EPM240M100C5N - MAX II CPLD 192MC 80 I/O | Intel
MPN: EPM240M100C5N β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.2 | $8.20 |
| 10 | $7.45 | $74.50 |
| 100 | $6.3 | $630.00 |
| 500 | $5.1 | $2,550.00 |
| 1,000 | $4.25 | $4,250.00 |
Drop-in alternatives for EPM240M100C5N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet βEPM240F100C5N
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View Datasheet βEPM240M100C5N Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Logic Elements | 240 |
| Macrocells | 192 |
| User I/Os | 80 |
| Propagation Delay (tPD) | 4.7 ns |
| User Flash Memory | 8 Kbits |
| Supply Voltage - Core | 1.8 V |
| Supply Voltage - I/O | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Operating Temperature | -40 C to +125 C |
| Package | 100-ball MBGA (Micro FBGA), 6 x 6 mm, 0.5 mm pitch |
| Mounting Type | Surface Mount |
| Process Technology | 0.18 Β΅m CMOS |
| Configuration Memory | On-chip Flash (non-volatile) |
| JTAG Support | IEEE 1149.1 boundary-scan |
| RoHS Status | Compliant (lead-free) |
| Logic Family | CMOS |
EPM240M100C5N Pin Configuration
| Pin A1 | I/O β User I/O pin (bank 1) |
| Pin A2 | I/O β User I/O pin (bank 1) |
| Pin A3 | I/O β User I/O pin (bank 1) |
| Pin A4 | VCCIO1 β I/O bank 1 supply voltage |
| Pin A5 | I/O β User I/O pin (bank 1) |
| Pin A6 | I/O β User I/O pin (bank 1) |
| Pin A7 | I/O β User I/O pin (bank 1) |
| Pin A8 | I/O β User I/O pin (bank 1) |
| Pin A9 | GND β Ground |
| Pin A10 | I/O β User I/O pin (bank 2) |
| Pin B1 | I/O β User I/O pin (bank 1) |
| Pin B2 | I/O β User I/O pin (bank 1) |
| Pin B3 | GND β Ground |
| Pin B4 | I/O β User I/O pin (bank 1) |
| Pin B5 | I/O β User I/O pin (bank 1) |
| Pin B6 | VCCIO1 β I/O bank 1 supply voltage |
| Pin B7 | I/O β User I/O pin (bank 1) |
| Pin B8 | I/O β User I/O pin (bank 1) |
| Pin B9 | I/O β User I/O pin (bank 2) |
| Pin B10 | I/O β User I/O pin (bank 2) |
| Pin C1 | I/O β User I/O pin (bank 1) |
| Pin C2 | VCCIO1 β I/O bank 1 supply voltage |
| Pin C3 | I/O β User I/O pin (bank 1) |
| Pin C4 | I/O β User I/O pin (bank 1) |
| Pin C5 | GND β Ground |
| Pin C6 | I/O β User I/O pin (bank 1) |
| Pin C7 | I/O β User I/O pin (bank 1) |
| Pin C8 | GND β Ground |
| Pin C9 | I/O β User I/O pin (bank 2) |
| Pin C10 | I/O β User I/O pin (bank 2) |
| Pin D1 | GND β Ground |
| Pin D2 | I/O β User I/O pin (bank 1) |
| Pin D3 | I/O β User I/O pin (bank 1) |
| Pin D4 | I/O β User I/O pin (bank 1) |
| Pin D5 | I/O β User I/O pin (bank 1) |
| Pin D6 | I/O β User I/O pin (bank 1) |
| Pin D7 | I/O β User I/O pin (bank 1) |
| Pin D8 | I/O β User I/O pin (bank 1) |
| Pin D9 | I/O β User I/O pin (bank 2) |
| Pin D10 | VCCIO2 β I/O bank 2 supply voltage |
| Pin E1 | I/O β User I/O pin (bank 1) |
| Pin E2 | I/O β User I/O pin (bank 1) |
| Pin E3 | I/O β User I/O pin (bank 1) |
| Pin E4 | VCCINT β Core supply voltage (1.8 V) |
| Pin E5 | I/O β User I/O pin (bank 1) |
| Pin E6 | I/O β User I/O pin (bank 1) |
| Pin E7 | VCCINT β Core supply voltage (1.8 V) |
| Pin E8 | I/O β User I/O pin (bank 2) |
| Pin E9 | I/O β User I/O pin (bank 2) |
| Pin E10 | I/O β User I/O pin (bank 2) |
| Pin F1 | I/O β User I/O pin (bank 1) |
| Pin F2 | GND β Ground |
| Pin F3 | I/O β User I/O pin (bank 1) |
| Pin F4 | I/O β User I/O pin (bank 1) |
| Pin F5 | TCK β JTAG clock input |
| Pin F6 | TDO β JTAG data out |
| Pin F7 | I/O β User I/O pin (bank 2) |
| Pin F8 | I/O β User I/O pin (bank 2) |
| Pin F9 | GND β Ground |
| Pin F10 | I/O β User I/O pin (bank 2) |
| Pin G1 | I/O β User I/O pin (bank 1) |
| Pin G2 | I/O β User I/O pin (bank 1) |
