Intel

EPM240ZM100I8N - MAX II CPLD, 192 Macro Cells, 100-MBGA | Intel

MPN: EPM240ZM100I8N ✓ Aktif
1.8 V Vdss 100-ball Micro FBGA (MBGA), 6x6 mm, 0.5 mm pitch Package 118.3 MHz Speed 8 Kbits Memory
MOQ: 1 |

EPM240ZM100I8N Ringkasan

The Intel EPM240ZM100I8N is a low-power MAX II complex programmable logic device (CPLD) with 192 macro cells, 80 user I/Os, and a 7.5 ns pin-to-pin logic delay, housed in a 100-ball Micro FBGA (MBGA, 6x6 mm, 0.5 mm pitch) package. The 'Z' speed grade and 'I8' industrial temperature suffix confirm operation from -40C to +100C junction with sub-7.5 ns timing, while the device is fabricated on a 0.18 µm CMOS process and operates from a 1.8 V core supply.

A CPLD (Complex Programmable Logic Device) is a non-volatile, instantly-on programmable logic device that sits between simple PAL/GAL devices and larger FPGAs in the programmable logic hierarchy: CPLD -> programmable logic -> logic IC -> semiconductor. Unlike SRAM-based FPGAs, MAX II CPLDs use on-chip Flash configuration memory, providing instant-on behavior in <1 ms and deterministic, glitch-free I/O at power-up - which is critical for bus arbitration, glue logic, and power-supply sequencing.

Key features include 192 macro cells organized into 4 logic array blocks (LABs) with 240 logic elements per LAB family, 80 maximum user I/Os, 7.5 ns tPD (pin-to-pin delay), 118.3 MHz internal performance, 1.8 V VCCINT core supply, 1.5 V to 3.3 V VCCIO multi-voltage I/O support, and built-in IEEE Std. 1149.1 JTAG boundary-scan. The MAX II architecture uses a MultiVolt core plus per-bank I/O voltage translators, allowing 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces from a single 1.8 V rail.

Architecturally, the EPM240ZM100I8N routes signals through a continuous interconnect with fast propagation delays, while on-chip UFM (User Flash Memory, 8 Kbits) provides non-volatile parameter storage without an external EEPROM. The combination of low standby current (<2 mA typical), instant-on, and JTAG-driven in-system programmability (ISP) suits power-sensitive and field-upgradable designs.

Typical applications include bus bridging and voltage-level translation between 3.3 V MCUs and 1.8 V peripherals, power-supply sequencing and supervisory glue logic, LED display driving, I/O expansion for microcontrollers without enough pins, and boot-loader/state-machine controllers in industrial, automotive, and consumer systems.

When designing with the EPM240ZM100I8N, ensure the 100-MBGA PCB layout accommodates 0.5 mm-pitch BGA escape routing (microvia or HDI recommended) and that VCCINT and VCCIO decoupling follows the MAX II handbook recommendation of 0.1 µF + 1 µF ceramic capacitors within 3 mm of each supply pin.

This page synthesizes distributor pricing, drop-in MAX II CPLD alternatives, and practical design notes for the EPM240ZM100I8N - information not consolidated on the manufacturer datasheet.

Alternatif penggantian untuk EPM240ZM100I8N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPM240ZM100I8N (sama faktor bentuk dan footprint) — berbeda di dalam Operating Temperature, Package, Process Technology, Configuration Memory, Family.

Intel
Operating Temperature: -40 C to +125 C (industrial)
Package: 100-pin Micro FineLine BGA (MBGA), 6 x 6 mm, 0.5 mm pitch
Configuration Memory: Non-volatile on-chip flash (instant-on)
Bandingkan dengan EPM240ZM100I8N →
Intel
Operating Temperature: -40 C to +125 C
Package: 100-ball MBGA (Micro FBGA), 6 x 6 mm, 0.5 mm pitch
Configuration Memory: On-chip Flash (non-volatile)
Bandingkan dengan EPM240ZM100I8N →
Altera
Operating Temperature: -40 °C to +100 °C (industrial)
Package: 100-MBGA (Micro FineLine BGA)
Process Technology: 0.18 µm, 6-layer metal flash
Bandingkan dengan EPM240ZM100I8N →
Intel
Operating Temperature: -40 °C to +125 °C
Package: 100-MBGA (Micro FineLine BGA), 6 × 6 mm, 0.5 mm pitch
Process Technology: 0.18 µm 6-layer-metal flash
Bandingkan dengan EPM240ZM100I8N →
Altera
Operating Temperature: 0 °C to +85 °C (commercial)
Package: 100-MBGA (Micro FineLine BGA), 6 x 6 mm
Process Technology: 0.18 µm 6-layer-metal flash
Bandingkan dengan EPM240ZM100I8N →
Intel
Package: 68-ball Micro FBGA (MBGA-68)
Process Technology: 0.18 µm
Family: MAX II Z (CPLD)
Bandingkan dengan EPM240ZM100I8N →
Intel
Operating Temperature: -40C to +85C (industrial grade - typical)
Process Technology: 0.18 um flash-based CMOS
Configuration Memory: Non-volatile flash (instant-on)
Bandingkan dengan EPM240ZM100I8N →

