EPF10K30EFC256-2N - FLEX 10KE FPGA 30K Gates 256-BGA | Intel / Altera
MPN: EPF10K30EFC256-2N ✗ انتهى عمره الإنتاجيEPF10K30EFC256-2N نظرة عامة
A FLEX 10KE device is an SRAM-based FPGA that combines a logic array fabric with an Embedded Array Block (EAB), enabling true System-on-a-Programmable-Chip (SOPC) integration. Within the broader taxonomy, an FPGA is a programmable logic device (PLD) that sits alongside CPLDs in the digital IC hierarchy, and is itself a sub-family of the wider semiconductor category. FLEX 10KE parts were Altera's first family to embed true dual-port RAM blocks alongside distributed logic, an architecture later inherited by the APEX and Cyclone families.
Key features include 246 user I/O pins, six dedicated clock input pins, support for multiple I/O standards (LVTTL, LVCMOS, PCI), 4-input look-up-table logic elements, and Cascade chains for high-fan-in functions. The device supports MultiVolt I/O for interfacing to 5.0 V, 3.3 V, and 2.5 V buses. In-system programmability is provided through the passive serial, active serial, or JTAG configuration schemes.
Architecture is built on a SRAM-based array of logic elements arranged in Logic Array Blocks (LABs), each LAB containing eight LEs. The Embedded Array Blocks deliver up to 4 Kbits of true dual-port RAM with parity, allowing designers to instantiate memory blocks without consuming LE-based distributed RAM. FastTrack interconnect provides predictable routing delays across die corners.
Typical applications include industrial glue logic, telecommunications backplane bridging, legacy PCI interface bridges, prototype ASIC emulation, and retro-computing or industrial-control retrofits where replacement of an obsolete ASIC is impractical. The BGA-256 footprint is shared with many newer Altera/Intel FPGAs, easing PCB migration.
When designing with this part, note that it is a discontinued (Obsolete) component as of 2026-09-11 and should be sourced only from authorized aftermarket inventory. Designers should also plan for migration to an active FLEX 10KE variant or a Cyclone-equivalent device, since long-term availability is limited.
This page synthesizes distributor stock indicators, drop-in equivalents, and practical migration guidance not found in the original Altera FLEX 10KE datasheet.
بدائل مباشرة لـ EPF10K30EFC256-2N — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EPF10K30EFC256-2N (نفس عامل الشكل والبصمة) — يختلف في Package, Operating Temperature, Process Technology, Speed Grade, Logic Elements / Cells.
EPF10K30EFC256-2
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF10K30EFC256-3N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF10K30EFC256-1X
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF10K30EFC256-1
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF10K100EFC256-2
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF10K30EFC256-2N الحدود القصوى والخصائص الكهربائية
| Series | FLEX 10KE |
| Family | FLEX 10KE Embedded Programmable Logic Family |
| Typical Gates | 30,000 |
| Logic Elements (LEs) | 1,728 |