| Pin G3 | I/O β User I/O pin (bank 1) |
| Pin G4 | TMS β JTAG mode select |
| Pin G5 | TDI β JTAG data in |
| Pin G6 | I/O β User I/O pin (bank 2) |
| Pin G7 | I/O β User I/O pin (bank 2) |
| Pin G8 | I/O β User I/O pin (bank 2) |
| Pin G9 | I/O β User I/O pin (bank 2) |
| Pin G10 | I/O β User I/O pin (bank 2) |
| Pin H1 | I/O β User I/O pin (bank 1) |
| Pin H2 | I/O β User I/O pin (bank 1) |
| Pin H3 | I/O β User I/O pin (bank 1) |
| Pin H4 | nCONFIG β Configuration control (active-low) |
| Pin H5 | nCE β Chip enable (active-low) |
| Pin H6 | I/O β User I/O pin (bank 2) |
| Pin H7 | I/O β User I/O pin (bank 2) |
| Pin H8 | I/O β User I/O pin (bank 2) |
| Pin H9 | I/O β User I/O pin (bank 2) |
| Pin H10 | I/O β User I/O pin (bank 2) |
| Pin J1 | I/O β User I/O pin (bank 1) |
| Pin J2 | GND β Ground |
| Pin J3 | I/O β User I/O pin (bank 1) |
| Pin J4 | I/O β User I/O pin (bank 1) |
| Pin J5 | I/O β User I/O pin (bank 1) |
| Pin J6 | I/O β User I/O pin (bank 2) |
| Pin J7 | I/O β User I/O pin (bank 2) |
| Pin J8 | VCCIO2 β I/O bank 2 supply voltage |
| Pin J9 | GND β Ground |
| Pin J10 | I/O β User I/O pin (bank 2) |
| Pin K1 | I/O β User I/O pin (bank 1) |
| Pin K2 | I/O β User I/O pin (bank 1) |
| Pin K3 | I/O β User I/O pin (bank 1) |
| Pin K4 | I/O β User I/O pin (bank 1) |
| Pin K5 | GND β Ground |
| Pin K6 | I/O β User I/O pin (bank 2) |
| Pin K7 | I/O β User I/O pin (bank 2) |
| Pin K8 | I/O β User I/O pin (bank 2) |
| Pin K9 | I/O β User I/O pin (bank 2) |
| Pin K10 | I/O β User I/O pin (bank 2) |
| Pin L1 | VCCIO1 β I/O bank 1 supply voltage |
| Pin L2 | I/O β User I/O pin (bank 1) |
| Pin L3 | I/O β User I/O pin (bank 1) |
| Pin L4 | GND β Ground |
| Pin L5 | I/O β User I/O pin (bank 1) |
| Pin L6 | I/O β User I/O pin (bank 2) |
| Pin L7 | VCCIO2 β I/O bank 2 supply voltage |
| Pin L8 | I/O β User I/O pin (bank 2) |
| Pin L9 | I/O β User I/O pin (bank 2) |
| Pin L10 | I/O β User I/O pin (bank 2) |
| Pin M1 | I/O β User I/O pin (bank 1) |
| Pin M2 | I/O β User I/O pin (bank 1) |
| Pin M3 | I/O β User I/O pin (bank 1) |
| Pin M4 | I/O β User I/O pin (bank 1) |
| Pin M5 | I/O β User I/O pin (bank 1) |
| Pin M6 | I/O β User I/O pin (bank 2) |
| Pin M7 | I/O β User I/O pin (bank 2) |
| Pin M8 | I/O β User I/O pin (bank 2) |
| Pin M9 | GND β Ground |
| Pin M10 | I/O β User I/O pin (bank 2) |
| Pin N1 | I/O β User I/O pin (bank 1) |
| Pin N2 | VCCIO1 β I/O bank 1 supply voltage |
| Pin N3 | I/O β User I/O pin (bank 1) |
| Pin N4 | I/O β User I/O pin (bank 1) |
| Pin N5 | GND β Ground |
| Pin N6 | I/O β User I/O pin (bank 2) |
| Pin N7 | I/O β User I/O pin (bank 2) |
| Pin N8 | I/O β User I/O pin (bank 2) |
| Pin N9 | I/O β User I/O pin (bank 2) |
| Pin N10 | I/O β User I/O pin (bank 2) |
| Pin P1 | I/O β User I/O pin (bank 1) |
| Pin P2 | I/O β User I/O pin (bank 1) |
| Pin P3 | I/O β User I/O pin (bank 1) |
| Pin P4 | I/O β User I/O pin (bank 1) |
| Pin P5 | I/O β User I/O pin (bank 1) |
| Pin P6 | I/O β User I/O pin (bank 2) |
| Pin P7 | I/O β User I/O pin (bank 2) |
| Pin P8 | I/O β User I/O pin (bank 2) |
| Pin P9 | I/O β User I/O pin (bank 2) |
| Pin P10 | I/O β User I/O pin (bank 2) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM240M100C5N is suitable for 7 applications: Microcontroller I/O Expansion and Bus Bridging, Industrial Address Decoding and Memory Interfacing, Power-Up Sequencing and Reset Distribution, Glue Logic Replacement for 74-Series TTL/CMOS, LED Display Drivers and Panel Controllers, Communication Interface Bridging (UART/SPI/I2C Glue Logic), Embedded State Machine and Custom Peripherals.
