EPF6016QC208-3 - FLEX 6000 FPGA 16K Gates 1320 Cells | Altera
MPN: EPF6016QC208-3 ✗ انتهى عمره الإنتاجيEPF6016QC208-3 نظرة عامة
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit containing an array of configurable logic blocks (CLBs / LEs), programmable interconnect, and I/O cells, all of which can be re-programmed in the field to implement arbitrary digital logic. The FLEX 6000 family sits in the hierarchy: programmable logic device (PLD) -> CPLD/FPGA -> SRAM-based FPGA -> low-density FPGA (16K gate class). Each LE in the EPF6016 contains a 4-input look-up table (LUT), a programmable register, and dedicated carry and cascade chains that accelerate arithmetic and wide fan-in functions across LABs, providing deterministic, predictable timing for synchronous state machines and datapaths.
Key features of the EPF6016QC208-3 include 1,320 logic elements in 132 LABs, 171 user I/Os, an embedded array block structure, JTAG (IEEE 1149.1) boundary-scan support, and SRAM-based configuration loaded from a serial PROM or through the Altera ByteBlaster / MasterBlaster / BitBlaster download cables. The device supports in-system programmability (ISP) and can be reconfigured in-circuit without removing it from the PCB, enabling field upgrades and rapid prototyping. The Q-3 speed grade is appropriate for designs where fMAX targets are below 100 MHz and where routing headroom, rather than raw speed, is the primary concern.
The EPF6016QC208-3 is typically deployed in telecom line-card glue logic, industrial control and instrumentation backplanes, PCI / ISA bus bridges, asynchronous-transfer-mode (ATM) glue, and embedded microcontroller co-processors. The 208-pin PQFP footprint has a generous 0.5 mm lead pitch that simplifies hand-prototyping and rework compared to fine-pitch BGA packages, while still exposing 171 user I/Os for medium-density parallel buses and peripheral multiplexing. Designers transitioning from older discrete TTL or 74-series glue logic often select this part as a single-chip replacement for 10-30 SSI/MSI packages.
When designing with the EPF6016QC208-3, ensure that VCCINT decoupling uses 0.1 uF ceramic capacitors placed within 5 mm of every supply pin and that the JTAG TMS/TCK lines are pulled up to VCCIO through 10 kohm resistors. The configuration EEPROM (such as EPC1 or EPC2) should be wired to support FLEX 6000 passive-serial configuration mode. Because the -3 speed grade has the slowest tPD of the family, validate critical paths with the Quartus II (or legacy MAX+PLUS II) timing analyzer before committing to the layout.
This page synthesizes distributor pricing from Heisener, Octopart, DigiKey and Mouser, drop-in same-package alternatives from the FLEX 6000 family, and practical design notes not found in the manufacturer datasheet.
بدائل مباشرة لـ EPF6016QC208-3 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EPF6016QC208-3 (نفس عامل الشكل والبصمة) — يختلف في Operating Temperature, Package, Process Technology, Configuration Memory, Speed Grade.
EPF6016QC208-2
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF6016QC208-2N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF6016QC208
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF6016AQC208-3
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF6016AQC208-3N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF6016AQC208-3S
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF6016QC208-3 الحدود القصوى والخصائص الكهربائية
| Family | FLEX 6000 |
| Typical Gates | 16,000 |
| Logic Elements | 1,320 |
| Logic Array Blocks (LABs) | 132 |
| User I/Os | 171 |
| Process Technology | 5.0 V SRAM CMOS |
| Supply Voltage VCCINT | 5.0 V |
| Supply Voltage VCCIO | 3.3 V / 5.0 V tolerant |
| العلبة | 208-pin PQFP (QFP-208) |
| Speed Grade | -3 (slowest commercial) |
| Configuration Method | SRAM, passive-serial via EPC1/EPC2 |
| JTAG Support | IEEE 1149.1 boundary-scan |
| In-System Programmability | Yes |
| Operating Temperature (commercial) | 0 C to 85 C |
تكوين أطراف EPF6016QC208-3
| دبوس 1 | I/O — User I/O bank (pin 1 of 208) |
| دبوس 2 | I/O — User I/O bank |
| دبوس 3 | I/O — User I/O bank |
| دبوس 4 | I/O — User I/O bank |
| دبوس 5 | I/O — User I/O bank |
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| دبوس 29 | I/O — User I/O bank |
| دبوس 30 | I/O — User I/O bank |
| دبوس 31 | I/O — User I/O bank |
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| دبوس 49 | I/O — User I/O bank |
| دبوس 50 | I/O — User I/O bank |
