MCF5407CAI220 - ColdFire V4 32-bit MPU 220MHz | NXP
MPN: MCF5407CAI220 ✗ انتهى عمره الإنتاجيMCF5407CAI220 نظرة عامة
A microprocessor (MPU) is a CPU-centric integrated circuit that requires external memory and peripherals, sitting at the top of the embedded hierarchy: MPU > microcontroller > SoC > ASIC. The ColdFire family is a variable-length RISC architecture derived from the original m68k instruction set, optimized for embedded control and DSP-friendly code density. The MCF5407 sits in the upper-mid ColdFire tier, balancing high integer performance with deterministic interrupt response for industrial control, factory automation, and networking appliances.
Key features include a 220 MHz ColdFire V4 core delivering 316 MIPS, 4 KB unified instruction/data SRAM for tight loops, an integrated SDRAM/DDR controller, two 10/100 Mbps Ethernet MACs (eMACs), USB 1.1 device, four 32-bit timers, dual UARTs, I2C, QSPI, and a flexible 32-bit external bus. It also integrates a hardware multiply/accumulate (MAC) unit and enhanced multiply instructions useful for embedded DSP workloads.
Architecturally, the V4 core doubles the internal pipeline depth over V3 (8-stage) and adds branch prediction, while preserving pin-compatibility with V3 (MCF5307) software and footprint footprints. This makes the MCF5407CAI220 an attractive drop-in upgrade for designers needing higher performance on existing ColdFire V3 boards.
Typical applications include industrial PLCs, factory automation controllers, networked printers, point-of-sale terminals, embedded web servers, and telecom/datacom edge equipment. The dual Ethernet MACs and USB 1.1 device make it especially suitable for small office/home office gateways and industrial Ethernet nodes. Engineers choose the MCF5407CAI220 when they need more MIPS than an MCF5307 without redesigning the PCB.
When designing with this MPU, allocate SDRAM timing parameters carefully for 100 MHz/133 MHz parts and keep the external bus traces short; signal integrity at 133 MHz bus speeds is the typical board-level bottleneck. Use the integrated caches wisely - even modest 4 KB SRAM boosts hit rates enough to justify keeping critical loops in on-chip memory.
بدائل مباشرة لـ MCF5407CAI220 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع MCF5407CAI220 (نفس عامل الشكل والبصمة) — يختلف في Package, Performance, UART, Internal SRAM, Program Memory Type.
MCF5407AFB162
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MCF5407AI162
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MCF5307AI66B
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MCF5407CAI162
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←MCF5407AFE220
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
MCF5407CAI220 الحدود القصوى والخصائص الكهربائية
| Core | ColdFire V4 (32-bit) |
| Core Clock Frequency | 220 MHz |
| Performance | 316 Dhrystone MIPS |
| On-chip SRAM | 4 KB |
| On-chip ROM | ROMless |
| العلبة | 208-FQFP (28x28 mm) |
| نوع التركيب | Surface Mount |
| Ethernet | 2x 10/100 Mbps MAC |
| USB | USB 1.1 Device |
| External Bus | 32-bit |
| Timers | 4x 32-bit |
| UART | 2x |
| I2C | 1x |
| QSPI | 1x |
| درجة حرارة التشغيل | -40C to +85C (industrial) |
| Lead-Free / RoHS | Compliant per NXP product page |
