EP1K10TC100-2 - 10K-Gate ACEX-1K FPGA, 576 LEs, TQFP-100 | Intel
MPN: EP1K10TC100-2 ✗ انتهى عمره الإنتاجيEP1K10TC100-2 نظرة عامة
An FPGA (Field Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (LBs), programmable interconnect, and I/O cells that can be re-wired by the user to implement arbitrary digital circuits. Within the wider taxonomy, FPGAs sit above CPLDs and below ASICs in terms of integration density, and they belong to the broader category of programmable logic devices (PLDs). ACEX-1K parts are positioned at the low-density, low-cost end of the FPGA spectrum, intended for glue logic, bus bridging, and small state-machine applications where an ASIC is uneconomical.
Key features include a 0.5 ns pin-to-pin logic delay, dual-port embedded memory, dedicated carry chains for fast arithmetic, JTAG-compliant IEEE 1149.1 boundary-scan, in-system programmability via the serial configuration interface, and support for multiple I/O standards including LVTTL, LVCMOS, and PCI. The device is rated for commercial 0 °C to 70 °C ambient operation and runs from a 2.375 V to 2.625 V core supply.
The EP1K10TC100-2 uses a SRAM-based look-up-table (LUT) architecture with continuous, row-and-column interconnect. Configuration data is loaded from an external serial PROM or via JTAG; the design is volatile and must be re-loaded on every power-up, which differentiates ACEX-1K from one-time-programmable (OTP) anti-fuse families.
Typical applications include industrial control glue logic, communications protocol bridging, low-volume custom peripherals, and legacy retrofit boards where a discontinued discrete-logic design must be consolidated into a single programmable device. The wide 2.5 V tolerance band simplifies multi-voltage design.
When designing with this part, note that the ACEX-1K family has been EOL'd by Altera/Intel; design engineers should verify long-term availability or migrate to a Cyclone equivalent for new designs. Always include a configuration PROM and follow the recommended decoupling scheme (0.1 μF + bulk) on every VCCINT and VCCIO pin pair.
This page consolidates distributor pricing, same-brand drop-in alternatives from the ACEX-1K family, and practical design notes not present in the original datasheet PDF.
بدائل مباشرة لـ EP1K10TC100-2 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP1K10TC100-2 (نفس عامل الشكل والبصمة) — يختلف في Process Technology, Package, Speed Grade, Family, Configuration Method.
EP1K10TC100-1
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1K10TC100-2N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1K10TC100-1N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1K10TC100-2 الحدود القصوى والخصائص الكهربائية
| Family | ACEX-1K |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements / Cells | 576 |
| Number of Logic Array Blocks (LABs/CLBs) | 72 |
| Total RAM Bits | 12288 |
| Number of Gates | 10000 (typical); 56000 (maximum) |
| Number of User I/O | 66 |
| Pin-to-Pin Logic Delay | 0.5 ns |
| Maximum Internal Frequency | 200 MHz (per FPGAkey listing) |
| Process Technology | 0.22 μm CMOS |
| Core Supply Voltage (VCCINT) | 2.375 V to 2.625 V (2.5 V nominal) |
| درجة حرارة التشغيل | 0 °C to 70 °C (TA, commercial) |
| العلبة | 100-pin TQFP (TQFP-100) |
| نوع التركيب | Surface Mount |
| Configuration Method | SRAM, serial / JTAG (IEEE 1149.1) |
| حالة RoHS | Compliant (per Heisener / DigiKey listings) |
| Lead-Free | Yes |
تكوين أطراف EP1K10TC100-2
| دبوس 1 | I/O — User I/O (bank 1) |
| دبوس 2 | I/O — User I/O (bank 1) |
| دبوس 3 | I/O — User I/O (bank 1) |
| دبوس 4 | I/O — User I/O (bank 1) |
