DSPIC33CH128MP506-I/PT - Dual-Core 100MHz DSC, 128KB Flash, TQFP-64 | Microchip
MPN: DSPIC33CH128MP506-I/PT ✓ نشطDSPIC33CH128MP506-I/PT نظرة عامة
A Digital Signal Controller (DSC) is a hybrid MCU/DSP that combines the deterministic interrupt response of a microcontroller with the single-cycle MAC engine and DSP-oriented instruction set of a digital signal processor. Within the broader semiconductor taxonomy, a DSC sits between a microcontroller (MCU) and a digital signal processor (DSP), and belongs to the larger family of embedded controllers -> microcontrollers -> DSCs. The dsPIC33CH family targets digital power conversion, where dual-core partitioning allows closed-loop control loops to run on the slave core without jitter from main-application interrupts. This architecture maps to the system-level hierarchy of power management -> digital power -> DSC controller.
Key features include a 100 MHz master core and 100 MHz slave core with separate program/data buses, 128 KB Flash with error correction, 16 KB SRAM, four 12-bit ADC modules at up to 3.5 Msps each, four high-resolution PWM generators (250 ps resolution), CAN FD, I2C, SPI, UART, SENT, and configurable logic cells. The TQFP-64 package provides ample I/O for motor-drive and multi-rail digital power topologies while remaining hand-solderable for prototypes.
The dual-core architecture isolates time-critical control firmware from main application code, eliminating interrupt latency jitter in digital power loops. The high-resolution 250 ps PWM enables high-frequency switch-mode power supply designs beyond 1 MHz while maintaining fine duty-cycle granularity. On-chip configurable logic cells and op-amps reduce bill-of-materials cost in motor-control and power-conversion designs.
Typical applications include server power supplies and telecom DC-DC converters, wireless charging transmitters, drones and BLDC motor controllers, automotive sensor signal conditioning, LED lighting drivers with digital dimming, and digital solar micro-inverters. These workloads benefit from parallel DSP execution and tight closed-loop control. When integrating this part, allocate the slave core for high-frequency control loops and the master for user-interface, communications, and supervisory tasks, and follow the master/slave inter-core mailbox protocol documented in the device family reference manual.
بدائل مباشرة لـ DSPIC33CH128MP506-I/PT — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع DSPIC33CH128MP506-I/PT (نفس عامل الشكل والبصمة) — يختلف في Package, Core Architecture, Operating Temperature, High-Resolution PWM, Program Memory (Flash).
DSPIC33CH128MP506-H/PT
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
DSPIC33CH128MP506-I/M4
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
DSPIC33CH128MP206-I/PT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←DSPIC33CH128MP208T-I/PT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←DSPIC33CH128MP506-I/PT الحدود القصوى والخصائص الكهربائية
| Core Architecture | Dual-core dsPIC33C DSC (master + slave) |
| Core Frequency (Master) | 100 MHz |
| Core Frequency (Slave) | 100 MHz |
| Program Memory (Flash) | 128 KB |
| Data Memory (RAM) | 16 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| ADC | 4x 12-bit, up to 3.5 Msps |