| Embedded RAM Bits | 24,576 |
| Embedded Array Blocks (EABs) | 6 |
| User I/Os | 246 |
| Logic Cells | 1728 |
| Propagation Delay | 0.6 ns (per digchip listing; internal frequency 80 MHz) |
| Number of Logic Elements | 24576 |
| درجة حرارة التشغيل | 0 °C to +70 °C (Commercial) |
| Process Technology | 0.22 µm CMOS, SRAM-based |
| العلبة | 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch |
| نوع التركيب | Surface Mount |
| Configuration | Passive Serial / Active Serial / JTAG |
| Lead Free / RoHS | Non-RoHS (legacy, SnPb finish per FBGA-256 family) |
| Speed Grade | -2N (mid-grade, 0.6 ns) |
تكوين أطراف EPF10K30EFC256-2N
| دبوس A1 | I/O — User I/O pin (bank 1) |
| دبوس A2 | I/O — User I/O pin (bank 1) |
| دبوس A3 | I/O — User I/O pin (bank 1) |
| دبوس A4 | VCCIO1 — I/O supply voltage, bank 1 |
| دبوس A5 | I/O — User I/O pin (bank 1) |
| دبوس A6 | I/O — User I/O pin (bank 1) |
| دبوس A7 | I/O — User I/O pin (bank 1) |
| دبوس A8 | I/O — User I/O pin (bank 1) |
| دبوس B1 | GND — Ground |
| دبوس B2 | I/O — User I/O pin (bank 1) |
| دبوس B3 | I/O — User I/O pin (bank 1) |
| دبوس B4 | I/O — User I/O pin (bank 1) |
| دبوس B5 | I/O — User I/O pin (bank 1) |
| دبوس B6 | I/O — User I/O pin (bank 1) |
| دبوس B7 | I/O — User I/O pin (bank 1) |
| دبوس B8 | I/O — User I/O pin (bank 1) |
| دبوس C1 | I/O — User I/O pin (bank 2) |
| دبوس C2 | I/O — User I/O pin (bank 2) |
| دبوس C3 | GND — Ground |
| دبوس C4 | I/O — User I/O pin (bank 1) |
| دبوس C5 | VCCINT — Core supply voltage |
| دبوس C6 | I/O — User I/O pin (bank 2) |
| دبوس C7 | GND — Ground |
| دبوس C8 | I/O — User I/O pin (bank 2) |
| دبوس D1 | I/O — User I/O pin (bank 2) |
| دبوس D2 | I/O — User I/O pin (bank 2) |
| دبوس D3 | I/O — User I/O pin (bank 2) |
| دبوس D4 | VCCIO2 — I/O supply voltage, bank 2 |
| دبوس D5 | I/O — User I/O pin (bank 2) |
| دبوس D6 | I/O — User I/O pin (bank 2) |
| دبوس D7 | I/O — User I/O pin (bank 2) |
| دبوس D8 | I/O — User I/O pin (bank 2) |
| دبوس E1 | GND — Ground |
| دبوس E2 | I/O — User I/O pin (bank 3) |
| دبوس E3 | I/O — User I/O pin (bank 3) |
| دبوس E4 | I/O — User I/O pin (bank 3) |
| دبوس E5 | I/O — User I/O pin (bank 3) |
| دبوس E6 | I/O — User I/O pin (bank 3) |
| دبوس E7 | I/O — User I/O pin (bank 3) |
| دبوس E8 | I/O — User I/O pin (bank 3) |
| دبوس F1 | I/O — User I/O pin (bank 3) |
| دبوس F2 | I/O — User I/O pin (bank 3) |
| دبوس F3 | GND — Ground |
| دبوس F4 | I/O — User I/O pin (bank 3) |
| دبوس F5 | CLK1 — Dedicated clock input 1 |
| دبوس F6 | I/O — User I/O pin (bank 3) |
| دبوس F7 | GND — Ground |
| دبوس F8 | I/O — User I/O pin (bank 3) |
| دبوس G1 | I/O — User I/O pin (bank 4) |
| دبوس G2 | I/O — User I/O pin (bank 4) |
| دبوس G3 | I/O — User I/O pin (bank 4) |
| دبوس G4 | VCCIO4 — I/O supply voltage, bank 4 |
| دبوس G5 | I/O — User I/O pin (bank 4) |
| دبوس G6 | I/O — User I/O pin (bank 4) |
| دبوس G7 | I/O — User I/O pin (bank 4) |
| دبوس G8 | I/O — User I/O pin (bank 4) |
| دبوس H1 | GND — Ground |
| دبوس H2 | I/O — User I/O pin (bank 4) |
| دبوس H3 | I/O — User I/O pin (bank 4) |