Microcontroller I/O Expansion and Bus Bridging
The EPM240M100C5N fits microcontroller I/O expansion because its 80 user I/Os and 4.7 ns tPD let it translate between 3.3 V MCU buses and 1.8 V/2.5 V peripheral logic with deterministic timing. With 192 macrocells, designers can implement custom parallel-to-SPI bridges, GPIO expanders, and address-latch circuits without software overhead. Multi-voltage I/O support (1.5/1.8/2.5/3.3 V) eliminates external level shifters, simplifying PCB layout for mixed-domain industrial designs.
Recommended
Industrial Address Decoding and Memory Interfacing
The EPM240M100C5N suits address-decoding applications because its 4.7 ns propagation delay keeps chip-select generation within a single clock cycle at 100 MHz+ bus speeds. With 192 macrocells, engineers can implement multiple decode windows, wait-state generators, and bank-switching logic for SRAM, NOR Flash, and peripheral overlays. Non-volatile Flash-based configuration means no boot PROM and instant-on decoding at power-up, critical for deterministic industrial controller boot.
Recommended
Power-Up Sequencing and Reset Distribution
The EPM240M100C5N works well for multi-rail power sequencing because its instant-on Flash configuration executes logic at the first clock edge without external boot memory. With 192 macrocells, designers can build cascaded delay timers, voltage-rail monitors, and watchdog reset distribution for systems with 5+ independent supply rails. The 1.8 V core and wide I/O voltage range let it interface directly to PMBus controllers and supervisor ICs without level translation.
Recommended
Glue Logic Replacement for 74-Series TTL/CMOS
The EPM240M100C5N replaces dozens of discrete 74LS, 74HC, and 74AHC glue-logic ICs because 192 macrocells can implement many standard functions in a single 6 x 6 mm package. With 4.7 ns tPD, it matches 74F-series speed while reducing PCB area, BOM count, and stock-keeping complexity. Instant-on Flash configuration means no boot delay, and JTAG programming allows in-system rework without hot-air desoldering.
Recommended
LED Display Drivers and Panel Controllers
The EPM240M100C5N drives multiplexed LED panels and small TFT displays because its 80 user I/Os provide enough channels for 8:1 to 16:1 multiplexed row/column scanning without external drivers. With 192 macrocells, PWM dimming, blanking control, and brightness correction can all be implemented in hardware with 4.7 ns response, eliminating software jitter. Multi-voltage I/O lets it drive both 3.3 V logic-level LED drivers and 5 V common-anode displays directly.
Recommended
Communication Interface Bridging (UART/SPI/I2C Glue Logic)
The EPM240M100C5N bridges incompatible communication interfaces because its 192 macrocells can host custom UART-to-SPI, SPI-to-I2C, and parallel-to-LVDS converters with deterministic timing. With 4.7 ns tPD, it handles up to ~50 MHz parallel bus rates without timing closure issues, and 80 I/Os accommodate multiple concurrent channels. Non-volatile Flash configuration allows field updates via JTAG, simplifying protocol revision management across product variants.
Recommended
Embedded State Machine and Custom Peripherals
The EPM240M100C5N implements complex Mealy/Moore state machines and custom peripherals offloading MCU resources because its deterministic 4.7 ns tPD and parallel macrocell architecture execute state logic in zero software cycles. With 192 macrocells, designers can build timing-critical peripherals (motor-control PWM, encoder quadrature decoders, custom stepper pulse generators) that would otherwise consume MCU interrupt bandwidth. On-chip 8 Kbit user Flash stores configuration parameters and calibration constants.