| High-Resolution PWM | 4 generators, 250 ps resolution |
| CAN | CAN FD |
| العلبة | TQFP-64 (10x10 mm) |
| درجة حرارة التشغيل | -40 C to +85 C (industrial grade -I) |
| نوع التركيب | Surface Mount |
| مستوى MSL | 3 (168 hours) |
| حالة RoHS | Compliant |
| Total GPIO (approx.) | 53 (per TQFP-64) |
تكوين أطراف DSPIC33CH128MP506-I/PT
| دبوس 1 | RP55/ASDA1/SCK1 — Remappable I/O / SPI clock (alt function) |
| دبوس 2 | RP54/ASDA2/SDO2 — Remappable I/O / SPI data out (alt) |
| دبوس 3 | RP53/ASCL1/SDA1 — Remappable I/O / I2C data (alt) |
| دبوس 4 | RP49/TDI — JTAG TDI / remappable I/O |
| دبوس 5 | RP48/TCK — JTAG TCK / remappable I/O |
| دبوس 6 | RP47/TDO — JTAG TDO / remappable I/O |
| دبوس 7 | RP52/TMS — JTAG TMS / remappable I/O |
| دبوس 8 | OSCI — Crystal oscillator input |
| دبوس 9 | OSCO — Crystal oscillator output |
| دبوس 10 | VDD — Digital supply 3.0-3.6 V |
| دبوس 11 | VSS — Digital ground |
| دبوس 12 | PGEC1 — ICSP clock (pair 1) |
| دبوس 13 | PGED1 — ICSP data (pair 1) |
| دبوس 14 | MCLR — Master clear / reset (active low) |
| دبوس 15 | RP46/PWM4H — Remappable I/O / PWM4 high output |
| دبوس 16 | RP45/PWM4L — Remappable I/O / PWM4 low output |
| دبوس 17 | RP44/PWM3H — Remappable I/O / PWM3 high output |
| دبوس 18 | RP43/PWM3L — Remappable I/O / PWM3 low output |
| دبوس 19 | RP42/PWM2H — Remappable I/O / PWM2 high output |
| دبوس 20 | RP41/PWM2L — Remappable I/O / PWM2 low output |
| دبوس 21 | RP40/PWM1H — Remappable I/O / PWM1 high output |
| دبوس 22 | RP39/PWM1L — Remappable I/O / PWM1 low output |
| دبوس 23 | VDD — Digital supply 3.0-3.6 V |
| دبوس 24 | VSS — Digital ground |
| دبوس 25 | AN13/RP34/C1IN2 — Analog input 13 / remappable I/O / comparator input |
| دبوس 26 | AN14/RP35/C1IN3 — Analog input 14 / remappable I/O / comparator input |
| دبوس 27 | AN15/RP36/C1IN4 — Analog input 15 / remappable I/O / comparator input |
| دبوس 28 | AVSS — Analog ground |
| دبوس 29 | AVDD — Analog supply 3.0-3.6 V |
| دبوس 30 | AN0/C1IN1 — Analog input 0 / comparator input 1 |
| دبوس 31 | AN1 — Analog input 1 |
| دبوس 32 | AN2 — Analog input 2 |
| دبوس 33 | AN3 — Analog input 3 |
| دبوس 34 | AN4 — Analog input 4 |
| دبوس 35 | AN5 — Analog input 5 |
| دبوس 36 | AN6 — Analog input 6 |
| دبوس 37 | AN7 — Analog input 7 |
| دبوس 38 | VREF+ — ADC voltage reference high |
| دبوس 39 | VREF- — ADC voltage reference low |
| دبوس 40 | AVDD — Analog supply 3.0-3.6 V |
| دبوس 41 | AVSS — Analog ground |
| دبوس 42 | C1IN1+/C2IN1+ — Comparator 1/2 non-inverting input |
| دبوس 43 | C1IN1-/C2IN1- — Comparator 1/2 inverting input |
| دبوس 44 | C1OUT/C2OUT — Comparator 1/2 output |
| دبوس 45 | RP32/PWM5H — Remappable I/O / PWM5 high output |
| دبوس 46 | RP33/PWM5L — Remappable I/O / PWM5 low output |
| دبوس 47 | RP38/C1TX — Remappable I/O / CAN FD transmit |
| دبوس 48 | RP37/C1RX — Remappable I/O / CAN FD receive |
| دبوس 49 | RP56/ASCL2/SCL2 — Remappable I/O / I2C clock (alt) |
| دبوس 50 | RP57/ASDA2/SDA2 — Remappable I/O / I2C data (alt) |
| دبوس 51 | RP58/SDI1 — Remappable I/O / SPI data in |
| دبوس 52 | RP59/SDO1 — Remappable I/O / SPI data out |
| دبوس 53 | RP60/SCK1 — Remappable I/O / SPI clock |
| دبوس 54 | RP61/U1RX — Remappable I/O / UART1 RX |
| دبوس 55 | RP62/U1TX — Remappable I/O / UART1 TX |
| دبوس 56 | RP63/U2RX — Remappable I/O / UART2 RX |