| دبوس H4 | I/O — User I/O pin (bank 4) |
| دبوس H5 | I/O — User I/O pin (bank 4) |
| دبوس H6 | I/O — User I/O pin (bank 4) |
| دبوس H7 | I/O — User I/O pin (bank 4) |
| دبوس H8 | I/O — User I/O pin (bank 4) |
| دبوس J1 | I/O — User I/O pin (bank 5) |
| دبوس J2 | I/O — User I/O pin (bank 5) |
| دبوس J3 | GND — Ground |
| دبوس J4 | I/O — User I/O pin (bank 5) |
| دبوس J5 | CLK2 — Dedicated clock input 2 |
| دبوس J6 | I/O — User I/O pin (bank 5) |
| دبوس J7 | GND — Ground |
| دبوس J8 | I/O — User I/O pin (bank 5) |
| دبوس K1 | I/O — User I/O pin (bank 5) |
| دبوس K2 | I/O — User I/O pin (bank 5) |
| دبوس K3 | I/O — User I/O pin (bank 5) |
| دبوس K4 | VCCIO5 — I/O supply voltage, bank 5 |
| دبوس K5 | I/O — User I/O pin (bank 5) |
| دبوس K6 | I/O — User I/O pin (bank 5) |
| دبوس K7 | I/O — User I/O pin (bank 5) |
| دبوس K8 | I/O — User I/O pin (bank 5) |
| دبوس L1 | GND — Ground |
| دبوس L2 | I/O — User I/O pin (bank 6) |
| دبوس L3 | I/O — User I/O pin (bank 6) |
| دبوس L4 | I/O — User I/O pin (bank 6) |
| دبوس L5 | I/O — User I/O pin (bank 6) |
| دبوس L6 | I/O — User I/O pin (bank 6) |
| دبوس L7 | I/O — User I/O pin (bank 6) |
| دبوس L8 | I/O — User I/O pin (bank 6) |
| دبوس M1 | I/O — User I/O pin (bank 6) |
| دبوس M2 | I/O — User I/O pin (bank 6) |
| دبوس M3 | GND — Ground |
| دبوس M4 | I/O — User I/O pin (bank 6) |
| دبوس M5 | CLK3 — Dedicated clock input 3 |
| دبوس M6 | I/O — User I/O pin (bank 6) |
| دبوس M7 | GND — Ground |
| دبوس M8 | I/O — User I/O pin (bank 6) |
| دبوس N1 | I/O — User I/O pin (bank 7) |
| دبوس N2 | I/O — User I/O pin (bank 7) |
| دبوس N3 | I/O — User I/O pin (bank 7) |
| دبوس N4 | VCCIO7 — I/O supply voltage, bank 7 |
| دبوس N5 | I/O — User I/O pin (bank 7) |
| دبوس N6 | I/O — User I/O pin (bank 7) |
| دبوس N7 | I/O — User I/O pin (bank 7) |
| دبوس N8 | I/O — User I/O pin (bank 7) |
| دبوس P1 | GND — Ground |
| دبوس P2 | I/O — User I/O pin (bank 7) |
| دبوس P3 | I/O — User I/O pin (bank 7) |
| دبوس P4 | I/O — User I/O pin (bank 7) |
| دبوس P5 | I/O — User I/O pin (bank 7) |
| دبوس P6 | I/O — User I/O pin (bank 7) |
| دبوس P7 | I/O — User I/O pin (bank 7) |
| دبوس P8 | I/O — User I/O pin (bank 7) |
| دبوس R1 | I/O — User I/O pin (bank 8) |
| دبوس R2 | I/O — User I/O pin (bank 8) |
| دبوس R3 | GND — Ground |
| دبوس R4 | I/O — User I/O pin (bank 8) |
| دبوس R5 | MSEL0 — Configuration mode select 0 |
| دبوس R6 | I/O — User I/O pin (bank 8) |
| دبوس R7 | GND — Ground |
| دبوس R8 | I/O — User I/O pin (bank 8) |
| دبوس T1 | I/O — User I/O pin (bank 8) |
| دبوس T2 | I/O — User I/O pin (bank 8) |
| دبوس T3 | I/O — User I/O pin (bank 8) |
| دبوس T4 | VCCIO8 — I/O supply voltage, bank 8 |
| دبوس T5 | MSEL1 — Configuration mode select 1 |
| دبوس T6 | I/O — User I/O pin (bank 8) |
| دبوس T7 | I/O — User I/O pin (bank 8) |
| دبوس T8 | I/O — User I/O pin (bank 8) |
التطبيقات النموذجية
EPF10K30EFC256-2N مناسب لـ 6 التطبيقs: Industrial Glue Logic Replacement, Telecom Backplane Bridging, Legacy PCI Bridge / Interface, ASIC Emulation / Prototype, Retro-Computing and Industrial Retrofit, Test & Measurement Front-End.