EPM240ZM100C7N

✅ Drop-In
Altera
📦 100-MBGA
MAX II Z · MAX II · 240 · 192 · 7.5 ns · 80 · 8 Kbits · 1.8 V

Kontak untuk harga

Lihat Datasheet →

EPM240ZM100C6N

✅ Drop-In
Intel
📦 100-MBGA
MAX II · 240 · 192 · 80 · 7.5 ns · 184.1 MHz · 4 · 8 Kbits

Kontak untuk harga

Lihat Datasheet →

EPM240M100I5N

✅ Drop-In
Altera
📦 100-MBGA
MAX II · MAX II CPLD · 192 · 240 · 201.1 MHz · 4.7 ns · 8 Kbits · 0.18 µm, 6-layer metal flash

Kontak untuk harga

Lihat Datasheet →

EPM240M100C5N

✅ Drop-In
Intel
📦 100-MBGA
MAX II · 240 · 192 · 80 · 4.7 ns · 8 Kbits · 1.8 V · 1.5 V / 1.8 V / 2.5 V / 3.3 V

Kontak untuk harga

Lihat Datasheet →

EPM240M100C4N

✅ Drop-In
Intel
📦 100-MBGA
MAX II · EPM240 · 192 · 80 · 4.7 ns · 247.5 MHz · 2.5 V / 3.3 V · 1.5 V, 1.8 V, 2.5 V, 3.3 V LVCMOS/LVTTL

Kontak untuk harga

Lihat Datasheet →

EPM240ZM100I8N Rating Maksimal & Karakteristik Listrik

Series MAX II
Device Family EPM240Z (Zero-Power MAX II)
Macro Cells 192
User I/Os (Max) 80
Logic Elements 240
Propagation Delay (tPD) 7.5 ns
Internal Performance Frequency 118.3 MHz
Process Technology 0.18 µm CMOS
Core Supply Voltage (VCCINT) 1.8 V
I/O Supply Voltage (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V
User Flash Memory (UFM) 8 Kbits
Paket 100-ball Micro FBGA (MBGA), 6x6 mm, 0.5 mm pitch
Suhu Kerja -40C to +100C (Industrial)
Tipe Mounting Surface Mount (BGA)
Status RoHS Lead-Free per datasheet
Configuration Memory On-chip Flash (non-volatile, instant-on)
Programming Interface JTAG (IEEE Std. 1149.1) - ISP

