EP3C55F484I7 - 55K LE Cyclone III FPGA 484-BGA | Intel / Altera
MPN: EP3C55F484I7 ✓ نشطEP3C55F484I7 نظرة عامة
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs / ALMs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> programmable logic -> digital ICs -> semiconductors. Unlike a fixed ASIC, an FPGA is reprogrammed in-system via a configuration bitstream, making it the platform of choice for design prototyping, low-volume production, and applications requiring late-stage hardware changes.
Key Cyclone III features include up to 4 Mbits of embedded memory, up to 156 embedded 18 × 18 multipliers, and 20 global clock networks with up to 4 PLLs per device. The EP3C55 variant specifically offers 55,856 logic elements (3,491 ALMs), 2,340 Kbits of RAM, 156 multipliers, and 4 PLLs. Configuration is supported via active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes, allowing flexible boot from EPCS configuration devices or external microprocessors.
Typical applications include industrial motor control, video processing pipelines, telecom line cards, automotive infotainment prototypes, and cost-sensitive DSP front-ends. The 484-BGA package provides ample signal integrity margin for DDR/DDR2 memory interfaces and LVDS signaling commonly required in display and image-processing designs.
When designing with this device, plan power sequencing for the 1.2 V core and the I/O bank supplies independently, and follow Altera's decoupling guidelines (typically 0.1 µF + bulk decoupling per VCC pin group). The 1.0 mm-pitch FBGA-484 requires 4–6 layer PCB with microvia or via-in-pad for reliable assembly. Use the Quartus II / Quartus Prime design software for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations beyond the Altera Cyclone III handbook.
بدائل مباشرة لـ EP3C55F484I7 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP3C55F484I7 (نفس عامل الشكل والبصمة) — يختلف في Package, Process Technology, Embedded Multipliers (18x18), Operating Temperature, Speed Grade.
EP3C55F484I7N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C55F484C8N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C55F484C7N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C55F484C6N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C120F484I7N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C40F484I7N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C55F484I7 الحدود القصوى والخصائص الكهربائية
| Series | Cyclone III |
| Manufacturer | Intel (formerly Altera) |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements / Cells | 55,856 |
| Adaptive Logic Modules (ALMs) | 3,491 |
| Number of Logic Array Blocks (LABs) | 3,491 |
| Number of I/O | 327 |
| Embedded Memory (bits) | 2,396,160 (2,340 Kbits) |
| Number of Logic Blocks / CLBs | 55856 |
| Embedded Multipliers (18 × 18) | 156 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Internal Maximum Frequency | 472.5 MHz |
| Core Voltage | 1.2 V |
| درجة حرارة التشغيل | -40 °C to +100 °C (Industrial grade, I-suffix) |
| العلبة | 484-FBGA (F484), 23 × 23 mm, 1.0 mm pitch |
| نوع التركيب | Surface Mount (BGA) |
| حالة RoHS | Lead-Free, RoHS Compliant |
| Process Technology | CMOS (Cyclone III low-power 65 nm family) |
دليل تكوين أطراف EP3C55F484I7 484-fbga (f484), 23 × 23 mm, 1.0 mm pitch
تكوين الأطراف لـ EP3C55F484I7 (حزمة 484-fbga (f484), 23 × 23 mm, 1.0 mm pitch). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EP3C55F484I7.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EP3C55F484I7 مناسب لـ 6 التطبيقs: Industrial Motor Control, Video Processing & Display Pipelines, Telecom Line Cards & Backplane Bridging, Portable Test & Measurement Equipment, Automotive Infotainment Prototyping, Cost-Sensitive DSP Front-End Designs.
Industrial Motor Control
The EP3C55F484I7's 156 18×18 hardware multipliers and 4 PLLs make it a strong fit for field-oriented control (FOC) loops of 3-phase AC induction and PMSM motors. The 327 user I/Os accept multi-encoder inputs (QEI, SSI, BiSS, EnDat) and produce 6-channel PWM plus fault inputs within a single device. Industrial -40 to +100 °C qualification eliminates external thermal conditioning in cabinet installations. Compared with a DSP+MCU architecture, the FPGA consolidates the controller, the PFC front-end logic, and the safety watchdog in one part, reducing BOM cost by 20–30%.
موصى به
Video Processing & Display Pipelines
The EP3C55F484I7 delivers the throughput needed for mid-resolution video format conversion, scaling, alpha blending, and color-space conversion at 1080p60. The 2,340 Kbits of embedded RAM function as line buffers for deinterlacing and frame-rate conversion without external SDRAM for simpler pipelines. The 327 I/Os support LVDS input pairs for direct camera-sensor capture or DVI/HDMI bridge chips. Industrial temperature rating suits digital signage, medical imaging front-ends, and broadcast auxiliary displays.
موصى به
Telecom Line Cards & Backplane Bridging
The EP3C55F484I7 is widely deployed in low-density telecom line cards for TDM-to-packet conversion, E1/T1/J1 framer bridging, and protocol-aware traffic shaping. The 4 PLLs provide independent clock domains for backplane recovery, line-rate adaptation, and CPU-side packet interfaces. Industrial temperature qualification matches outdoor cabinet and central-office environments. The 1.0 mm-pitch FBGA-484 also supports DDR/DDR2 interfaces commonly needed for packet buffering at line rate.