Industrial Glue Logic Replacement
The EPF10K30EFC256-2N fits industrial glue-logic replacement because its 1,728 logic elements and 246 user I/Os are sufficient to replace multiple discrete 74-series TTL or PAL/GAL devices on a legacy backplane. With 0.6 ns propagation delay at speed grade -2 and a 0 °C to +70 °C commercial operating range, the part comfortably meets glue-logic timing margins for factory-floor PLCs and motor-control boards. The 256-ball FineLine BGA (1.0 mm pitch) integrates onto existing 4-layer PCBs without layout rework, and SRAM-based configuration lets designers iterate via JTAG without UV erasure. Pair with an EPC2 configuration device for standalone boot in factory automation cabinets.
موصى به
Telecom Backplane Bridging
The EPF10K30EFC256-2N is well suited to telecom backplane bridging across LVTTL/LVCMOS buses, where its 246 user I/Os and MultiVolt I/O banks can directly interface 5.0 V and 3.3 V legacy PHYs without external level shifters. Six EABs delivering 4 Kbits each (24 Kbits total) implement small FIFO buffers and protocol-state lookup tables, while 0.6 ns propagation delay accommodates 50 MHz parallel backplane signaling. The FineLine BGA's 1.0 mm pitch supports high-density backplane cards. Use this part in central-office bridges, E1/T1 line-interface cards, and SS7 signalling appliances where active parts are no longer available.
موصى به
Legacy PCI Bridge / Interface
The EPF10K30EFC256-2N supports legacy PCI interface bridging (33 MHz, 32-bit) within its 1,728 logic elements and 0.6 ns propagation delay budget, providing a flexible replacement for end-of-life PCI controller ASICs in industrial PCs, medical instruments, and test equipment. The 246 user I/Os comfortably accommodate 32-bit data plus 4-bit command/handshake plus parity and interrupt lines. MultiVolt I/O allows direct 5.0 V PCI signaling at 33 MHz without external buffers. Designers migrating older designs with this part benefit from in-system SRAM configuration that allows post-production firmware bug fixes via JTAG.
موصى به
ASIC Emulation / Prototype
The EPF10K30EFC256-2N serves as a cost-effective prototype platform for ASIC verification, where 30K gates, 24 Kbits of embedded RAM, and 0.6 ns propagation delay support behavioral models of small to mid-complexity ASICs. JTAG-based in-system programmability shortens bring-up iteration cycles from days to hours. The 256-ball FineLine BGA allows mechanical compatibility with multiple prototype boards, and the FLEX 10KE's deterministic FastTrack interconnect simplifies static timing analysis versus modern mesh-based architectures. Common in ASIC emulation for set-top boxes, industrial sensors, and medical-device controllers.
موصى به
Retro-Computing and Industrial Retrofit
The EPF10K30EFC256-2N is ideal for retro-computing and industrial-retrofit boards that need a modern (programmable) but mature logic fabric to replace discontinued 74F/74AS glue logic, GAL/PAL address decoders, or proprietary gate arrays in 1990s-era industrial controllers. Its SRAM configuration plus embedded RAM blocks enable recreation of vintage bus protocols (VME, Multibus, STD-32) without revisiting original ASIC mask sets. Commercial 0-70 °C temperature grade and FineLine BGA footprint allow direct drop-in to retrofitted PCBs. Aftermarket availability makes it the practical choice for keeping long-lifecycle factory systems operational.
