EPM240ZM100C7N - MAX II Z CPLD 192MC 7.5ns 100-MBGA | Altera/Intel
MPN: EPM240ZM100C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.2278 | $9.23 |
| 10 | $8.3 | $83.00 |
| 100 | $7.4 | $740.00 |
| 500 | $6.7 | $3,350.00 |
| 1,000 | $6.1 | $6,100.00 |
Drop-in alternatives for EPM240ZM100C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM240ZM100C6N
✅ Drop-In✓ In Stock
$7.1 / Unit
View Datasheet →EPM240ZM100C8N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPM240GM100C5N
✅ Drop-In✓ In Stock
$4.75 / Unit
View Datasheet →EPM240F100C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$5.2 / Unit
View Datasheet →EPM570ZM100C7N
✅ Drop-In📋 Reference alternative (not in catalog)
EPM240ZM100C7N Maximum Ratings & Electrical Characteristics
| Family | MAX II Z |
| Series | MAX II |
| Logic Elements | 240 |
| Macrocells | 192 |
| Pin-to-Pin Logic Delay (tPD) | 7.5 ns |
| User I/Os | 80 |
| User Flash Memory (UFM) | 8 Kbits |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Package | 100-MBGA (Micro FineLine BGA), 6 x 6 mm |
| Configuration Memory | On-chip non-volatile flash |
| Process Technology | 0.18 µm 6-layer-metal flash |
| JTAG Support | IEEE 1149.1 (programming + boundary-scan) |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Mounting Type | Surface Mount (BGA) |
| Lead-Free / RoHS | Compliant per datasheet |
EPM240ZM100C7N 100-mbga (micro fineline bga), 6 x 6 mm Pin Configuration Guide
Complete pinout information for EPM240ZM100C7N (100-mbga (micro fineline bga), 6 x 6 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM240ZM100C7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM240ZM100C7N is suitable for 6 applications: Microprocessor Address Decoding and Bus Interfacing, Power-Up and Power-Down Sequencing, Industrial Glue Logic and Factory Automation, Low-Power Portable and Battery-Backed Devices, LED Display Multiplexing and Refresh Control, I/O Expansion and Peripheral Bridging.
Microprocessor Address Decoding and Bus Interfacing
The EPM240ZM100C7N's 7.5 ns pin-to-pin delay and 80 user I/Os make it well suited to decode external memory and peripheral address lines in 8/16/32-bit microcontroller or microprocessor systems. With 240 logic elements the device comfortably holds wide-chip-select decoders for SRAM, Flash, and peripheral banks while keeping propagation delay below one clock cycle at 50 MHz. The on-chip flash configuration ensures instant-on decoding without boot-PROM overhead. Place the CPLD close to the MCU address bus to minimize trace-induced skew and use MultiVolt I/O banks (1.8 V/2.5 V/3.3 V) to interface directly with the MCU without external level shifters. Pair with EPM1270T144C5N when more LE headroom is needed.
Recommended
Power-Up and Power-Down Sequencing
The EPM240ZM100C7N is widely used to sequence multiple voltage rails in FPGA, SoC, and ASIC-based boards where specific turn-on/off orders are mandatory. Its instant-on non-volatile flash means the sequencing logic is active the moment VCCINT ramps, eliminating the boot-race condition seen with MCU-based sequencers. Each of the 80 I/Os can directly drive a MOSFET gate or enable pin through MultiVolt bank voltage selection, supporting 1.8 V, 2.5 V, and 3.3 V loads from a single device. Sequencing delays are set in hardware look-up tables, making them deterministic and immune to firmware bugs. Combine with EPM2210F256C5N for systems with more than 8 sequenced rails.
Recommended
Industrial Glue Logic and Factory Automation
Factory automation boards require deterministic parallel logic to bridge sensor buses, motor-control ICs, and PLC backplanes, where the EPM240ZM100C7N's 7.5 ns tPD and 80 I/Os are well matched. The instant-on non-volatile flash survives brown-outs and noisy industrial supplies without re-programming, and the commercial 0 °C to +85 °C operating range covers most factory-floor environments. The MultiVolt I/O architecture lets a single CPLD connect to 24 V tolerant inputs through external resistor dividers and drive 3.3 V logic outputs in the same design. Pair with EPM570T100C5N when board area allows a TQFP and a higher logic budget is needed.
Recommended
Low-Power Portable and Battery-Backed Devices
The MAX II Z sub-family is engineered for ultra-low static power consumption, making the EPM240ZM100C7N ideal for battery-backed and energy-harvesting products that must idle for long periods. Typical standby current below 2 mA at 1.8 V core allows the CPLD to monitor a wake-up signal without draining the source, while instant-on flash configuration eliminates the multi-millisecond boot delay of MCU-based supervisors. The 8 Kbit UFM block stores calibration constants and serial numbers, replacing an external EEPROM in many designs. Combine with EPM1270F256I5N when a larger UFM and more I/Os are required for handheld instrumentation.