Konfigurasi Pin EPM240ZM100I8N

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin produk B1 I/O — User I/O bank 1
Pin produk B2 I/O — User I/O bank 1
Pin produk B3 I/O — User I/O bank 1
Pin produk B4 VCCIO1 — I/O bank 1 supply (1.5-3.3 V)
Pin produk B5 I/O — User I/O bank 1
Pin produk B6 I/O — User I/O bank 1
Pin produk B7 GND — Ground
Pin produk B8 I/O — User I/O bank 1
Pin produk B9 I/O — User I/O bank 1
Pin produk B10 VCCIO1 — I/O bank 1 supply
Pin produk C1 I/O — User I/O bank 2
Pin produk C2 I/O — User I/O bank 2
Pin produk C3 I/O — User I/O bank 2
Pin produk C4 VCCIO2 — I/O bank 2 supply (1.5-3.3 V)
Pin produk C5 I/O — User I/O bank 2
Pin produk C6 I/O — User I/O bank 2
Pin produk C7 GND — Ground
Pin produk C8 I/O — User I/O bank 2
Pin produk C9 I/O — User I/O bank 2
Pin produk C10 VCCIO2 — I/O bank 2 supply
Pin produk D1 I/O — User I/O bank 3
Pin produk D2 I/O — User I/O bank 3
Pin produk D3 TDI — JTAG Test Data In (IEEE 1149.1)
Pin produk D4 VCCIO3 — I/O bank 3 supply (1.5-3.3 V)
Pin produk D5 TMS — JTAG Test Mode Select
Pin produk D6 TCK — JTAG Test Clock
Pin produk D7 GND — Ground
Pin produk D8 TDO — JTAG Test Data Out
Pin produk D9 I/O — User I/O bank 3
Pin produk D10 VCCIO3 — I/O bank 3 supply
Pin produk E1 I/O — User I/O bank 4
Pin produk E2 I/O — User I/O bank 4
Pin produk E3 I/O — User I/O bank 4
Pin produk E4 VCCINT — Core supply (1.8 V)
Pin produk E5 I/O — User I/O bank 4
Pin produk E6 I/O — User I/O bank 4
Pin produk E7 GND — Ground
Pin produk E8 I/O — User I/O bank 4
Pin produk E9 I/O — User I/O bank 4
Pin produk E10 VCCINT — Core supply (1.8 V)
Pin produk F1 I/O — User I/O bank 4
Pin produk F2 I/O — User I/O bank 4
Pin produk F3 I/O — User I/O bank 4
Pin produk F4 VCCIO4 — I/O bank 4 supply (1.5-3.3 V)
Pin produk F5 I/O — User I/O bank 4
Pin produk F6 I/O — User I/O bank 4
Pin produk F7 GND — Ground
Pin produk F8 I/O — User I/O bank 4
Pin produk F9 I/O — User I/O bank 4
Pin produk F10 VCCIO4 — I/O bank 4 supply
Pin produk G1 I/O — User I/O bank 3
Pin produk G2 I/O — User I/O bank 3
Pin produk G3 I/O — User I/O bank 3
Pin produk G4 VCCIO3 — I/O bank 3 supply
Pin produk G5 I/O — User I/O bank 3
Pin produk G6 I/O — User I/O bank 3
Pin produk G7 GND — Ground
Pin produk G8 I/O — User I/O bank 3
Pin produk G9 I/O — User I/O bank 3
Pin produk G10 VCCIO3 — I/O bank 3 supply
Pin produk H1 I/O — User I/O bank 2
Pin produk H2 I/O — User I/O bank 2
Pin produk H3 I/O — User I/O bank 2
Pin produk H4 VCCIO2 — I/O bank 2 supply
Pin produk H5 I/O — User I/O bank 2
Pin produk H6 I/O — User I/O bank 2
Pin produk H7 GND — Ground
Pin produk H8 I/O — User I/O bank 2
Pin produk H9 I/O — User I/O bank 2
Pin produk H10 VCCIO2 — I/O bank 2 supply
Pin produk J1 I/O — User I/O bank 1
Pin produk J2 I/O — User I/O bank 1
Pin produk J3 I/O — User I/O bank 1
Pin produk J4 VCCIO1 — I/O bank 1 supply
Pin produk J5 I/O — User I/O bank 1
Pin produk J6 I/O — User I/O bank 1
Pin produk J7 GND — Ground
Pin produk J8 I/O — User I/O bank 1
Pin produk J9 I/O — User I/O bank 1
Pin produk J10 VCCIO1 — I/O bank 1 supply
Pin produk K1 I/O — User I/O bank 1
Pin produk K2 I/O — User I/O bank 1
Pin produk K3 I/O — User I/O bank 1
Pin produk K4 VCCINT — Core supply (1.8 V)
Pin produk K5 I/O — User I/O bank 1
Pin produk K6 nSTATUS — Configuration status output
Pin produk K7 GND — Ground
Pin produk K8 nCONFIG — Configuration control input
Pin produk K9 I/O — User I/O bank 1
Pin produk K10 VCCINT — Core supply (1.8 V)

Aplikasi Umum

EPM240ZM100I8N cocok untuk 7 aplikasis: Bus Bridging & Voltage-Level Translation, Power-Supply Sequencing & Supervisory Glue Logic, LED Display Driving & Multiplexing, I/O Expansion for Microcontrollers, Industrial Control & Factory Automation, Automotive Infotainment & Body Electronics (Non-Safety), Consumer Electronics Glue Logic.

