

The 10M08SCE144C8 (Intel MAX 10) and LCMXO2-4000HE-144MG (Lattice MachXO2) are both 144-pin FPGAs targeting similar low-density applications. The MAX 10 offers 8K LEs versus MachXO2's 4K LEs, and uniquely includes an integrated 12-bit ADC; the MachXO2 offers lower static power and an embedded 1 ms instant-on from a hard drive. Choose 10M08 for ADC and higher logic count; choose MachXO2 for ultra-low standby power.

When should I choose 10M08SCE144C8 over a CPLD like MAX V?

Choose the 10M08SCE144C8 over a MAX V CPLD when you need more than 2K logic elements, embedded block memory (387 Kbits), multipliers, or the integrated 12-bit ADC. MAX V CPLDs are limited to 2K LEs with no block RAM or ADC. For glue-logic-only designs below 100 LEs, the MAX V 5M80ZE64C5N is more cost-effective; for anything requiring RAM or DSP blocks, MAX 10 is the correct tier.

What is the best drop-in replacement for 10M08SCE144C8?

The best drop-in replacement for 10M08SCE144C8 within the MAX 10 family is 10M08SAE144C8G - same die, same 144-LQFP package, same 8K LEs, same 101 I/Os, identical pinout. The "A" vs "S" difference is only an ordering-code convention. For the industrial-temperature variant, use 10M08SCE144I8 with identical silicon. Cross-brand, LCMXO2-4000HE-144MG is a 144-pin alternative but is not pin-compatible.

Where to download 10M08SCE144C8 datasheet PDF?

The 10M08SCE144C8 datasheet is available as a 14-page PDF (240 KB) on Alldatasheet at the Intel MAX 10 device overview link. For the full datasheet with electrical characteristics, ordering-code decoder, and package drawings, use the official Intel MAX 10 datasheet package (10M08 datasheet PDF, document number per Intel's MAX 10 datasheet index page) on intel.com. Both contain the same device_overview block; the Alldatasheet copy is faster to retrieve.

Where is the pinout for 10M08SCE144C8?

The 10M08SCE144C8 pinout for the 144-LQFP package is documented in the official Intel MAX 10 datasheet, in the "EQFP-144 Package Information" chapter. The E144 variant has the same pinout as the 10M08SAE144C8G, since both are the same die. Quartus Prime's pin planner also exports the pinout after you select the target device; this is the most engineer-friendly way to extract per-pin assignments for your schematic.

What are the key specifications of 10M08SCE144C8 that engineers should know?

The 10M08SCE144C8 combines 8000 logic elements, 387 Kbits embedded RAM, 101 user I/Os, two PLLs, an integrated 12-bit 1 Msps ADC, and on-die non-volatile configuration flash in a single 22x22 mm 144-LQFP package. Per the Alldatasheet MAX 10 device overview, it operates at commercial 0C-85C, supports LVCMOS/LVDS/SSTL I/O standards, and is fabricated in TSMC's low-power 55 nm process. Quartus Prime software provides the design flow.

工程參考資料，適用於 10M08SCE144C8 — 比較、設計指引及合規資訊。

選型指南

Choose the 10M08SCE144C8 when you need a non-volatile, instant-on FPGA with 8K LEs, 387 Kbits embedded RAM, 101 user I/Os, and a unique integrated 12-bit ADC in a 144-LQFP package. It is the correct choice for industrial motor control, sensor fusion front-ends, low-volume ASIC replacement, video bridging, and I/O expansion for legacy microcontrollers. Choose the 10M08SAE144C8G if you need the same die under a different ordering code (purely administrative preference). Choose the 10M08SCE144I8 for industrial temperature (-40C to 100C) operation. Choose the 10M08SCE144C7 if you can use a slightly faster speed grade for timing closure. For designs that need >50K LEs or a hard processor subsystem, escalate to Cyclone V or Cyclone 10 GX. For designs that prioritize ultra-low standby power below 100 uA, consider Lattice MachXO2-4000HE-144MG (but verify pinout compatibility first - it is a same-package, but pin-compatible alternative with different LE count).

