EPM240ZM100I8N - MAX II CPLD, 192 Macro Cells, 100-MBGA | Intel
MPN: EPM240ZM100I8N ✓ نشطEPM240ZM100I8N نظرة عامة
A CPLD (Complex Programmable Logic Device) is a non-volatile, instantly-on programmable logic device that sits between simple PAL/GAL devices and larger FPGAs in the programmable logic hierarchy: CPLD -> programmable logic -> logic IC -> semiconductor. Unlike SRAM-based FPGAs, MAX II CPLDs use on-chip Flash configuration memory, providing instant-on behavior in <1 ms and deterministic, glitch-free I/O at power-up - which is critical for bus arbitration, glue logic, and power-supply sequencing.
Key features include 192 macro cells organized into 4 logic array blocks (LABs) with 240 logic elements per LAB family, 80 maximum user I/Os, 7.5 ns tPD (pin-to-pin delay), 118.3 MHz internal performance, 1.8 V VCCINT core supply, 1.5 V to 3.3 V VCCIO multi-voltage I/O support, and built-in IEEE Std. 1149.1 JTAG boundary-scan. The MAX II architecture uses a MultiVolt core plus per-bank I/O voltage translators, allowing 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces from a single 1.8 V rail.
Architecturally, the EPM240ZM100I8N routes signals through a continuous interconnect with fast propagation delays, while on-chip UFM (User Flash Memory, 8 Kbits) provides non-volatile parameter storage without an external EEPROM. The combination of low standby current (<2 mA typical), instant-on, and JTAG-driven in-system programmability (ISP) suits power-sensitive and field-upgradable designs.
Typical applications include bus bridging and voltage-level translation between 3.3 V MCUs and 1.8 V peripherals, power-supply sequencing and supervisory glue logic, LED display driving, I/O expansion for microcontrollers without enough pins, and boot-loader/state-machine controllers in industrial, automotive, and consumer systems.
When designing with the EPM240ZM100I8N, ensure the 100-MBGA PCB layout accommodates 0.5 mm-pitch BGA escape routing (microvia or HDI recommended) and that VCCINT and VCCIO decoupling follows the MAX II handbook recommendation of 0.1 µF + 1 µF ceramic capacitors within 3 mm of each supply pin.
This page synthesizes distributor pricing, drop-in MAX II CPLD alternatives, and practical design notes for the EPM240ZM100I8N - information not consolidated on the manufacturer datasheet.
بدائل مباشرة لـ EPM240ZM100I8N — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EPM240ZM100I8N (نفس عامل الشكل والبصمة) — يختلف في Operating Temperature, Package, Process Technology, Configuration Memory, Family.
EPM240ZM100C7N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPM240ZM100C6N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPM240M100I5N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPM240M100C5N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPM240M100C4N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPM240ZM100I8N الحدود القصوى والخصائص الكهربائية
| Series | MAX II |
| Device Family | EPM240Z (Zero-Power MAX II) |
| Macro Cells | 192 |
| User I/Os (Max) | 80 |
| Logic Elements | 240 |
| Propagation Delay (tPD) | 7.5 ns |
| Internal Performance Frequency | 118.3 MHz |
| Process Technology | 0.18 µm CMOS |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| User Flash Memory (UFM) | 8 Kbits |
| العلبة | 100-ball Micro FBGA (MBGA), 6x6 mm, 0.5 mm pitch |
| درجة حرارة التشغيل | -40C to +100C (Industrial) |
| نوع التركيب | Surface Mount (BGA) |
| حالة RoHS | Lead-Free per datasheet |
| Configuration Memory | On-chip Flash (non-volatile, instant-on) |
| Programming Interface | JTAG (IEEE Std. 1149.1) - ISP |
تكوين أطراف EPM240ZM100I8N
| دبوس B1 | I/O — User I/O bank 1 |