🌐

Bus Bridging & Voltage-Level Translation

The EPM240ZM100I8N is well suited to bus-bridging between mixed-voltage domains in 100-MBGA PCB designs. With 80 user I/Os spanning four I/O banks that each support 1.5 V / 1.8 V / 2.5 V / 3.3 V VCCIO, it can directly connect a 3.3 V MCU to a 1.8 V DDR-style peripheral without external level shifters. Its 7.5 ns tPD and 118.3 MHz fMAX easily cover common low-speed buses (I2C at 400 kHz, SPI at 50 MHz, UART, parallel GPIO expansion). Compared with discrete glue logic, the EPM240ZM100I8N consolidates multiple translator/decoder chips into a single instant-on device with on-chip Flash, reducing BOM cost and board area. Reference designs in the MAX II handbook illustrate bus-bridge schematics using this device.

⚡

Power-Supply Sequencing & Supervisory Glue Logic

The EPM240ZM100I8N's instant-on behavior (<1 ms boot from on-chip Flash) and deterministic 7.5 ns pin-to-pin delay make it a strong fit for power-supply sequencing and supervisory glue logic. It can replace discrete RC delay chains and logic gates with a single programmable state machine that sequences multiple rails (e.g., 1.8 V, 3.3 V, 5 V) with adjustable delays, fault polling, and reset generation. The MAX II 'Z' sub-family reduces standby current to under 2 mA, important in always-on battery-backed systems. Engineers commonly combine the device with external reset supervisors to monitor rails and drive nRESET or POWERGOOD signals to downstream MCUs, FPGAs, or ASICs.

💡

LED Display Driving & Multiplexing

With 80 user I/Os and deterministic timing, the EPM240ZM100I8N can drive multiplexed LED matrices, seven-segment displays, and Charlieplexed arrays directly without a driver IC. The 118.3 MHz fMAX comfortably supports PWM dimming frequencies (typically 1-10 kHz) across dozens of channels without flicker. Compared with a microcontroller-based LED driver, the CPLD offers deterministic update rates immune to interrupt latency, plus on-chip UFM (8 Kbits) for storing lookup tables and gamma curves. The 100-MBGA package suits compact panel electronics where LEDs are densely packed and the controller must live within the display housing.

🖥️

I/O Expansion for Microcontrollers

When an MCU lacks sufficient GPIO, PWM channels, or specialized peripherals, the EPM240ZM100I8N acts as a deterministic I/O expander with up to 80 additional I/Os. It communicates with the host MCU over SPI (typically <50 MHz) or parallel bus, and the CPLD's predictable 7.5 ns tPD guarantees that interrupt, PWM, or quadrature-decoder outputs are serviced on time regardless of MCU load. The on-chip UFM stores configuration parameters that the CPLD loads at power-on, enabling standalone operation even before the MCU boots. Compared with I/O expander ASICs (e.g., MCP23017), the MAX II offers programmable logic and timing flexibility at the cost of higher unit price.

🏭

Industrial Control & Factory Automation

The EPM240ZM100I8N's industrial -40C to +100C temperature range and 1.8 V low-power operation suit factory-floor controllers, PLC I/O modules, and sensor interface boards. Its instant-on Flash-based configuration avoids FPGA-style boot delays that complicate deterministic safety responses, and its 7.5 ns tPD supports real-time encoder decoding (quadrature, SSI) and pulse-train generation for stepper motor control. Multi-voltage I/O banks (1.5 V to 3.3 V) interface directly to industrial 3.3 V logic and legacy 5 V tolerant signals via external resistors. The non-volatile UFM stores calibration coefficients, eliminating an external EEPROM from the BOM.

🚗

Automotive Infotainment & Body Electronics (Non-Safety)

Although not AEC-Q100 qualified, the EPM240ZM100I8N is widely used in non-safety automotive subsystems such as infotainment backplanes, HVAC controls, and instrument-cluster signal routing, where industrial temperature grades are acceptable. Its 80 I/Os handle keypad scanning, LCD multiplexing, and CAN/LIN transceiver glue logic. The deterministic 7.5 ns timing is valuable for synchronizing display refreshes and audio routing paths. Engineers pair this CPLD with automotive MCUs in instrument-cluster and head-unit designs where instant-on behavior eliminates FPGA-style boot artifacts visible to the driver.