| دبوس 51 | I/O — User I/O bank |
| دبوس 52 | I/O — User I/O bank |
| دبوس 53 | GND — Ground |
| دبوس 54 | I/O — User I/O bank |
| دبوس 55 | I/O — User I/O bank |
| دبوس 56 | I/O — User I/O bank |
| دبوس 57 | I/O — User I/O bank |
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| دبوس 101 | I/O — User I/O bank |
| دبوس 102 | I/O — User I/O bank |
| دبوس 103 | I/O — User I/O bank |
| دبوس 104 | I/O — User I/O bank |
| دبوس 105 | GND — Ground |
| دبوس 106 | I/O — User I/O bank |
| دبوس 107 | I/O — User I/O bank |
| دبوس 108 | I/O — User I/O bank |
| دبوس 109 | I/O — User I/O bank |
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| دبوس 153 | I/O — User I/O bank |
| دبوس 154 | I/O — User I/O bank |
| دبوس 155 | I/O — User I/O bank |
| دبوس 156 | I/O — User I/O bank |
| دبوس 157 | GND — Ground |
| دبوس 158 | I/O — User I/O bank |
| دبوس 159 | I/O — User I/O bank |
| دبوس 160 | I/O — User I/O bank |
| دبوس 161 | I/O — User I/O bank |
| دبوس 162 | I/O — User I/O bank |
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| دبوس 170 | I/O — User I/O bank |
| دبوس 171 | I/O — User I/O bank |
| دبوس 172 | I/O — User I/O bank |
| دبوس 173 | I/O — User I/O bank |
| دبوس 174 | I/O — User I/O bank |
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| دبوس 198 | I/O — User I/O bank |
| دبوس 199 | I/O — User I/O bank |
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| دبوس 201 | I/O — User I/O bank |
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| دبوس 205 | I/O — User I/O bank |
| دبوس 206 | I/O — User I/O bank |
| دبوس 207 | I/O — User I/O bank |
| دبوس 208 | I/O — User I/O bank |
التطبيقات النموذجية
EPF6016QC208-3 مناسب لـ 6 التطبيقs: Telecom Line-Card Glue Logic, Industrial Control Backplanes, PCI / ISA Bus Bridge, Embedded Microcontroller Co-Processor, Legacy ASIC Replacement, Test and Measurement Instrumentation.
Telecom Line-Card Glue Logic
The EPF6016QC208-3 is well suited to telecom line-card glue logic where it consolidates 10-30 discrete 74-series SSI/MSI packages into a single reprogrammable device. With 1,320 logic elements across 132 LABs and 171 user I/Os, it absorbs bus bridges, framer interfaces, and clock-domain crossings that surround legacy TDM ASICs, while the 5.0V VCCINT and 3.3V/5.0V-tolerant VCCIO simplify interfacing to vintage line-card backplanes. The -3 speed grade delivers deterministic timing at sub-100 MHz fMAX with ample routing slack, and in-system programmability via JTAG (IEEE 1149.1) allows field firmware revisions without removing the line card from service.
موصى به
Industrial Control Backplanes
The EPF6016QC208-3 has long been deployed in industrial control backplanes for PLCs, motor drives, and process instrumentation, where its 208-pin PQFP package with 0.5 mm lead pitch is hand-solderable and field-reworkable by technicians. The 5.0V core tolerance interfaces directly to legacy 74HC/74LS logic on the backplane, while the 171 available I/Os drive multi-drop RS-485, CAN, and parallel fieldbus transceivers without external bus-switches. Combined with 1,320 LEs of state-machine capacity and SRAM-based in-system reconfigurability, it lets OEM backplane vendors ship a single hardware platform that supports multiple customer-specific protocols through firmware differentiation.
موصى به
PCI / ISA Bus Bridge
For PCI (33 MHz, 32-bit) and ISA bus bridge designs the EPF6016QC208-3 supplies enough logic and I/O to implement address decoding, byte-enable logic, wait-state generation, and interrupt steering without external MSI glue. The 171 user I/Os comfortably fan out to 32-bit address/data buses plus control and arbitration signals, and the -3 speed grade provides timing margin for 33 MHz PCI signaling when paired with external transceivers. SRAM-based configuration lets a single PCB ship as PCI or ISA depending on the loaded bitstream, simplifying inventory across product variants.
موصى به
Embedded Microcontroller Co-Processor
The EPF6016QC208-3 serves as a co-processor to 8-bit and 16-bit microcontrollers (8051, 68HC11, H8) by offloading custom peripheral logic, DSP pre-processing, or parallel I/O expansion. Its 1,320 LEs implement state machines for stepping-motor control, encoder quadrature decoding, or LCD segment driving without burdening the host MCU's cycle budget. The PQFP-208 footprint mates with hand-rework-friendly 2-layer PCBs, and the 5.0V core matches the supply rail of legacy microcontrollers, removing level-shifters from the bus between host and FPGA.
