Altera

EPF6016QC208-3 - FLEX 6000 FPGA 16K Gates 1320 Cells | Altera

MPN: EPF6016QC208-3 ✗ Akhir Hidup

5.0 V Vdss 208-pin PQFP (QFP-208) Package -3 (slowest commercial) Speed

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EPF6016QC208-3 Ringkasan

The Altera (Intel) EPF6016QC208-3 is a member of the FLEX 6000 family of Field-Programmable Gate Arrays (FPGAs) fabricated on a 5.0V CMOS process, offering 16,000 typical gates and 1,320 logic elements across 132 Logic Array Blocks (LABs). The -3 speed grade denotes the slowest commercial speed bin of the family, prioritizing timing-closure margin over absolute fMAX, and the device is housed in a 208-pin Power Quad Flat Pack (PQFP / QFP-208) package with 171 usable user I/Os. It operates from a single 5.0V supply (VCCINT = 5.0V, VCCIO = 3.3V or 5.0V tolerant) and is targeted at glue-logic, bus-interface, and cost-sensitive ASIC-replacement designs in industrial, telecom, and embedded-control applications.

A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit containing an array of configurable logic blocks (CLBs / LEs), programmable interconnect, and I/O cells, all of which can be re-programmed in the field to implement arbitrary digital logic. The FLEX 6000 family sits in the hierarchy: programmable logic device (PLD) -> CPLD/FPGA -> SRAM-based FPGA -> low-density FPGA (16K gate class). Each LE in the EPF6016 contains a 4-input look-up table (LUT), a programmable register, and dedicated carry and cascade chains that accelerate arithmetic and wide fan-in functions across LABs, providing deterministic, predictable timing for synchronous state machines and datapaths.

Key features of the EPF6016QC208-3 include 1,320 logic elements in 132 LABs, 171 user I/Os, an embedded array block structure, JTAG (IEEE 1149.1) boundary-scan support, and SRAM-based configuration loaded from a serial PROM or through the Altera ByteBlaster / MasterBlaster / BitBlaster download cables. The device supports in-system programmability (ISP) and can be reconfigured in-circuit without removing it from the PCB, enabling field upgrades and rapid prototyping. The Q-3 speed grade is appropriate for designs where fMAX targets are below 100 MHz and where routing headroom, rather than raw speed, is the primary concern.

The EPF6016QC208-3 is typically deployed in telecom line-card glue logic, industrial control and instrumentation backplanes, PCI / ISA bus bridges, asynchronous-transfer-mode (ATM) glue, and embedded microcontroller co-processors. The 208-pin PQFP footprint has a generous 0.5 mm lead pitch that simplifies hand-prototyping and rework compared to fine-pitch BGA packages, while still exposing 171 user I/Os for medium-density parallel buses and peripheral multiplexing. Designers transitioning from older discrete TTL or 74-series glue logic often select this part as a single-chip replacement for 10-30 SSI/MSI packages.

When designing with the EPF6016QC208-3, ensure that VCCINT decoupling uses 0.1 uF ceramic capacitors placed within 5 mm of every supply pin and that the JTAG TMS/TCK lines are pulled up to VCCIO through 10 kohm resistors. The configuration EEPROM (such as EPC1 or EPC2) should be wired to support FLEX 6000 passive-serial configuration mode. Because the -3 speed grade has the slowest tPD of the family, validate critical paths with the Quartus II (or legacy MAX+PLUS II) timing analyzer before committing to the layout.

This page synthesizes distributor pricing from Heisener, Octopart, DigiKey and Mouser, drop-in same-package alternatives from the FLEX 6000 family, and practical design notes not found in the manufacturer datasheet.

Alternatif penggantian untuk EPF6016QC208-3 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPF6016QC208-3 (sama faktor bentuk dan footprint) — berbeda di dalam Operating Temperature, Package, Process Technology, Configuration Memory, Speed Grade.

EPF6016AQC208-3

Intel

Operating Temperature: 0 C to +85 C (Commercial)

Process Technology: 0.35 um CMOS, 5 V tolerant

Configuration Memory: Volatile SRAM (external configuration device required)