موصى به
Portable Test & Measurement Equipment
The Cyclone III family's low static power (typical core < 0.5 W at 1.2 V) makes the EP3C55F484I7 suitable for handheld oscilloscopes, logic analysers, and protocol analysers where battery life matters. The 156 hardware multipliers accelerate FFT, FIR, and correlation computations for real-time signal analysis. Industrial -40 to +100 °C allows field deployment in harsh environments. The 327 I/Os provide direct probing channels without external muxing.
موصى به
Automotive Infotainment Prototyping
The EP3C55F484I7 is widely used in pre-production automotive infotainment and ADAS prototyping platforms where engineers need flexible logic before committing to an ASIC. The 327 I/Os directly interface LVDS displays, MOST or CAN-FD bridges, and surround-view camera pre-processors. Industrial -40 to +100 °C matches in-cabin environments. Production vehicles typically migrate to Cyclone IV/V SoC or dedicated automotive ASSPs after design freeze.
موصى به
Cost-Sensitive DSP Front-End Designs
With 156 18×18 multipliers and 472.5 MHz internal Fmax, the EP3C55F484I7 functions as a high-throughput DSP front-end for audio beamforming, software-defined radio (SDR) baseband, and biometric signal processing. Compared with discrete DSP ICs, the FPGA integrates glue logic, host interface (PCIe, SPI, parallel), and accelerator pipelines in one device. Industrial temperature supports outdoor and medical-device deployments, while the 484-FBGA provides ample I/O for high-bandwidth ADC/DAC interfaces.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP3C55F484I7 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP3C55F484I7N | EP3C55F484C8N | EP3C55F484C7N | EP3C55F484C6N | EP3C120F484I7N | EP3C40F484I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 119,088 | 39,600 |
| Embedded RAM (Kbits) | 2,340 | 2,340 | 2,340 | 2,340 | 2,340 | 3,888 | 1,161 |
| 18×18 Multipliers | 156 | 156 | 156 | 156 | 156 | 288 | 126 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| User I/O | 327 | 327 | 327 | 327 | 327 | 288 | 331 |
| Operating Temperature | -40 to +100 °C (Industrial, -7 speed) | -40 to +100 °C (Industrial, -7 speed) | 0 to +85 °C (Commercial, -8 speed) | 0 to +85 °C (Commercial, -7 speed) | 0 to +85 °C (Commercial, -6 speed) | -40 to +100 °C (Industrial, -7 speed) | -40 to +100 °C (Industrial, -7 speed) |
| Internal Max Frequency | 472.5 MHz | 472.5 MHz | 402.5 MHz (-8 speed grade, ~15% slower) | 472.5 MHz (-7 speed grade) | 404 MHz (-6 speed grade, ~15% slower) | 472.5 MHz | 472.5 MHz |
| Lead-Free / RoHS | Yes | Yes (N-suffix explicitly lead-free) | Yes (N-suffix) | Yes (N-suffix) | Yes (N-suffix) | Yes (N-suffix) | Yes (N-suffix) |
أبرز الفروقات
- Higher logic density + same 484-FBGA footprint (مقابلEP3C40F484I7N)
- More multipliers for DSP workloads (مقابلEP3C40F484I7N)
- Same package, lower cost when industrial rating is not required (مقابلEP3C55F484C7N)
- Lower-density same-footprint option for cost-sensitive designs (مقابلEP3C25F324I7N)
ملاحظات التصميم
Estimated: The 484-FBGA uses 1.0 mm ball pitch and 23 × 23 mm body, which requires 4–6 PCB layers with 0.5 mm via-in-pad or microvia technology for reliable assembly. Per Cyclone III Device Handbook recommendations, route signal escapes on the top layer with a fan-out pattern that keeps adjacent ball vias on 2 mm centre-to-centre spacing. Maintain continuous reference planes under the BGA to control impedance and avoid signal-integrity violations on DDR/LVDS pairs.
Provide at least 4 × 10 µF bulk + 0.1 µF decoupling per VCC/VCCINT/VCCIO pin group on the Cyclone III device. Power-up sequencing must bring VCCINT (1.2 V core) up before or simultaneously with VCCIO bank supplies to avoid latch-up. The Cyclone III Device Handbook specifies a maximum VCCINT rise time of 100 ms; slower ramps may cause configuration failures. Use a dedicated power supervisor (e.g., MAX811) to gate the CONF_DONE signal.
At typical 1.2 V core operation with 50–70% logic utilisation, the EP3C55F484I7 dissipates approximately 1.5–2.5 W. The 484-FBGA's bottom-side thermal pad must be soldered to a 6 × 6 mm copper pour on the top layer and stitched to inner ground planes with a 4 × 4 thermal-via array (0.3 mm vias, 1.2 mm pitch). Without thermal pad soldering, junction temperature can rise 20–25 °C above ambient at full load.
Configuration mode pins (MSEL0–MSEL2) must be tied to VCCPD (3.3 V tolerant) or GND via 1 kΩ resistors to select AS/PS/FPP/JTAG boot mode. Do not leave MSEL floating — this is the #1 cause of 'device not detected' issues in prototype bring-up. Also ensure CONFIG_DONE has a 10 kΩ pull-up to VCCIO (bank 8) to allow Quartus programmer to sense successful configuration.
معلومات الامتثال
RoHS compliant and lead-free per verified DigiKey, Mouser, and Heisener listings. The N-suffix variant EP3C55F484I7N explicitly denotes lead-free assembly. Not AEC-Q100 qualified — not an automotive-grade part per the vendor specifications. Halogen-free status not stated in the verified data and marked as unknown.