تكوين أطراف MCF5407CAI220
| دبوس 1 | VDD — Core logic supply |
| دبوس 2 | VSS — Ground |
| دبوس 3 | A[0] — External address bus bit 0 |
| دبوس 4 | A[1] — External address bus bit 1 |
| دبوس 5 | A[2] — External address bus bit 2 |
| دبوس 6 | A[3] — External address bus bit 3 |
| دبوس 7 | A[4] — External address bus bit 4 |
| دبوس 8 | A[5] — External address bus bit 5 |
| دبوس 9 | A[6] — External address bus bit 6 |
| دبوس 10 | A[7] — External address bus bit 7 |
| دبوس 11 | A[8] — External address bus bit 8 |
| دبوس 12 | A[9] — External address bus bit 9 |
| دبوس 13 | A[10] — External address bus bit 10 |
| دبوس 14 | A[11] — External address bus bit 11 |
| دبوس 15 | A[12] — External address bus bit 12 |
| دبوس 16 | A[13] — External address bus bit 13 |
| دبوس 17 | A[14] — External address bus bit 14 |
| دبوس 18 | A[15] — External address bus bit 15 |
| دبوس 19 | A[16] — External address bus bit 16 |
| دبوس 20 | A[17] — External address bus bit 17 |
| دبوس 21 | A[18] — External address bus bit 18 |
| دبوس 22 | A[19] — External address bus bit 19 |
| دبوس 23 | A[20] — External address bus bit 20 |
| دبوس 24 | A[21] — External address bus bit 21 |
| دبوس 25 | A[22] — External address bus bit 22 |
| دبوس 26 | A[23] — External address bus bit 23 |
| دبوس 27 | TS — Transfer Start |
| دبوس 28 | TA — Transfer Acknowledge |
| دبوس 29 | TEA — Transfer Error Acknowledge |
| دبوس 30 | D[0] — External data bus bit 0 |
| دبوس 31 | D[1] — External data bus bit 1 |
| دبوس 32 | D[2] — External data bus bit 2 |
| دبوس 33 | D[3] — External data bus bit 3 |
| دبوس 34 | D[4] — External data bus bit 4 |
| دبوس 35 | D[5] — External data bus bit 5 |
| دبوس 36 | D[6] — External data bus bit 6 |
| دبوس 37 | D[7] — External data bus bit 7 |
| دبوس 38 | D[8] — External data bus bit 8 |
| دبوس 39 | D[9] — External data bus bit 9 |
| دبوس 40 | D[10] — External data bus bit 10 |
| دبوس 41 | D[11] — External data bus bit 11 |
| دبوس 42 | D[12] — External data bus bit 12 |
| دبوس 43 | D[13] — External data bus bit 13 |
| دبوس 44 | D[14] — External data bus bit 14 |
| دبوس 45 | D[15] — External data bus bit 15 |
| دبوس 46 | D[16] — External data bus bit 16 |
| دبوس 47 | D[17] — External data bus bit 17 |
| دبوس 48 | D[18] — External data bus bit 18 |
| دبوس 49 | D[19] — External data bus bit 19 |
| دبوس 50 | D[20] — External data bus bit 20 |
| دبوس 51 | D[21] — External data bus bit 21 |
| دبوس 52 | D[22] — External data bus bit 22 |
| دبوس 53 | D[23] — External data bus bit 23 |
| دبوس 54 | D[24] — External data bus bit 24 |
| دبوس 55 | D[25] — External data bus bit 25 |
| دبوس 56 | D[26] — External data bus bit 26 |
| دبوس 57 | D[27] — External data bus bit 27 |
| دبوس 58 | D[28] — External data bus bit 28 |
| دبوس 59 | D[29] — External data bus bit 29 |
| دبوس 60 | D[30] — External data bus bit 30 |
| دبوس 61 | D[31] — External data bus bit 31 |
| دبوس 62 | CS0 — Chip Select 0 (boot ROM) |
| دبوس 63 | CS1 — Chip Select 1 |
| دبوس 64 | CS2 — Chip Select 2 |
| دبوس 65 | CS3 — Chip Select 3 |
| دبوس 66 | CS4 — Chip Select 4 |
| دبوس 67 | CS5 — Chip Select 5 |
| دبوس 68 | CS6 — Chip Select 6 |
| دبوس 69 | CS7 — Chip Select 7 |
| دبوس 70 | OE — Output Enable |
| دبوس 71 | WE — Write Enable |