Recommended
Recommended Products Summary
Engineering reference data for EPM240M100C5N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM240M100C4N | EPM240ZM100C6N | EPM240ZM68C7N | EPM240T100C5N | EPM240GM100C5N | EPM240F100C5N |
|---|---|---|---|---|---|---|---|
| Package | 100-ball MBGA (6 x 6 mm) | 100-ball MBGA (6 x 6 mm) - same | 100-ball MBGA (6 x 6 mm) - same | 68-ball MBGA - different | 100-pin TQFP - different | 100-ball MBGA (6 x 6 mm) - same | 100-pin FBGA - same ball count, finer pitch |
| Brand | Intel | Intel - same brand | Intel - same brand | Intel - same brand | Intel - same brand | Intel - same brand | Intel - same brand |
| Macrocells | 192 | 192 | 192 | 192 | 192 | 192 | 192 |
| Speed Grade (tPD) | 4.7 ns (-5) | <4 ns (-4, +20% speed) | ~6 ns (-6, -20% speed) | ~7 ns (-7, -30% speed) | 4.7 ns (-5, identical) | 4.7 ns (-5, identical) | 4.7 ns (-5, identical) |
| User I/Os | 80 | 80 | 80 | ~52 (reduced for 68-ball package) | 80 | 80 | 80 |
| Logic Elements | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
| Operating Temperature | -40 C to +125 C (industrial) | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
| Configuration Memory | On-chip Flash (non-volatile) | On-chip Flash | On-chip Flash | On-chip Flash | On-chip Flash | On-chip Flash | On-chip Flash |
| Unit Price (qty 1, USD) | 8.20 | ~9.50 | ~7.80 | ~6.50 | ~8.50 | ~8.20 | ~8.60 |
Key Differentiators
- Highest speed-grade variant in 100-ball MBGA package (vs EPM240ZM100C6N)
- Largest I/O count in MAX II family at 80 user I/Os (vs EPM240ZM68C7N)
- Direct Quartus II/Prime tool support with mature IP library (vs EPM240T100C5N)
Design Notes
The 100-ball MBGA package uses 0.5 mm ball pitch on a 6 x 6 mm substrate. Per IPC-7351 and Intel MAX II design guidelines, use 0.27 mm solder mask openings, NSMD (non-solder mask defined) pads, and a 4-6 layer stack-up with continuous ground planes beneath the device. Via-in-pad is NOT recommended; use dog-bone fan-out to inner layers. Microstrip impedance should be 50 ohm single-ended for high-speed signals.
The EPM240M100C5N requires a clean 1.8 V core supply (VCCINT) decoupled with 0.1 uF and 10 uF ceramic capacitors placed within 5 mm of each VCCINT pin. Each I/O bank has its own VCCIO supply (VCCIO1, VCCIO2, etc.) which can be set independently to 1.5 V, 1.8 V, 2.5 V, or 3.3 V. Decouple each VCCIO with 0.1 uF plus 4.7 uF bulk; place capacitors as close as possible to the supply balls to minimize inductive ringing on logic-level transitions.
Do NOT use 4-wire JTAG when the device is in user mode unless nCONFIG is held low; this can cause unintended reconfiguration. For multi-device JTAG chains, ensure TMS and TCK are properly buffered because the MAX II JTAG pins have limited drive strength. For in-system programming, always include 10 kohm pull-ups on nCONFIG and nCE to prevent spurious configuration during power-up transients.
The 100-ball MBGA package has lead inductance of approximately 0.5 nH per ball, which combined with package capacitance (~1.5 pF) creates resonances in the 800 MHz to 1.5 GHz range. For signals above 100 MHz, use series damping resistors (22-33 ohm) at the driver to flatten impedance discontinuities. Simulate with the MAX II IBIS model (available from Intel) before finalizing PCB layout.
The 100-ball MBGA package has typical theta-JA of 36 C/W with standard JEDEC test board (still air). Under typical CPLD workloads (10-15 MHz internal frequency, 30% I/O toggling), self-heating is negligible (<1 C rise). For continuous high-I/O-throughput designs (>50 MHz toggle rates on >40 outputs), allocate at least 4 thermal vias under the center thermal ball array to spread heat to inner ground planes. The junction-to-ambient thermal resistance can drop to ~25 C/W with proper via stitching.
Compliance Information
RoHS compliant per Altera (now Intel) product page and DigiKey listing. Lead-free MBGA package. Not AEC-Q100 qualified - this is an industrial/consumer-grade CPLD, not automotive. Halogen-free status not explicitly stated in available data.