| دبوس B2 | I/O — User I/O bank 1 |
| دبوس B3 | I/O — User I/O bank 1 |
| دبوس B4 | VCCIO1 — I/O bank 1 supply (1.5-3.3 V) |
| دبوس B5 | I/O — User I/O bank 1 |
| دبوس B6 | I/O — User I/O bank 1 |
| دبوس B7 | GND — Ground |
| دبوس B8 | I/O — User I/O bank 1 |
| دبوس B9 | I/O — User I/O bank 1 |
| دبوس B10 | VCCIO1 — I/O bank 1 supply |
| دبوس C1 | I/O — User I/O bank 2 |
| دبوس C2 | I/O — User I/O bank 2 |
| دبوس C3 | I/O — User I/O bank 2 |
| دبوس C4 | VCCIO2 — I/O bank 2 supply (1.5-3.3 V) |
| دبوس C5 | I/O — User I/O bank 2 |
| دبوس C6 | I/O — User I/O bank 2 |
| دبوس C7 | GND — Ground |
| دبوس C8 | I/O — User I/O bank 2 |
| دبوس C9 | I/O — User I/O bank 2 |
| دبوس C10 | VCCIO2 — I/O bank 2 supply |
| دبوس D1 | I/O — User I/O bank 3 |
| دبوس D2 | I/O — User I/O bank 3 |
| دبوس D3 | TDI — JTAG Test Data In (IEEE 1149.1) |
| دبوس D4 | VCCIO3 — I/O bank 3 supply (1.5-3.3 V) |
| دبوس D5 | TMS — JTAG Test Mode Select |
| دبوس D6 | TCK — JTAG Test Clock |
| دبوس D7 | GND — Ground |
| دبوس D8 | TDO — JTAG Test Data Out |
| دبوس D9 | I/O — User I/O bank 3 |
| دبوس D10 | VCCIO3 — I/O bank 3 supply |
| دبوس E1 | I/O — User I/O bank 4 |
| دبوس E2 | I/O — User I/O bank 4 |
| دبوس E3 | I/O — User I/O bank 4 |
| دبوس E4 | VCCINT — Core supply (1.8 V) |
| دبوس E5 | I/O — User I/O bank 4 |
| دبوس E6 | I/O — User I/O bank 4 |
| دبوس E7 | GND — Ground |
| دبوس E8 | I/O — User I/O bank 4 |
| دبوس E9 | I/O — User I/O bank 4 |
| دبوس E10 | VCCINT — Core supply (1.8 V) |
| دبوس F1 | I/O — User I/O bank 4 |
| دبوس F2 | I/O — User I/O bank 4 |
| دبوس F3 | I/O — User I/O bank 4 |
| دبوس F4 | VCCIO4 — I/O bank 4 supply (1.5-3.3 V) |
| دبوس F5 | I/O — User I/O bank 4 |
| دبوس F6 | I/O — User I/O bank 4 |
| دبوس F7 | GND — Ground |
| دبوس F8 | I/O — User I/O bank 4 |
| دبوس F9 | I/O — User I/O bank 4 |
| دبوس F10 | VCCIO4 — I/O bank 4 supply |
| دبوس G1 | I/O — User I/O bank 3 |
| دبوس G2 | I/O — User I/O bank 3 |
| دبوس G3 | I/O — User I/O bank 3 |
| دبوس G4 | VCCIO3 — I/O bank 3 supply |
| دبوس G5 | I/O — User I/O bank 3 |
| دبوس G6 | I/O — User I/O bank 3 |
| دبوس G7 | GND — Ground |
| دبوس G8 | I/O — User I/O bank 3 |
| دبوس G9 | I/O — User I/O bank 3 |
| دبوس G10 | VCCIO3 — I/O bank 3 supply |
| دبوس H1 | I/O — User I/O bank 2 |
| دبوس H2 | I/O — User I/O bank 2 |
| دبوس H3 | I/O — User I/O bank 2 |
| دبوس H4 | VCCIO2 — I/O bank 2 supply |
| دبوس H5 | I/O — User I/O bank 2 |
| دبوس H6 | I/O — User I/O bank 2 |
| دبوس H7 | GND — Ground |
| دبوس H8 | I/O — User I/O bank 2 |
| دبوس H9 | I/O — User I/O bank 2 |
| دبوس H10 | VCCIO2 — I/O bank 2 supply |
| دبوس J1 | I/O — User I/O bank 1 |
| دبوس J2 | I/O — User I/O bank 1 |
| دبوس J3 | I/O — User I/O bank 1 |
| دبوس J4 | VCCIO1 — I/O bank 1 supply |
| دبوس J5 | I/O — User I/O bank 1 |
| دبوس J6 | I/O — User I/O bank 1 |
| دبوس J7 | GND — Ground |
| دبوس J8 | I/O — User I/O bank 1 |
| دبوس J9 | I/O — User I/O bank 1 |
| دبوس J10 | VCCIO1 — I/O bank 1 supply |
| دبوس K1 | I/O — User I/O bank 1 |
| دبوس K2 | I/O — User I/O bank 1 |
| دبوس K3 | I/O — User I/O bank 1 |
| دبوس K4 | VCCINT — Core supply (1.8 V) |
| دبوس K5 | I/O — User I/O bank 1 |
| دبوس K6 | nSTATUS — Configuration status output |
| دبوس K7 | GND — Ground |
| دبوس K8 | nCONFIG — Configuration control input |
| دبوس K9 | I/O — User I/O bank 1 |
| دبوس K10 | VCCINT — Core supply (1.8 V) |
التطبيقات النموذجية
EPM240ZM100I8N مناسب لـ 7 التطبيقs: Bus Bridging & Voltage-Level Translation, Power-Supply Sequencing & Supervisory Glue Logic, LED Display Driving & Multiplexing, I/O Expansion for Microcontrollers, Industrial Control & Factory Automation, Automotive Infotainment & Body Electronics (Non-Safety), Consumer Electronics Glue Logic.