موصى به
Test & Measurement Front-End
The EPF10K30EFC256-2N fits test-and-measurement front-end signal conditioning where its 0.6 ns propagation delay and 246 user I/Os allow simultaneous switching of multiple test vectors at sub-100 ns intervals. Embedded dual-port RAM blocks (six EABs at 4 Kbits each) hold waveform tables and reference patterns, eliminating external memory in compact instruments such as logic analyzers, protocol exercisers, and bench-top bit-error-rate testers. SRAM configuration via JTAG simplifies last-minute test pattern updates in R&D labs. Pair this part with an EPC2 configuration device for portable instruments.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EPF10K30EFC256-2N — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EPF10K30EFC256-2 | EPF10K30EFC256-3N | EPF10K30EFC256-1X | EPF10K30EFC256-1 | EPF10K100EFC256-2 |
|---|---|---|---|---|---|---|
| Package | 256-ball FineLine BGA (17x17 mm, 1.0 mm pitch) | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Typical Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | 100,000 |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 4,992 |
| Embedded RAM Bits | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 40,960 |
| User I/Os | 246 | 246 | 246 | 246 | 246 | 246 |
| Speed Grade | -2N (~0.6 ns) | -2 (~0.6 ns) | -3 (faster, ~0.5 ns) | -1X (slower) | -1 (slower) | -2 (~0.6 ns) |
| Lead-Free / RoHS | Non-RoHS (SnPb) | Pb-free / RoHS | Non-RoHS (SnPb) | Pb-free / RoHS | Pb-free / RoHS | Pb-free / RoHS |
| Operating Temperature | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C |
أبرز الفروقات
- Pb-free finish for RoHS-compliant assemblies (مقابلEPF10K30EFC256-2N)
- Faster speed grade (-3) for tighter timing margins (مقابلEPF10K30EFC256-2N)
- Larger logic capacity (100K gates) with identical footprint (مقابلEPF10K100EFC256-2)
ملاحظات التصميم
Estimated: at typical 30% toggle rate with all 246 I/Os switching at 50 MHz with 3.3 V VCCIO, total dynamic power is ~0.4 W plus ~0.1 W static. Combined with 1.0 mm-pitch FineLine BGA theta_JA around 25 °C/W on a 4-layer PCB with thermal vias, junction temperature stays below 80 °C in 25 °C ambient. For sealed enclosures, derate by 30% and add forced-air cooling above 50 °C ambient.
Use a 4-layer PCB with continuous VCC and GND planes under the 256-ball BGA. Place 0.1 µF + 10 µF decoupling capacitors within 5 mm of every VCCINT/VCCIO ball, plus bulk 47 µF tantalum at each PCB power entry. The 1.0 mm pitch requires NSMD (non-solder-mask-defined) pads with 0.5 mm diameter and via-in-pad (filled and plated over) for the center ball grid to ensure reliable reflow.
Configuration device selection: pair with EPC2LC20 (3.3 V) or EPC4QC100 for passive-serial configuration. Do NOT use an EPC1, which is incompatible with -2N speed grade devices. Always include a pull-up on nCONFIG and a pull-down on nSTATUS per FLEX 10KE datasheet recommendations. JTAG chaining requires TCK pulled low during power-up to prevent spurious configuration start.
Dedicated clock pins CLK1/CLK2/CLK3 (positions F5, J5, M5 in this pinout) should be routed with 50 Ω controlled impedance and isolated from switching I/O by a ground guard trace. MultiVolt I/O banks (1-8) must each have a VCCIO plane; do NOT tie banks at different voltages together or the I/O buffers will latch up. LVDS signaling is NOT supported on FLEX 10KE - use external transceivers.
معلومات الامتثال
EPF10K30EFC256-2N ships with SnPb (lead-bearing) finish per legacy FLEX 10KE BGA family datasheet - NOT RoHS-compliant. Choose EPF10K30EFC256-2 (Pb-free) for RoHS compliance. AEC-Q100 not applicable to FPGAs in this family.