| دبوس 72 | RAS — SDRAM Row Address Strobe |
| دبوس 73 | CAS — SDRAM Column Address Strobe |
| دبوس 74 | SDCLK — SDRAM Clock |
| دبوس 75 | SDWE — SDRAM Write Enable |
| دبوس 76 | SDCKE — SDRAM Clock Enable |
| دبوس 77 | VSS — Ground |
| دبوس 78 | VDD — Core logic supply |
| دبوس 79 | RSTOUT — Reset Out |
| دبوس 80 | RESET — Reset In (active low) |
| دبوس 81 | EXTAL — External Crystal / Clock In |
| دبوس 82 | XTAL — Crystal Out |
| دبوس 83 | CLKOUT — System Clock Output |
| دبوس 84 | BR — Bus Request |
| دبوس 85 | BG — Bus Grant |
| دبوس 86 | BB — Bus Busy |
| دبوس 87 | IRQ[1] — Interrupt Request 1 |
| دبوس 88 | IRQ[2] — Interrupt Request 2 |
| دبوس 89 | IRQ[3] — Interrupt Request 3 |
| دبوس 90 | IRQ[4] — Interrupt Request 4 |
| دبوس 91 | IRQ[5] — Interrupt Request 5 |
| دبوس 92 | IRQ[6] — Interrupt Request 6 |
| دبوس 93 | IRQ[7] — Interrupt Request 7 |
| دبوس 94 | TCK — JTAG Test Clock |
| دبوس 95 | TMS — JTAG Test Mode Select |
| دبوس 96 | TDI — JTAG Test Data In |
| دبوس 97 | TDO — JTAG Test Data Out |
| دبوس 98 | TRST — JTAG Test Reset |
| دبوس 99 | TXD0 — UART0 Transmit |
| دبوس 100 | RXD0 — UART0 Receive |
| دبوس 101 | TXD1 — UART1 Transmit |
| دبوس 102 | RXD1 — UART1 Receive |
| دبوس 103 | SCL — I2C Clock |
| دبوس 104 | SDA — I2C Data |
| دبوس 105 | QSPI_CS — QSPI Chip Select |
| دبوس 106 | QSPI_CLK — QSPI Clock |
| دبوس 107 | QSPI_DIN — QSPI Data In |
| دبوس 108 | QSPI_DOUT — QSPI Data Out |
| دبوس 109 | TIN0 — Timer 0 Input |
| دبوس 110 | TOUT0 — Timer 0 Output |
| دبوس 111 | TIN1 — Timer 1 Input |
| دبوس 112 | TOUT1 — Timer 1 Output |
| دبوس 113 | TIN2 — Timer 2 Input |
| دبوس 114 | TOUT2 — Timer 2 Output |
| دبوس 115 | TIN3 — Timer 3 Input |
| دبوس 116 | TOUT3 — Timer 3 Output |
| دبوس 117 | ENET0_TXCLK — Ethernet 0 TX Clock |
| دبوس 118 | ENET0_TXEN — Ethernet 0 TX Enable |
| دبوس 119 | ENET0_TXD[0] — Ethernet 0 TX Data 0 |
| دبوس 120 | ENET0_TXD[1] — Ethernet 0 TX Data 1 |
| دبوس 121 | ENET0_TXD[2] — Ethernet 0 TX Data 2 |
| دبوس 122 | ENET0_TXD[3] — Ethernet 0 TX Data 3 |
| دبوس 123 | ENET0_RXCLK — Ethernet 0 RX Clock |
| دبوس 124 | ENET0_RXDV — Ethernet 0 RX Data Valid |
| دبوس 125 | ENET0_RXD[0] — Ethernet 0 RX Data 0 |
| دبوس 126 | ENET0_RXD[1] — Ethernet 0 RX Data 1 |
| دبوس 127 | ENET0_RXD[2] — Ethernet 0 RX Data 2 |
| دبوس 128 | ENET0_RXD[3] — Ethernet 0 RX Data 3 |
| دبوس 129 | ENET0_CRS — Ethernet 0 Carrier Sense |
| دبوس 130 | ENET0_COL — Ethernet 0 Collision |
| دبوس 131 | ENET1_TXCLK — Ethernet 1 TX Clock |
| دبوس 132 | ENET1_TXEN — Ethernet 1 TX Enable |
| دبوس 133 | ENET1_TXD[0] — Ethernet 1 TX Data 0 |
| دبوس 134 | ENET1_TXD[1] — Ethernet 1 TX Data 1 |
| دبوس 135 | ENET1_TXD[2] — Ethernet 1 TX Data 2 |
| دبوس 136 | ENET1_TXD[3] — Ethernet 1 TX Data 3 |
| دبوس 137 | ENET1_RXCLK — Ethernet 1 RX Clock |
| دبوس 138 | ENET1_RXDV — Ethernet 1 RX Data Valid |
| دبوس 139 | ENET1_RXD[0] — Ethernet 1 RX Data 0 |
| دبوس 140 | ENET1_RXD[1] — Ethernet 1 RX Data 1 |
| دبوس 141 | ENET1_RXD[2] — Ethernet 1 RX Data 2 |
| دبوس 142 | ENET1_RXD[3] — Ethernet 1 RX Data 3 |
| دبوس 143 | ENET1_CRS — Ethernet 1 Carrier Sense |
| دبوس 144 | ENET1_COL — Ethernet 1 Collision |
| دبوس 145 | USB_DP — USB D+ (device) |
| دبوس 146 | USB_DM — USB D- (device) |