موصى به
Legacy ASIC Replacement
The EPF6016QC208-3 is a frequent ASIC-replacement target for low-volume industrial and military programs whose original masked-ASIC supplier has exited the market. With approximately 16,000 equivalent ASIC gates and 1,320 logic elements, it accommodates designs that previously committed to 5.0V masked ASICs and now require last-time-buy alternatives. The SRAM bitstream is held in an external EPC1/EPC2 PROM, allowing the design to be re-spun in software rather than at the wafer fab, and the same 208-pin PQFP footprint matches legacy ASIC land patterns so PCBs do not require rework.
موصى به
Test and Measurement Instrumentation
Bench-top test and measurement instruments use the EPF6016QC208-3 as a flexible pattern generator, protocol decoder, or custom-timing engine where off-the-shelf microcontrollers lack deterministic timing. The 132 LABs hold wide counters, parallel-serial converters, and trigger-state machines, while the 171 user I/Os simultaneously drive front-panel BNC connectors, parallel LCDs, and GPIB/HPIB interfaces. In-system programmability allows the instrument firmware to be updated through JTAG without opening the chassis, and the -3 speed grade provides robust timing margin for slow-precision measurements up to roughly 50 MHz.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EPF6016QC208-3 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EPF6016QC208-2 | EPF6016QC208-2N | EPF6016AQC208-3 | EPF6016AQC208-3N |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | PQFP-208 | PQFP-208 - same | PQFP-208 - same | PQFP-208 - same | PQFP-208 - same |
| Logic Elements | 1,320 | 1,320 (same die) | 1,320 (same die) | 1,320 (same die) | 1,320 (same die) |
| LABs | 132 | 132 | 132 | 132 | 132 |
| User I/Os | 171 | 171 | 171 | 171 | 171 |
| Speed Grade | -3 (slowest) | -2 (faster fMAX) | -2 + industrial temp | -3 (same speed, A-grade die) | -3 (same speed, A-grade + industrial) |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C | -40 C to +85 C (industrial) | 0 C to +85 C | -40 C to +85 C (industrial) |
| Supply Voltage VCCINT | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
أبرز الفروقات
- Lowest cost FLEX 6000 speed grade in PQFP-208 (مقابلEPF6016QC208-2)
- Industrial temperature variant available in same footprint (مقابلEPF6016QC208-2N)
- Same die across PQFP and BGA package options (مقابلEPF6016BC256-3)
ملاحظات التصميم
Estimated: at VCCINT = 5.0 V and typical 100 MHz operation with 70% utilization, the EPF6016QC208-3 core current is approximately 100-150 mA. Place 0.1 uF X7R ceramic decoupling within 5 mm of every VCCINT pin and add a single bulk 47-100 uF tantalum or aluminum-polymer capacitor on each VCCINT island. VCCIO banks should be decoupled similarly and never left floating - unused banks should be tied to the same rail as the active bank to prevent I/O latch-up.
PQFP-208 has 0.5 mm lead pitch - keep-out clearance of 0.3 mm above the package body is required for socketed or hand-reworked designs. Route all I/O signals on inner layers with vias placed inside the package land pattern to avoid signal-fanout congestion. Provide a continuous ground plane on layer 2 directly beneath the device, and stitch the perimeter of the PQFP land pattern with a ground-signal-ground trace pattern to control simultaneous-switching noise (SSN) on the 171 I/O banks.
Do not confuse speed grades - the -3 grade has the slowest tPD of the FLEX 6000 family; designing assuming -1 fMAX values will fail timing closure. The configuration PROM (EPC1/EPC2) must match the bit-width of the FLEX 6000 bitstream - using an EPC8 intended for ACEX devices will not configure the EPF6016. Finally, the JTAG chain order (TMS/TCK/TDO/TDI) must be verified before ISP programming or boundary-scan test vectors will return expected results.
The 208-pin PQFP has long internal bond wires that introduce approximately 4-6 nH of series inductance per pin, which combined with 5-10 pF of pin capacitance creates LC resonances around 600 MHz. For signal-integrity above 50 MHz, add 33 ohm series resistors on clock outputs and source-terminate high-speed buses. The PQFP-208 body is approximately 28 mm x 28 mm with 3.4 mm height - allow 4 mm of vertical clearance above the package for socketed test clips and inspection.
معلومات الامتثال
RoHS/REACH status not present in verified web data; EPF6016QC208-3 pre-dates RoHS Phase 2 transition (the FLEX 6000 family launched in 1998). AEC-Q100 not applicable - this is a commercial-grade FPGA. For RoHS-compliant variants of the FLEX 6000 die, consult Altera/Intel product-change notifications.