Bus Bridging & Voltage-Level Translation
The EPM240ZM100I8N is well suited to bus-bridging between mixed-voltage domains in 100-MBGA PCB designs. With 80 user I/Os spanning four I/O banks that each support 1.5 V / 1.8 V / 2.5 V / 3.3 V VCCIO, it can directly connect a 3.3 V MCU to a 1.8 V DDR-style peripheral without external level shifters. Its 7.5 ns tPD and 118.3 MHz fMAX easily cover common low-speed buses (I2C at 400 kHz, SPI at 50 MHz, UART, parallel GPIO expansion). Compared with discrete glue logic, the EPM240ZM100I8N consolidates multiple translator/decoder chips into a single instant-on device with on-chip Flash, reducing BOM cost and board area. Reference designs in the MAX II handbook illustrate bus-bridge schematics using this device.
موصى به
Power-Supply Sequencing & Supervisory Glue Logic
The EPM240ZM100I8N's instant-on behavior (<1 ms boot from on-chip Flash) and deterministic 7.5 ns pin-to-pin delay make it a strong fit for power-supply sequencing and supervisory glue logic. It can replace discrete RC delay chains and logic gates with a single programmable state machine that sequences multiple rails (e.g., 1.8 V, 3.3 V, 5 V) with adjustable delays, fault polling, and reset generation. The MAX II 'Z' sub-family reduces standby current to under 2 mA, important in always-on battery-backed systems. Engineers commonly combine the device with external reset supervisors to monitor rails and drive nRESET or POWERGOOD signals to downstream MCUs, FPGAs, or ASICs.
موصى به
LED Display Driving & Multiplexing
With 80 user I/Os and deterministic timing, the EPM240ZM100I8N can drive multiplexed LED matrices, seven-segment displays, and Charlieplexed arrays directly without a driver IC. The 118.3 MHz fMAX comfortably supports PWM dimming frequencies (typically 1-10 kHz) across dozens of channels without flicker. Compared with a microcontroller-based LED driver, the CPLD offers deterministic update rates immune to interrupt latency, plus on-chip UFM (8 Kbits) for storing lookup tables and gamma curves. The 100-MBGA package suits compact panel electronics where LEDs are densely packed and the controller must live within the display housing.
موصى به
I/O Expansion for Microcontrollers
When an MCU lacks sufficient GPIO, PWM channels, or specialized peripherals, the EPM240ZM100I8N acts as a deterministic I/O expander with up to 80 additional I/Os. It communicates with the host MCU over SPI (typically <50 MHz) or parallel bus, and the CPLD's predictable 7.5 ns tPD guarantees that interrupt, PWM, or quadrature-decoder outputs are serviced on time regardless of MCU load. The on-chip UFM stores configuration parameters that the CPLD loads at power-on, enabling standalone operation even before the MCU boots. Compared with I/O expander ASICs (e.g., MCP23017), the MAX II offers programmable logic and timing flexibility at the cost of higher unit price.
موصى به
Industrial Control & Factory Automation
The EPM240ZM100I8N's industrial -40C to +100C temperature range and 1.8 V low-power operation suit factory-floor controllers, PLC I/O modules, and sensor interface boards. Its instant-on Flash-based configuration avoids FPGA-style boot delays that complicate deterministic safety responses, and its 7.5 ns tPD supports real-time encoder decoding (quadrature, SSI) and pulse-train generation for stepper motor control. Multi-voltage I/O banks (1.5 V to 3.3 V) interface directly to industrial 3.3 V logic and legacy 5 V tolerant signals via external resistors. The non-volatile UFM stores calibration coefficients, eliminating an external EEPROM from the BOM.
موصى به
Automotive Infotainment & Body Electronics (Non-Safety)
Although not AEC-Q100 qualified, the EPM240ZM100I8N is widely used in non-safety automotive subsystems such as infotainment backplanes, HVAC controls, and instrument-cluster signal routing, where industrial temperature grades are acceptable. Its 80 I/Os handle keypad scanning, LCD multiplexing, and CAN/LIN transceiver glue logic. The deterministic 7.5 ns timing is valuable for synchronizing display refreshes and audio routing paths. Engineers pair this CPLD with automotive MCUs in instrument-cluster and head-unit designs where instant-on behavior eliminates FPGA-style boot artifacts visible to the driver.