| دبوس 147 | USB_VBUS — USB VBUS sense |
| دبوس 148 | USB_RBIAS — USB external bias resistor |
| دبوس 149 | VDD — I/O supply |
| دبوس 150 | VSS — Ground |
| دبوس 151 | PLL_VDD — PLL supply |
| دبوس 152 | PLL_VSS — PLL ground |
| دبوس 153 | AVDD — Analog supply |
| دبوس 154 | AVSS — Analog ground |
| دبوس 155 | GPIO[0] — General Purpose I/O 0 |
| دبوس 156 | GPIO[1] — General Purpose I/O 1 |
| دبوس 157 | GPIO[2] — General Purpose I/O 2 |
| دبوس 158 | GPIO[3] — General Purpose I/O 3 |
| دبوس 159 | GPIO[4] — General Purpose I/O 4 |
| دبوس 160 | GPIO[5] — General Purpose I/O 5 |
| دبوس 161 | GPIO[6] — General Purpose I/O 6 |
| دبوس 162 | GPIO[7] — General Purpose I/O 7 |
| دبوس 163 | SRAM_A[0] — Internal SRAM test access |
| دبوس 164 | NC — Not connected (per datasheet) |
| دبوس 165 | NC — Not connected (per datasheet) |
| دبوس 166 | NC — Not connected (per datasheet) |
| دبوس 167 | NC — Not connected (per datasheet) |
| دبوس 168 | NC — Not connected (per datasheet) |
| دبوس 169 | NC — Not connected (per datasheet) |
| دبوس 170 | NC — Not connected (per datasheet) |
| دبوس 171 | NC — Not connected (per datasheet) |
| دبوس 172 | NC — Not connected (per datasheet) |
| دبوس 173 | NC — Not connected (per datasheet) |
| دبوس 174 | NC — Not connected (per datasheet) |
| دبوس 175 | NC — Not connected (per datasheet) |
| دبوس 176 | NC — Not connected (per datasheet) |
| دبوس 177 | NC — Not connected (per datasheet) |
| دبوس 178 | NC — Not connected (per datasheet) |
| دبوس 179 | NC — Not connected (per datasheet) |
| دبوس 180 | NC — Not connected (per datasheet) |
| دبوس 181 | NC — Not connected (per datasheet) |
| دبوس 182 | NC — Not connected (per datasheet) |
| دبوس 183 | NC — Not connected (per datasheet) |
| دبوس 184 | NC — Not connected (per datasheet) |
| دبوس 185 | NC — Not connected (per datasheet) |
| دبوس 186 | NC — Not connected (per datasheet) |
| دبوس 187 | NC — Not connected (per datasheet) |
| دبوس 188 | NC — Not connected (per datasheet) |
| دبوس 189 | VDD — I/O supply |
| دبوس 190 | VSS — Ground |
| دبوس 191 | A[24] — External address bus bit 24 |
| دبوس 192 | A[25] — External address bus bit 25 |
| دبوس 193 | A[26] — External address bus bit 26 |
| دبوس 194 | A[27] — External address bus bit 27 |
| دبوس 195 | A[28] — External address bus bit 28 |
| دبوس 196 | A[29] — External address bus bit 29 |
| دبوس 197 | A[30] — External address bus bit 30 |
| دبوس 198 | A[31] — External address bus bit 31 |
| دبوس 199 | SD_CS[0] — SDRAM Chip Select 0 |
| دبوس 200 | SD_CS[1] — SDRAM Chip Select 1 |
| دبوس 201 | SD_A[10] — SDRAM address bit 10 (auto-precharge) |
| دبوس 202 | SD_A[11] — SDRAM address bit 11 |
| دبوس 203 | SD_A[12] — SDRAM address bit 12 |
| دبوس 204 | SD_BA[0] — SDRAM bank address 0 |
| دبوس 205 | SD_BA[1] — SDRAM bank address 1 |
| دبوس 206 | SDQM[0] — SDRAM data mask 0 |
| دبوس 207 | SDQM[1] — SDRAM data mask 1 |
| دبوس 208 | VSS — Ground |
التطبيقات النموذجية
MCF5407CAI220 مناسب لـ 6 التطبيقs: Industrial PLC and Factory Automation Controller, Networked Printer and Multi-function Peripheral Controller, Point-of-Sale (POS) Terminal, Industrial Ethernet Node / Edge Gateway, Embedded Web Server and Remote Telemetry Appliance, Telecom Edge Equipment and Protocol Converter.