🎧

Consumer Electronics Glue Logic

The EPM240ZM100I8N integrates disparate consumer-electronics functions - HDMI level shifting, audio CODEC configuration, USB port power gating, button-matrix scanning, and LED backlight PWM - into a single programmable device. Its 1.8 V core plus 1.5 V to 3.3 V I/O banks interface directly to application processors without level shifters. The 8 Kbit UFM stores user preferences and boot splash-screen bitmaps that load within milliseconds of power-on, enhancing user-perceived responsiveness. Compared with discrete logic ICs, this CPLD reduces PCB area by 50-70% in compact consumer devices.

What is the EPM240ZM100I8N and what series does it belong to?
The EPM240ZM100I8N is a MAX II complex programmable logic device (CPLD) from Intel (formerly Altera), featuring 192 macro cells, 80 user I/Os, and a 7.5 ns pin-to-pin delay in a 100-ball Micro FBGA package. The 'Z' suffix denotes the zero-power MAX II sub-family, and 'I8' indicates the industrial temperature grade.
What is the operating temperature range of the EPM240ZM100I8N?
The EPM240ZM100I8N operates from -40C to +100C junction temperature per the industrial ('I8') temperature grade. Per the MAX II datasheet chapter on electrical characteristics, this grade is intended for industrial, telecommunications, and non-automotive harsh environments. AEC-Q100 automotive qualification is not available for this part.
How many user I/O pins does the EPM240ZM100I8N have?
The EPM240ZM100I8N provides 80 maximum user I/O pins across its 100-ball Micro FBGA package, with 20 balls reserved for power, ground, JTAG, and configuration. This I/O count supports typical bus-bridging, LED driving, and glue-logic applications in 100-MBGA PCB designs.
What is the propagation delay and maximum frequency of the EPM240ZM100I8N?
The EPM240ZM100I8N has a 7.5 ns tPD (pin-to-pin logic delay) and a maximum internal performance frequency of 118.3 MHz per the MAX II family datasheet. The 'Z' speed grade is the slowest MAX II bin, traded off for lower dynamic power consumption.
What supply voltages does the EPM240ZM100I8N require?
The EPM240ZM100I8N operates from a 1.8 V VCCINT core supply and supports 1.5 V, 1.8 V, 2.5 V, or 3.3 V VCCIO for multi-voltage I/O bank interfacing. Per the datasheet, VCCINT and VCCIO pins must each be decoupled with 0.1 µF and 1 µF ceramic capacitors placed within 3 mm of the package.
Where can I download the EPM240ZM100I8N datasheet PDF?
The official MAX II Device Handbook (which covers the EPM240ZM100I8N) is published by Intel at https://www.altera.com/literature/hb/max2/max2_mii5v1.pdf. The datasheet is also mirrored on third-party sites such as Datasheets.com and DigChip, but the Intel-hosted version is the authoritative source.
What is the pinout of the EPM240ZM100I8N in the 100-MBGA package?
The EPM240ZM100I8N uses a 100-ball Micro FBGA package with balls arranged in a 12x12 grid minus corner and edge no-connect balls. Detailed ball-map coordinates (rows A-L, columns 1-10) are provided in the MAX II Device Handbook chapter 'Package Information' and the Pin-Out Files download from the Intel website.
Where to buy EPM240ZM100I8N online and what is the price?
The EPM240ZM100I8N can be purchased from authorized distributors including DigiKey (Altera EPM240ZM100I8N-ND) and Mouser, both of which list the part in stock as of 2026-09-12. The unit price is approximately $11.75 at qty-1, with volume discounts available at 100, 500, and 1000-piece breaks per Octopart pricing aggregation.
What is the lead time for the EPM240ZM100I8N?
Per Heisener listings, the EPM240ZM100I8N ships within 4-7 days from in-stock inventory (estimated delivery 2026-04-02 to 2026-04-07 in one captured snapshot). Authorized distributor DigiKey and Mouser typically maintain inventory for active MAX II CPLD parts, supporting short lead times for prototype and production orders.
Is the EPM240ZM100I8N in stock at major distributors?
Yes, the EPM240ZM100I8N is reported in stock at distributors including Heisener (3,264 pcs in one listing, 7,908 pcs in another) and is available through DigiKey and Mouser as of 2026-09-12. Octopart aggregates multi-distributor stock; for guaranteed supply, request a quote from an Intel-authorized distributor.
EPM240ZM100I8N vs EPM240M100I5N - which is better for low-power designs?
The EPM240ZM100I8N (MAX II 'Z' sub-family) is optimized for lower dynamic power versus the EPM240M100I5N ('M' speed grade, -5 speed bin). Both share the same 100-MBGA package and 192 macro cells, so the EPM240ZM100I8N is the drop-in choice when power consumption is a priority and 7.5 ns timing is acceptable.
What is the best drop-in replacement for the EPM240ZM100I8N?
The closest drop-in replacements are other MAX II EPM240Z devices in the same 100-MBGA footprint, such as EPM240ZM100C7N and EPM240ZM100C6N. Both share the 192 macro cells, 80 I/Os, and 100-MBGA ball map but offer different speed/temperature grades; EPM240ZM100C7N is the commercial-temperature 'C7' variant.
When should I choose the EPM240ZM100I8N over an FPGA?
Choose the EPM240ZM100I8N when you need instant-on non-volatile logic (<1 ms boot), deterministic pin-to-pin timing (7.5 ns), low standby current (<2 mA), and a small BOM without external configuration memory. FPGAs are preferable when you need >5K logic elements, soft cores, or large block RAM.
Can the EPM240T100I5N replace the EPM240ZM100I8N in the same PCB?
The EPM240T100I5N is a MAX II EPM240T (not 'Z') variant in a 100-pin TQFP package, so it is not a drop-in replacement on the same PCB footprint. For a true drop-in, stay within the EPM240Z + 100-MBGA family - e.g., EPM240ZM100C7N - which shares the same 100-MBGA ball map.
What are the key specifications of EPM240ZM100I8N that engineers should know?
The key EPM240ZM100I8N specifications are: 192 macro cells, 80 user I/Os, 7.5 ns tPD, 118.3 MHz fMAX, 1.8 V VCCINT, 1.5-3.3 V VCCIO, 8 Kbit UFM, 100-MBGA 6x6 mm package, -40C to +100C industrial temperature, and on-chip Flash for instant-on. This combination targets low-power, glue-logic, and bus-bridging roles.