| دبوس 5 | I/O — User I/O (bank 1) |
| دبوس 6 | VCCIO1 — I/O bank 1 supply |
| دبوس 7 | I/O — User I/O (bank 1) |
| دبوس 8 | I/O — User I/O (bank 1) |
| دبوس 9 | I/O — User I/O (bank 1) |
| دبوس 10 | I/O — User I/O (bank 1) |
| دبوس 11 | GND — Ground |
| دبوس 12 | I/O — User I/O (bank 1) |
| دبوس 13 | I/O — User I/O (bank 1) |
| دبوس 14 | I/O — User I/O (bank 1) |
| دبوس 15 | VCCINT — Core supply 2.5 V |
| دبوس 16 | I/O — User I/O (bank 1) |
| دبوس 17 | I/O — User I/O (bank 1) |
| دبوس 18 | I/O — User I/O (bank 1) |
| دبوس 19 | I/O — User I/O (bank 1) |
| دبوس 20 | I/O — User I/O (bank 1) |
| دبوس 21 | I/O — User I/O (bank 1) |
| دبوس 22 | GND — Ground |
| دبوس 23 | I/O — User I/O (bank 2) |
| دبوس 24 | I/O — User I/O (bank 2) |
| دبوس 25 | I/O — User I/O (bank 2) |
| دبوس 26 | I/O — User I/O (bank 2) |
| دبوس 27 | VCCIO2 — I/O bank 2 supply |
| دبوس 28 | I/O — User I/O (bank 2) |
| دبوس 29 | I/O — User I/O (bank 2) |
| دبوس 30 | I/O — User I/O (bank 2) |
| دبوس 31 | I/O — User I/O (bank 2) |
| دبوس 32 | I/O — User I/O (bank 2) |
| دبوس 33 | I/O — User I/O (bank 2) |
| دبوس 34 | GND — Ground |
| دبوس 35 | I/O — User I/O (bank 2) |
| دبوس 36 | I/O — User I/O (bank 2) |
| دبوس 37 | VCCINT — Core supply 2.5 V |
| دبوس 38 | I/O — User I/O (bank 2) |
| دبوس 39 | I/O — User I/O (bank 2) |
| دبوس 40 | I/O — User I/O (bank 2) |
| دبوس 41 | I/O — User I/O (bank 2) |
| دبوس 42 | I/O — User I/O (bank 2) |
| دبوس 43 | I/O — User I/O (bank 2) |
| دبوس 44 | GND — Ground |
| دبوس 45 | MSEL0 — Configuration mode select 0 |
| دبوس 46 | MSEL1 — Configuration mode select 1 |
| دبوس 47 | nSTATUS — Configuration status (open drain) |
| دبوس 48 | DCLK — Configuration clock input |
| دبوس 49 | CONF_DONE — Configuration done (open drain) |
| دبوس 50 | VCCINT — Core supply 2.5 V |
| دبوس 51 | nCONFIG — Configuration control (active low) |
| دبوس 52 | DATA0 — Configuration data input |
| دبوس 53 | I/O — User I/O (bank 3) |
| دبوس 54 | I/O — User I/O (bank 3) |
| دبوس 55 | I/O — User I/O (bank 3) |
| دبوس 56 | I/O — User I/O (bank 3) |
| دبوس 57 | GND — Ground |
| دبوس 58 | I/O — User I/O (bank 3) |
| دبوس 59 | I/O — User I/O (bank 3) |
| دبوس 60 | I/O — User I/O (bank 3) |
| دبوس 61 | VCCIO3 — I/O bank 3 supply |
| دبوس 62 | I/O — User I/O (bank 3) |
| دبوس 63 | I/O — User I/O (bank 3) |
| دبوس 64 | I/O — User I/O (bank 3) |
| دبوس 65 | I/O — User I/O (bank 3) |
| دبوس 66 | I/O — User I/O (bank 3) |
| دبوس 67 | I/O — User I/O (bank 3) |
| دبوس 68 | GND — Ground |
| دبوس 69 | I/O — User I/O (bank 3) |
| دبوس 70 | I/O — User I/O (bank 3) |
| دبوس 71 | I/O — User I/O (bank 3) |
| دبوس 72 | VCCINT — Core supply 2.5 V |
| دبوس 73 | I/O — User I/O (bank 3) |
| دبوس 74 | I/O — User I/O (bank 3) |
| دبوس 75 | I/O — User I/O (bank 3) |
| دبوس 76 | I/O — User I/O (bank 4) |
| دبوس 77 | I/O — User I/O (bank 4) |
| دبوس 78 | GND — Ground |
| دبوس 79 | I/O — User I/O (bank 4) |
| دبوس 80 | I/O — User I/O (bank 4) |
| دبوس 81 | I/O — User I/O (bank 4) |
| دبوس 82 | I/O — User I/O (bank 4) |
| دبوس 83 | VCCIO4 — I/O bank 4 supply |
| دبوس 84 | I/O — User I/O (bank 4) |
| دبوس 85 | I/O — User I/O (bank 4) |
| دبوس 86 | I/O — User I/O (bank 4) |
| دبوس 87 | I/O — User I/O (bank 4) |
| دبوس 88 | I/O — User I/O (bank 4) |
| دبوس 89 | I/O — User I/O (bank 4) |
| دبوس 90 | GND — Ground |
| دبوس 91 | I/O — User I/O (bank 4) |
| دبوس 92 | I/O — User I/O (bank 4) |
| دبوس 93 | I/O — User I/O (bank 4) |
| دبوس 94 | VCCINT — Core supply 2.5 V |
| دبوس 95 | TDI — JTAG test data input |
| دبوس 96 | TMS — JTAG test mode select |
| دبوس 97 | TCK — JTAG test clock |
| دبوس 98 | TDO — JTAG test data output |