| دبوس 57 | RP64/U2TX — Remappable I/O / UART2 TX |
| دبوس 58 | PGEC2 — ICSP clock (pair 2) |
| دبوس 59 | PGED2 — ICSP data (pair 2) |
| دبوس 60 | PGEC3 — ICSP clock (pair 3) |
| دبوس 61 | PGED3 — ICSP data (pair 3) |
| دبوس 62 | VDD — Digital supply 3.0-3.6 V |
| دبوس 63 | VSS — Digital ground |
| دبوس 64 | VDD — Digital supply 3.0-3.6 V |
التطبيقات النموذجية
DSPIC33CH128MP506-I/PT مناسب لـ 6 التطبيقs: Server & Telecom Digital Power Supplies, Wireless Charging Transmitters, BLDC / PMSM Motor Control (Drones, Robotics, E-Bike), Automotive Sensor Signal Conditioning, Digital LED Lighting Drivers, Solar Micro-Inverters & Optimizers.
Server & Telecom Digital Power Supplies
The DSPIC33CH128MP506-I/PT is purpose-built for high-density server and telecom DC-DC converters operating above 500 kHz switching frequency. Its 250 ps high-resolution PWM enables duty-cycle granularity below 0.1 percent at 1 MHz, allowing tight regulation on multi-phase VRM topologies. The slave core runs the closed-loop current/voltage PID loops while the master core manages PMBus telemetry, fault logging, and housekeeping, eliminating interrupt jitter on the control path. Compared with a single-core MCU, the dual-core architecture cuts digital-loop latency by roughly 30 percent.
موصى به
Wireless Charging Transmitters
Qi-compliant and proprietary resonant wireless power transmitters use the DSPIC33CH128MP506-I/PT for foreign-object detection, coil current zero-crossing detection, and real-time closed-loop power tuning. The slave core samples the resonant tank current at 3.5 Msps via the four on-chip 12-bit ADCs and adjusts PWM phase on a cycle-by-cycle basis, while the master handles Qi protocol state machine, authentication, and BLE/Wi-Fi host communication.
موصى به
BLDC / PMSM Motor Control (Drones, Robotics, E-Bike)
Field-oriented control (FOC) of brushless DC and PMSM motors benefits from the dual-core partitioning of the DSPIC33CH128MP506-I/PT. The slave core executes the 10 kHz current-control loop (Clarke/Park transform, inverse Park, SVPWM) deterministically, while the master core handles the slower 1 kHz torque/speed loop, sensor fusion, and CAN FD communication to the flight controller or BMS. The 250 ps PWM supports field-weakening and high-speed operation above 100 krpm.
موصى به
Automotive Sensor Signal Conditioning
The DSPIC33CH128MP506-I/PT can serve as an automotive sensor ECU for battery management or chassis sensing, processing analog inputs from current shunts, thermistors, and accelerometers. CAN FD connectivity allows it to integrate into modern zonal vehicle networks, while the dual-core setup enables deterministic sensor sampling decoupled from host ECU communication. Note that -I grade is industrial (-40 to +85 C); automotive deployments typically require the -E or -H grade variant of this part family.
موصى به
Digital LED Lighting Drivers
High-end architectural and horticulture LED drivers use the DSPIC33CH128MP506-I/PT for multi-channel constant-current control with sub-1 percent dimming accuracy. The four 12-bit ADCs monitor each channel's LED current, while the high-resolution PWM at 250 ps provides flicker-free dimming down to 0.1 percent duty cycle. The slave core handles the per-channel regulation while the master runs DALI-2, DMX512 or BLE Mesh communication.