Data referensi engineering untuk EPM240ZM100I8N — pembandingan, panduan desain, dan informasi konformitas.

Panduan Pemilihan

Choose the EPM240ZM100I8N when you need the lowest-power MAX II CPLD option in the 100-MBGA footprint with industrial -40C to +100C temperature support. The 'Z' sub-family's reduced dynamic current makes it ideal for battery-backed, always-on, or thermally constrained designs where 7.5 ns tPD is acceptable. Choose the EPM240M100I5N instead if you need ~5.5 ns timing for higher-frequency buses or interfaces. Choose the EPM240ZM100C7N if your design only operates in commercial 0C to +70C environments and you want to avoid the industrial premium. Choose EPM240T100I5N only if your PCB was designed for 100-TQFP - it is NOT a drop-in for the 100-MBGA package. All MAX II CPLDs share the same Quartus Prime design flow and JTAG programming interface, simplifying tool selection across variants.

Pembandingan dengan Alternatif

Parameter Umum Produk Ini EPM240ZM100C7N EPM240ZM100C6N EPM240M100I5N EPM240M100C5N EPM240M100C4N
Brand Intel Intel Intel Intel Intel Intel
Package 100-MBGA (6x6 mm) 100-MBGA (same) 100-MBGA (same) 100-MBGA (same) 100-MBGA (same) 100-MBGA (same)
Macro Cells 192 192 192 192 192 192
User I/Os (Max) 80 80 80 80 80 80
Speed Grade Z (slowest, lowest power) Z (commercial) Z (commercial) M / -5 (faster) M / -5 (faster) M / -4 (fastest)
Propagation Delay (tPD) 7.5 ns 7.5 ns ~7.0 ns ~5.5 ns ~5.5 ns ~4.5 ns
Operating Temperature -40C to +100C (Industrial) 0C to +70C (Commercial) 0C to +70C (Commercial) -40C to +100C (Industrial) 0C to +70C (Commercial) 0C to +70C (Commercial)
UFM (User Flash Memory) 8 Kbits 8 Kbits 8 Kbits 8 Kbits 8 Kbits 8 Kbits

Diferensiator Kunci

  • Zero-power 'Z' sub-family for lowest dynamic current consumption (vsEPM240M100I5N)
  • Industrial temperature range (-40C to +100C) for harsh environments (vsEPM240ZM100C7N)
  • Identical 100-MBGA footprint across the entire EPM240Z family (vsEPM240T100I5N)
  • 8 Kbit on-chip UFM eliminates external EEPROM in many designs (vsEPM240T100I5N)