| دبوس 99 | I/O — User I/O (bank 4) |
| دبوس 100 | GND — Ground |
التطبيقات النموذجية
EP1K10TC100-2 مناسب لـ 6 التطبيقs: Industrial Glue Logic Consolidation, Communications Protocol Bridging, Legacy Retrofit Board Replacement, Custom Peripheral Implementation, Test and Measurement Front-End Logic, Educational and Prototyping Platform.
Industrial Glue Logic Consolidation
The EP1K10TC100-2 is well-suited to industrial glue-logic consolidation where a board full of discrete 74-series TTL, bus transceivers, and small state machines must be merged into a single programmable device. Its 576 logic elements and 72 LABs comfortably absorb 5-15 standard-logic functions, while 66 user I/O are enough to replace dozens of discrete packages. The 0.5 ns pin-to-pin delay and 200 MHz internal frequency support typical industrial bus rates (SPI, I2C, parallel async) with margin. Designers typically target this density for retrofit boards where redesign-for-ASIC is uneconomical. Use a 0.1 µF + bulk decoupling pair on every VCCINT and VCCIO bank, and pair the FPGA with an EPCS1 configuration PROM for standalone operation. Industrial temperature grade is not available; the commercial 0 °C to 70 °C window limits deployment to cabinet-resident equipment.
موصى به
Communications Protocol Bridging
The EP1K10TC100-2 fits protocol-bridging applications such as UART-to-SPI, SPI-to-I2C, or parallel-to-serial conversion in embedded telecom and industrial-control equipment. Its 12,288 bits of dual-port embedded RAM can hold small packet buffers or lookup tables without external memory, and the 66 user I/O expose multiple bus interfaces simultaneously. The 0.22 µm 2.5 V fabric delivers 200 MHz internal operation, sufficient for 10-50 Mbps bridging duties. LVTTL and LVCMOS I/O standards cover most 3.3 V and 5 V mixed-voltage bridges via external level shifters. JTAG-based in-system programming allows field firmware updates without removing the device. Note that the SRAM-based configuration requires a configuration PROM or host MCU boot loader; design accordingly to avoid bricking in the field.
موصى به
Legacy Retrofit Board Replacement
Designers use the EP1K10TC100-2 to retrofit end-of-life control boards that previously relied on multiple discrete 74HC/74LS packages or on now-obsolete small PLDs. The same TQFP-100 footprint lets the new design drop into the existing PCB land pattern, and Quartus II synthesis ports legacy schematic-based designs into HDL quickly. 576 LEs comfortably absorb the typical 100-300 logic gates of legacy designs, while 66 user I/O match legacy connector pinouts. Because the part is obsolete and available only from stock, it is best reserved for genuine form-fit-function retrofits rather than new designs. Always derate by operating margin and consider Cyclone II EP2C5T100C7N as the long-term migration target.
موصى به
Custom Peripheral Implementation
The EP1K10TC100-2 enables low-volume custom peripherals such as motor-control timers, sensor pre-processors, and proprietary bus interfaces without committing to an ASIC NRE. Designers implement custom register sets, PWM generators, or quadrature decoders in HDL and benefit from the 0.5 ns pin-to-pin delay for deterministic real-time response. The 12,288-bit dual-port RAM supports small FIFOs for data buffering between the FPGA and a host MCU. Quartus II provides a free development flow with schematic and HDL entry, plus the SignalTap logic analyzer for in-system debug. For new designs, note the limited operating temperature window (commercial only) and plan for Cyclone II migration if the design graduates to volume production.