Recommended
LED Display Multiplexing and Refresh Control
The EPM240ZM100C7N's combination of 80 I/Os and 7.5 ns timing is well suited to driving multiplexed seven-segment, dot-matrix, and RGB-LED panels without any firmware overhead. Each row/column driver can be assigned to a dedicated MultiVolt I/O bank so 3.3 V and 5 V LED segments can be driven directly. The deterministic timing prevents the row-flicker artifacts that occur when MCU interrupts jitter the refresh rate, and the on-chip UFM can store lookup-table font data. Pair with EPM570ZM100C7N for larger RGB panels that exceed 240-LE capacity.
Recommended
I/O Expansion and Peripheral Bridging
When an MCU or SoC runs out of GPIO pins, the EPM240ZM100C7N can serve as a low-latency I/O expander that translates SPI, I2C, or parallel commands into wider parallel bus actions. The CPLD's 240 logic elements hold small state machines and shift registers while the 80 I/Os fan out into multiple peripheral enables, chip selects, and status LEDs. The instant-on behavior means expanded peripherals are available immediately at power-up, before the host MCU finishes its own boot. Combine with EPM1270T144C5N when 80 I/Os is insufficient for the target peripheral count.
Recommended
Recommended Products Summary
Engineering reference data for EPM240ZM100C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM240ZM100C6N | EPM240ZM100C8N | EPM240GM100C5N | EPM240F100C5N | EPM570ZM100C7N |
|---|---|---|---|---|---|---|
| Package | 100-MBGA (6 x 6 mm) | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family / Sub-family | MAX II Z (zero-power) | MAX II Z | MAX II Z | MAX II G | MAX II G | MAX II Z |
| Logic Elements | 240 | 240 | 240 | 240 | 240 | 570 |
| Macrocells | 192 | 192 | 192 | 192 | 192 | 440 |
| Pin-to-Pin Delay (tPD) | 7.5 ns | 8.5 ns | 7.5 ns | 5.0 ns | 5.0 ns | 7.5 ns |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V | 1.8 V | 3.3 V | 3.3 V | 1.8 V |
| User I/Os | 80 | 80 | 80 | 80 | 80 | 76 |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Static Power Profile | Ultra-low (MAX II Z) | Ultra-low | Ultra-low | Standard | Standard | Ultra-low |
Key Differentiators
- Lowest-power MAX II sub-family for battery designs (vs EPM240GM100C5N)
- 7.5 ns speed grade balance of timing and cost (vs EPM240ZM100C6N)
- Pin-compatible density scaling within MAX II family (vs EPM570ZM100C7N)
Design Notes
The MAX II Z sub-family is optimized for ultra-low static power at 1.8 V VCCINT; ensure the regulator supplying VCCINT is rated for at most 50 mV dropout so the device remains in its low-power regime during battery operation. Decouple VCCINT with a 1 µF X7R ceramic within 5 mm of the BGA and add a 0.1 µF parallel cap for high-frequency noise. VCCIO banks should each have their own 0.1 µF + 1 µF decoupling pair, because bank-to-bank voltage differences (e.g. 1.8 V + 3.3 V) cannot share a single decoupling capacitor without leakage.
The 100-MBGA Micro FineLine BGA has 0.5 mm pitch and 6 x 6 mm body. Use a 4-layer PCB with continuous ground plane directly under the BGA to provide low-impedance return paths for the 80 I/Os. Vias-in-pad (VIP) with filled-and-capped plating are recommended to maximize escape routing density on inner layers. Keep all high-speed outputs (clocks, fast memory interfaces) on the outer layer for short stubs, and route MultiVolt bank VCCIO rails as wide traces or small power pours to avoid IR drop on heavily loaded banks.
Do not mix 3.3 V and 1.5 V signals within the same VCCIO bank - each I/O bank shares a single VCCIO rail, so voltage mixing forces a redesign into two banks. The JTAG TCK pin has no internal pull-up; if boundary-scan is unused, leave the JTAG chain intact or add a 10 kΩ pull-up on TCK to prevent spurious configuration attempts. Do not apply VCCIO before VCCINT, because I/O cells powered before the core can latch incorrect states. Finally, when migrating designs from EPM240T100 (TQFP) to EPM240ZM100 (MBGA), verify the pinout translation table in the MAX II handbook - the TQFP and MBGA pin numbers do NOT align 1:1 even though both are 100-pin.
Program the device with the JTAG chain in a known order if multiple MAX II devices are cascaded; the Quartus II/Prime programmer auto-detects the chain when BSDL files are loaded. Use a USB-Blaster or ByteBlaster-II cable rather than legacy ByteBlaster MV for reliable 1.8 V programming. Place the JTAG header within 50 mm of the device to avoid signal-integrity issues on TCK/TMS/TDO/TDI.
Compliance Information
RoHS and lead-free per Altera/Intel MAX II Device Handbook and current distributor listings. MAX II Z is NOT AEC-Q100 qualified; for automotive designs use MAX 10 family instead.