موصى به
Solar Micro-Inverters & Optimizers
Module-level solar micro-inverters and DC power optimizers use the DSPIC33CH128MP506-I/PT to implement MPPT algorithms, islanding detection, and grid-tie synchronization. The slave core tracks the panel's maximum power point every 100 ms via incremental-conductance MPPT, while the master handles grid-tie PLL, anti-islanding detection, and powerline or wireless telemetry. High-resolution PWM drives the interleaved boost + full-bridge inverter stages.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ DSPIC33CH128MP506-I/PT — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | DSPIC33CH128MP506-H/PT | DSPIC33CH128MP206-I/PT | DSPIC33CH128MP208T-I/PT |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-64 (10x10 mm) | TQFP-64 (10x10 mm) - same | TQFP-64 (10x10 mm) - same | TQFP-64 (10x10 mm) - same |
| Core Architecture | Dual-core dsPIC33C | Dual-core dsPIC33C | Dual-core dsPIC33C | Dual-core dsPIC33C |
| Core Frequency | 100 MHz master + 100 MHz slave | 100 MHz master + 100 MHz slave | 100 MHz master + 100 MHz slave | 100 MHz master + 100 MHz slave |
| Flash Memory | 128 KB | 128 KB | 64 KB (-50%) | 128 KB |
| RAM | 16 KB | 16 KB | 8 KB (-50%) | 16 KB |
| High-Resolution PWM | 250 ps, 4 generators | 250 ps, 4 generators | 250 ps, 4 generators | 250 ps, 8 generators |
| CAN FD | Yes | Yes | Yes | Yes |
| Operating Temperature | -40 C to +85 C (-I grade) | -40 C to +150 C (-H grade) | -40 C to +85 C | -40 C to +85 C |
| Approx. Unit Price (qty-1, as of 2026-09-22) | $9.85 | ~$11.50 | ~$7.20 | ~$10.50 |
أبرز الفروقات
- Dual-core partitioning eliminates jitter on closed-loop control tasks (مقابلSingle-core dsPIC33EP256MC506)
- High-resolution 250 ps PWM duty-cycle resolution (مقابلStandard 8.32 ns PWM on dsPIC33EP family)
- Up to 4x 12-bit ADCs at 3.5 Msps each (مقابل1x ADC on dsPIC33EP256MC506)
ملاحظات التصميم
Estimated: The DSPIC33CH128MP506-I/PT operates from 3.0 V to 3.6 V. Decouple each VDD pin with a 100 nF X7R ceramic placed within 3 mm of the pin, plus a bulk 4.7 uF or 10 uF ceramic. Place AVDD/VREF+ decoupling (100 nF + 10 uF) as close to the analog supply pins as possible to keep ADC noise below 1 LSB at 3.5 Msps.
Estimated: At a typical digital-power duty cycle of 50 percent and 100 MHz dual-core operation, internal dissipation is roughly 200-300 mW. TQFP-64 theta_JA is approximately 50 C/W on a 4-layer JEDEC PCB, so the junction temperature rise is roughly 10-15 C above ambient, which is acceptable without an explicit heatsink. For sealed outdoor enclosures, derate current and clock speed if ambient exceeds 70 C.
Route PWM outputs and analog inputs on separate layers and guard them with ground pour. Keep PWM traces short and away from the crystal oscillator to avoid coupled noise. Place the decoupling capacitors on the same side as the IC and keep via stubs below 0.5 mm to maintain low-impedance return paths at the PWM switching frequency.
Do not assume the two cores share a single program image: each dsPIC33CH core has its own Flash partition and must be programmed separately. Misconfiguring the slave-core boot vector will prevent the master core from launching the slave. Always consult the device family reference manual for the mailbox and SLAVE_FICD register setup before commissioning inter-core firmware.
معلومات الامتثال
RoHS compliant per Microchip product page. -I grade is industrial (-40 to +85 C), not AEC-Q100 qualified; for automotive deployments consider the -E or -H grade variants of the same die. BitLocker may be branded in some regions.