موصى به
Test and Measurement Front-End Logic
The EP1K10TC100-2 serves well as front-end glue logic in test and measurement fixtures: pattern generation, signal routing matrices, timing-and-control sequencers, and protocol-aware stimulus engines all fit within 576 LEs. The 66 user I/O provide ample fan-out for multi-channel test heads, and the dual-port embedded RAM allows small capture buffers without external memory. Fast pin-to-pin delay (0.5 ns) supports deterministic timing in stimulus generation. JTAG boundary-scan (IEEE 1149.1) simplifies board-level interconnect testing during fixture bring-up. Designers should pair the FPGA with an EPCS configuration PROM so fixtures boot autonomously without a host downloader.
موصى به
Educational and Prototyping Platform
The EP1K10TC100-2 is an accessible low-density FPGA for university digital-logic laboratories and hobby prototyping where students learn HDL design, finite state machines, and bus protocols. The free Altera Quartus II Web Edition supports the part, and the TQFP-100 package is breadboard-friendly via breakout boards. 576 LEs are enough to teach multi-project labs (CPU cores, UARTs, simple graphics) without overwhelming beginners. The 2.5 V core simplifies lab power supplies. Because the part is obsolete, educational users should weigh whether to use a Cyclone II or MAX II dev board instead to gain long-term tool support, but existing lab stock of ACEX-1K boards remains functional for HDL pedagogy.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP1K10TC100-2 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP1K10TC100-1 | EP1K10TC100-2N | EP1K10TC100-1N |
|---|---|---|---|---|
| Package | TQFP-100 | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same |
| Brand | Intel | Intel | Intel | Intel |
| Speed Grade | -2 (0.5 ns) | -1 (~0.6 ns) | -2 (0.5 ns) | -1 (~0.6 ns) |
| Logic Elements | 576 | 576 | 576 | 576 |
| Embedded RAM Bits | 12288 | 12288 | 12288 | 12288 |
| User I/O | 66 | 66 | 66 | 66 |
| Lead-Free / RoHS | Yes | Yes | Yes (N suffix explicit) | Yes (N suffix explicit) |
أبرز الفروقات
- Fastest speed grade in the TQFP-100 ACEX-1K family (مقابلEP1K10TC100-1)
- Original non-N suffix preserves dual footprint compatibility (مقابلEP1K10TC100-2N)
- TQFP-100 form factor suits legacy PCB retrofit designs (مقابلEP1K10QC208-2)
ملاحظات التصميم
Estimated: the EP1K10TC100-2 draws core current in the 50-200 mA range at 2.5 V depending on utilization and toggle rate. Provide a 2.5 V regulator with at least 500 mA headroom and a 0.1 µF ceramic + 10 µF bulk decoupling pair on every VCCINT and VCCIO bank pin. Power-on ramp should be monotonic within the datasheet specification to avoid configuration failure.
Because the EP1K10TC100-2 is SRAM-based, the FPGA is non-functional until a configuration bitstream is loaded. Always include an EPCS1 (or larger EPCS4) serial configuration PROM on the board, or a host MCU capable of serial slave configuration via DCLK and DATA0. Forgetting the configuration source is the single most common reason ACEX-1K boards appear dead on first power-up.
Place 0.1 µF decoupling capacitors within 5 mm of every VCCINT and VCCIO pin pair. Use a solid ground plane on layer 2 and route all high-speed clock and JTAG signals with controlled impedance. The TQFP-100 thermal pad is not present on this package; thermal performance relies on copper pour area and ambient airflow, not on a bottom thermal pad.
Keep JTAG signals (TCK, TMS, TDI, TDO) short and isolated from switching I/O. Pull nCONFIG high through a 1 kΩ resistor to VCCINT and pull nSTATUS and CONF_DONE high through 1 kΩ resistors to VCCINT, since these are open-drain signals. Route the MSEL pins to known logic levels (GND/VCCIO) per the desired configuration mode; do not leave them floating.
معلومات الامتثال
RoHS compliant per distributor listings (DigiKey, Heisener). The -N suffix variants explicitly carry the lead-free finish; standard -2 finish is also lead-free per current distributor stock. REACH, halogen-free, and conflict-minerals status not stated in the verified web data and marked unknown.