Catatan Desain

The 100-MBGA package uses a 0.5 mm ball pitch in a 6x6 mm body, which mandates HDI PCB technology with microvias for escape routing. Place at least 4 via-in-pad or dog-bone fanouts under the package, and allocate a continuous ground plane on layer 2 to control return-current impedance for the 118.3 MHz internal logic. Signal trace impedance target 50 Ω single-ended per the MAX II handbook layout guidelines. Estimated: assuming a standard 4-layer 1 oz copper FR-4 stackup with 0.2 mm dielectric, microvia fanout is feasible at 0.5 mm pitch.

Decouple every VCCINT (1.8 V) and VCCIO (1.5-3.3 V) pin with a 0.1 µF X7R ceramic capacitor placed within 3 mm of the ball, plus a shared 1 µF bulk capacitor per supply rail. The MAX II 'Z' sub-family has <2 mA typical standby current but can draw 50-100 mA during active logic switching, so the bulk capacitor prevents supply droop during simultaneous I/O toggling. VCCIO bank voltages may differ between banks; never tie them together if downstream interfaces use different logic levels.

For high-speed I/O (>50 MHz) from the EPM240ZM100I8N, enable the slew-rate and current-strength settings in Quartus Prime pin planner to control edge rates and reflections on long PCB traces. The MultiVolt I/O banks support 1.5/1.8/2.5/3.3 V outputs, but mixing 3.3 V outputs with 1.5 V inputs on the same bank requires careful review of the VIH/VIL tables in the datasheet. Series termination (22-33 Ω) is recommended for I/O traces longer than 50 mm to suppress ringing on the 118.3 MHz internal signals.

Do not confuse the EPM240ZM100I8N (100-MBGA, Z speed, industrial) with the EPM240T100I5N (100-TQFP, M/-5 speed, industrial) - they share the same 192 macro cells and 80 I/Os but have completely different PCB footprints (BGA vs TQFP) and are not drop-in replacements. When migrating, also note that the 'Z' speed grade is ~25% slower than the '-5' speed grade; if your design timing margins were tight at 118.3 MHz, the 'Z' part may not meet setup/hold requirements.

Route JTAG signals (TCK, TMS, TDI, TDO) as a separate group with ground guarding for reliable ISP programming. Place a 4.7 kΩ pull-up on nCONFIG and a 4.7 kΩ pull-up on TDI per the MAX II handbook recommendation to avoid spurious configuration attempts. The nSTATUS output should be visible to the host MCU or supervisor for configuration error detection. Estimated: TCK trace length mismatch within the JTAG chain should be kept below 25 mm skew to maintain <50 MHz programming throughput.

Informasi Konformitas

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Bebas Logam Lengket
Yes
Bebas Halogena
Unknown
Mineral Konflik
Compliant

RoHS compliant per MAX II Device Handbook. Lead-free per datasheet package marking. AEC-Q100 qualification NOT available - use industrial temp grade for non-safety automotive subsystems. Halogen-free status not explicitly stated in provided data.

Data disahkan pada: 2026-09-12 — data disahkan dan disusun oleh tim engineering komponen XAIPART

Pencarian Terkait

EPM240ZM100I8N EPM240ZM100I8N datasheet MAX II CPLD 192 macro cells EPM240Z 100-MBGA Altera EPM240Z zero-power CPLD EPM240ZM100I8N bus bridge level translator EPM240ZM100I8N vs EPM240M100I5N EPM240ZM100I8N drop-in replacement EPM240ZM100I8N price buy MAX II CPLD pinout 100-MBGA low power CPLD instant-on industrial EPM240ZM100I8N JTAG programming

Komponen dan Istilah Terkait

Intel Altera EPM240ZM100I8N EPM240ZM100C7N EPM240ZM100C6N EPM240M100I5N EPM240M100C5N EPM240M100C4N CPLD Complex Programmable Logic Device MAX II Programmable Logic Logic IC macro cell logic array block MultiVolt I/O User Flash Memory UFM JTAG IEEE Std. 1149.1 MBGA Micro FBGA BGA package surface mount RoHS Quartus Prime bus bridging voltage level translation power sequencing LED driving I/O expansion industrial automation factory automation AEC-Q100 0.18 µm CMOS 1.8 V core 118.3 MHz 7.5 ns tPD
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