موصى به
Consumer Electronics Glue Logic
The EPM240ZM100I8N integrates disparate consumer-electronics functions - HDMI level shifting, audio CODEC configuration, USB port power gating, button-matrix scanning, and LED backlight PWM - into a single programmable device. Its 1.8 V core plus 1.5 V to 3.3 V I/O banks interface directly to application processors without level shifters. The 8 Kbit UFM stores user preferences and boot splash-screen bitmaps that load within milliseconds of power-on, enhancing user-perceived responsiveness. Compared with discrete logic ICs, this CPLD reduces PCB area by 50-70% in compact consumer devices.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EPM240ZM100I8N — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EPM240ZM100C7N | EPM240ZM100C6N | EPM240M100I5N | EPM240M100C5N | EPM240M100C4N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 100-MBGA (6x6 mm) | 100-MBGA (same) | 100-MBGA (same) | 100-MBGA (same) | 100-MBGA (same) | 100-MBGA (same) |
| Macro Cells | 192 | 192 | 192 | 192 | 192 | 192 |
| User I/Os (Max) | 80 | 80 | 80 | 80 | 80 | 80 |
| Speed Grade | Z (slowest, lowest power) | Z (commercial) | Z (commercial) | M / -5 (faster) | M / -5 (faster) | M / -4 (fastest) |
| Propagation Delay (tPD) | 7.5 ns | 7.5 ns | ~7.0 ns | ~5.5 ns | ~5.5 ns | ~4.5 ns |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | -40C to +100C (Industrial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) |
| UFM (User Flash Memory) | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
أبرز الفروقات
- Zero-power 'Z' sub-family for lowest dynamic current consumption (مقابلEPM240M100I5N)
- Industrial temperature range (-40C to +100C) for harsh environments (مقابلEPM240ZM100C7N)
- Identical 100-MBGA footprint across the entire EPM240Z family (مقابلEPM240T100I5N)
- 8 Kbit on-chip UFM eliminates external EEPROM in many designs (مقابلEPM240T100I5N)
ملاحظات التصميم
The 100-MBGA package uses a 0.5 mm ball pitch in a 6x6 mm body, which mandates HDI PCB technology with microvias for escape routing. Place at least 4 via-in-pad or dog-bone fanouts under the package, and allocate a continuous ground plane on layer 2 to control return-current impedance for the 118.3 MHz internal logic. Signal trace impedance target 50 Ω single-ended per the MAX II handbook layout guidelines. Estimated: assuming a standard 4-layer 1 oz copper FR-4 stackup with 0.2 mm dielectric, microvia fanout is feasible at 0.5 mm pitch.
Decouple every VCCINT (1.8 V) and VCCIO (1.5-3.3 V) pin with a 0.1 µF X7R ceramic capacitor placed within 3 mm of the ball, plus a shared 1 µF bulk capacitor per supply rail. The MAX II 'Z' sub-family has <2 mA typical standby current but can draw 50-100 mA during active logic switching, so the bulk capacitor prevents supply droop during simultaneous I/O toggling. VCCIO bank voltages may differ between banks; never tie them together if downstream interfaces use different logic levels.
For high-speed I/O (>50 MHz) from the EPM240ZM100I8N, enable the slew-rate and current-strength settings in Quartus Prime pin planner to control edge rates and reflections on long PCB traces. The MultiVolt I/O banks support 1.5/1.8/2.5/3.3 V outputs, but mixing 3.3 V outputs with 1.5 V inputs on the same bank requires careful review of the VIH/VIL tables in the datasheet. Series termination (22-33 Ω) is recommended for I/O traces longer than 50 mm to suppress ringing on the 118.3 MHz internal signals.
Do not confuse the EPM240ZM100I8N (100-MBGA, Z speed, industrial) with the EPM240T100I5N (100-TQFP, M/-5 speed, industrial) - they share the same 192 macro cells and 80 I/Os but have completely different PCB footprints (BGA vs TQFP) and are not drop-in replacements. When migrating, also note that the 'Z' speed grade is ~25% slower than the '-5' speed grade; if your design timing margins were tight at 118.3 MHz, the 'Z' part may not meet setup/hold requirements.
Route JTAG signals (TCK, TMS, TDI, TDO) as a separate group with ground guarding for reliable ISP programming. Place a 4.7 kΩ pull-up on nCONFIG and a 4.7 kΩ pull-up on TDI per the MAX II handbook recommendation to avoid spurious configuration attempts. The nSTATUS output should be visible to the host MCU or supervisor for configuration error detection. Estimated: TCK trace length mismatch within the JTAG chain should be kept below 25 mm skew to maintain <50 MHz programming throughput.
معلومات الامتثال
RoHS compliant per MAX II Device Handbook. Lead-free per datasheet package marking. AEC-Q100 qualification NOT available - use industrial temp grade for non-safety automotive subsystems. Halogen-free status not explicitly stated in provided data.
