Intel

EPF10K30EFC256-2N - FLEX 10KE FPGA 30K Gates 256-BGA | Intel / Altera

MPN: EPF10K30EFC256-2N ✗ Cuối đời

256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch Package -2N (mid-grade, 0.6 ns) Speed

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EPF10K30EFC256-2N Tóm tắt

The Intel (formerly Altera) EPF10K30EFC256-2N is a member of the FLEX 10KE embedded programmable logic family, delivering approximately 30,000 typical gates with 1,728 logic elements (LEs) and 24,576 RAM bits in a 256-ball FineLine BGA package (17 x 17 mm, 1.0 mm pitch). It is implemented in a 0.22 µm CMOS SRAM process and supports in-system configuration via a built-in serial configuration interface. The '2N' speed grade corresponds to a propagation delay of approximately 0.6 ns at the register-to-register path, with a commercial operating temperature range of 0 °C to +70 °C.

A FLEX 10KE device is an SRAM-based FPGA that combines a logic array fabric with an Embedded Array Block (EAB), enabling true System-on-a-Programmable-Chip (SOPC) integration. Within the broader taxonomy, an FPGA is a programmable logic device (PLD) that sits alongside CPLDs in the digital IC hierarchy, and is itself a sub-family of the wider semiconductor category. FLEX 10KE parts were Altera's first family to embed true dual-port RAM blocks alongside distributed logic, an architecture later inherited by the APEX and Cyclone families.

Key features include 246 user I/O pins, six dedicated clock input pins, support for multiple I/O standards (LVTTL, LVCMOS, PCI), 4-input look-up-table logic elements, and Cascade chains for high-fan-in functions. The device supports MultiVolt I/O for interfacing to 5.0 V, 3.3 V, and 2.5 V buses. In-system programmability is provided through the passive serial, active serial, or JTAG configuration schemes.

Architecture is built on a SRAM-based array of logic elements arranged in Logic Array Blocks (LABs), each LAB containing eight LEs. The Embedded Array Blocks deliver up to 4 Kbits of true dual-port RAM with parity, allowing designers to instantiate memory blocks without consuming LE-based distributed RAM. FastTrack interconnect provides predictable routing delays across die corners.

Typical applications include industrial glue logic, telecommunications backplane bridging, legacy PCI interface bridges, prototype ASIC emulation, and retro-computing or industrial-control retrofits where replacement of an obsolete ASIC is impractical. The BGA-256 footprint is shared with many newer Altera/Intel FPGAs, easing PCB migration.

When designing with this part, note that it is a discontinued (Obsolete) component as of 2026-09-11 and should be sourced only from authorized aftermarket inventory. Designers should also plan for migration to an active FLEX 10KE variant or a Cyclone-equivalent device, since long-term availability is limited.

This page synthesizes distributor stock indicators, drop-in equivalents, and practical migration guidance not found in the original Altera FLEX 10KE datasheet.

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Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPF10K30EFC256-2N (cùng hình factor và footprint) — khác nhau ở Package, Operating Temperature, Process Technology, Speed Grade, Logic Elements / Cells.

EPF10K100EFC256-2

Intel

Package: 256-FBGA (FineLine BGA, 17 x 17 mm)

Process Technology: 0.22 µm CMOS SRAM

Logic Elements / Cells: 4,992 (49,152 user logic elements)