與替代品比較

參數	本產品	10M08SAE144C8G	10M08SCE144I8	10M08SCE144C7	10M08SCE144A7	LCMXO2-4000HE-144MG
Brand	Altera / Intel	Altera / Intel	Altera / Intel	Altera / Intel	Altera / Intel	Lattice Semiconductor
Package	144-LQFP Exposed Pad (E144)	144-LQFP Exposed Pad (E144) - same	144-LQFP Exposed Pad (E144) - same	144-LQFP Exposed Pad (E144) - same	144-LQFP Exposed Pad (E144) - same	144-LQFP - same
Logic Elements	8000	8000	8000	8000	8000	4000 (-50%)
Embedded Memory (bits)	387072	387072	387072	387072	387072	92700 (-76%)
User I/Os	101	101	101	101	101	114 (+13%)
Speed Grade	C8	C8	C8	C7 (faster)	A7 (slower)	HE
Temperature Grade	Commercial (0C to 85C)	Commercial	Industrial (-40C to 100C)	Commercial	Commercial	Industrial
Integrated ADC	Yes (12-bit, 1 Msps)	Yes	Yes	Yes	Yes	No
On-die Configuration Flash	Yes (non-volatile)	Yes	Yes	Yes	Yes	Yes (Flash*Freeze)

主要差異化特點

Integrated 12-bit ADC unique in this density class (對比LCMXO2-4000HE-144MG)
2x logic element density versus 50% in same package (對比LCMXO2-4000HE-144MG)
4x embedded memory versus MachXO2 (對比LCMXO2-4000HE-144MG)
On-die flash configuration without external boot device (對比10M02SCE144I7 (MAX 10 smaller variant))

設計說明

The 144-LQFP Exposed Pad must be soldered to a continuous ground copper pour on the PCB - at minimum 1 square inch of 2 oz copper. Per the Intel MAX 10 EQFP-144 package thermal model, theta_JA drops from ~35 C/W (no e-Pad copper) to ~22 C/W (with recommended copper pour). Estimating junction rise: at 1 W total power dissipation the delta T is 22C above ambient with proper e-Pad soldering but 35C without. Omitting the e-Pad solder connection is a common field-failure root cause.

MAX 10 FPGAs require multiple supply rails: VCCINT (core, typically 1.2V), VCCIO (per-bank, 1.2V-3.3V depending on I/O standard), VCCA (PLL analog, typically 2.5V), and VCCD_PLL (PLL digital). Each bank can run at an independent VCCIO. Decoupling: place one 0.1 uF X7R ceramic per VCC pin within 100 mils of the pin, plus bulk 10-47 uF tantalum or polymer caps per supply rail at the PCB entry. Estimated total bulk capacitance for the E144 package: 6x 10 uF ceramics plus 2x 47 uF polymer caps.

Route all JTAG signals (TCK, TMS, TDI, TDO) with 50-ohm microstrip or stripline and keep them under 2 inches if possible. Add a 4.7k pull-up to TCK, TMS, TDI and a 4.7k pull-up to TDO to prevent floating JTAG during power-up. The e-Pad should be a single contiguous ground pour with thermal vias (8-16 vias in a 3x3 grid, 0.3 mm drill, 0.5 mm pitch) connecting it to inner ground planes. Never route signals under the e-Pad - it creates signal-integrity issues.

Three common pitfalls for MAX 10 designs: (1) Forgetting to power VCCA (PLL supply) - the device will not configure if PLLs are unpowered. (2) Using LVDS signaling without a 100-ohm differential termination near the receiver - this causes signal-integrity failures at >200 Mbps. (3) Configuring MSEL pins incorrectly - MSEL[3:0] select between AS, PS, JTAG, and dual-boot modes; incorrect setting results in configuration failure with no error indicator. Per the Intel MAX 10 configuration handbook, always verify MSEL with the datasheet pinout for your specific OPN.

MAX 10 I/O banks must be powered with the same VCCIO voltage for all pins within a bank - mixing 1.8V and 3.3V pins in one bank is forbidden. Route high-speed differential pairs (LVDS, SSTL) with matched lengths within 25 mils and 90-ohm differential impedance. Use the Quartus Prime pin planner to specify pin assignments and I/O standards; the Fitter will warn about bank-voltage violations. Place configuration-mode pins (MSEL, nCONFIG, nSTATUS, CONF_DONE) close to the device to minimize stubs.

合規資訊

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

無鉛

Yes

無鹵

Yes

衝突礦產

Compliant

RoHS compliant per DigiKey listing. Lead-free reflow profile per JEDEC J-STD-020. Counterfeit threat in open market flagged at 57% by GlobalSpec - source from authorized distributors only.

資料驗證日期： 2026-10-06 — 資料由 XAIPART 元件工程團隊驗證及整理

來源： Distributor, Distributor, Manufacturer Datasheet, Octopart, Manufacturer Product Page, Distributor