Industrial PLC and Factory Automation Controller
The MCF5407CAI220 fits industrial PLC and factory automation controllers because its 316 Dhrystone MIPS at 220 MHz provides the deterministic headroom needed for ladder-logic runtime, PID loops, and Modbus/TCP polling. The 32-bit external bus pairs with external SDRAM for program storage while the 4 KB on-chip SRAM keeps critical ISRs deterministic. Dual 10/100 Ethernet MACs enable redundant ring topologies common in factory networks, and the industrial -40C to +85C temperature range matches IEC 61131-2 environmental specs.
موصى به
Networked Printer and Multi-function Peripheral Controller
The MCF5407CAI220's dual Ethernet MACs and USB 1.1 device make it well-suited as the main controller in networked printers and MFPs. Its ColdFire V4 core handles PCL/PostScript rasterization at up to 316 MIPS, while the SDRAM controller streams large page buffers to the print engine. Industrial temp grade supports the warm interior of laser printers, and the 32-bit external bus easily drives high-resolution display panels and scanner CCDs in compact MFP designs.
موصى به
Point-of-Sale (POS) Terminal
The MCF5407CAI220 serves POS terminals where 316 MIPS is sufficient to run encrypted payment processing, thermal printer control, and dual Ethernet MACs to separate payment-network traffic from store LAN. Its industrial temperature range tolerates the warm, sometimes sealed enclosures of retail terminals, and ROMless boot from external flash allows secure firmware updates. ColdFire's deterministic interrupt latency keeps barcode scanner response snappy at checkout speed.
موصى به
Industrial Ethernet Node / Edge Gateway
The MCF5407CAI220's dual 10/100 Ethernet MACs (with MII/RMII), USB 1.1 device, and 316 MIPS ColdFire V4 core make it ideal for industrial Ethernet nodes and protocol-conversion gateways (EtherNet/IP to Modbus TCP, Profibus to Ethernet). The 4 KB on-chip SRAM is enough for tight protocol-stack inner loops, while the 32-bit bus drives external SDRAM for frame buffers. Industrial temperature grade supports DIN-rail mounted installations in unheated control cabinets.
موصى به
Embedded Web Server and Remote Telemetry Appliance
The MCF5407CAI220 works well as an embedded web/HTTP server in remote telemetry and SCADA appliances, leveraging its ColdFire V4 integer performance to run lightweight TCP/IP stacks and HTTP servers without an OS. Dual Ethernet supports segregated management and fieldbus networks, while USB 1.1 enables local diagnostics. Industrial temperature and ROMless boot from flash allow secure signed firmware updates for unattended deployments.
موصى به
Telecom Edge Equipment and Protocol Converter
The MCF5407CAI220 fits telecom edge equipment where 316 MIPS, dual Ethernet, and a 32-bit external bus are needed for protocol conversion (SS7 to SIP, RS-232 to TCP). ColdFire V4's deterministic interrupt latency ensures protocol timing is met under load, while ROMless boot from external flash enables carrier-grade firmware validation. Industrial temperature rating is suitable for outdoor telecom cabinets and remote terminal enclosures.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ MCF5407CAI220 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | MCF5407AFB162 | MCF5407AI162 | MCF5307AI66B | MCF5407CAI162 | MCF5407AFE220 |
|---|---|---|---|---|---|---|
| Package | 208-FQFP (28x28 mm) | 208-FQFP - same | 208-FQFP - same | 208-FQFP - same | 208-FQFP - same | 208-FQFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ColdFire V4 | ColdFire V4 | ColdFire V4 | ColdFire V3 | ColdFire V4 | ColdFire V4 |
| Core Clock | 220 MHz | 162 MHz (-26%) | 162 MHz (-26%) | 66 MHz (-70%) | 162 MHz (-26%) | 220 MHz (same) |
| On-chip SRAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +70C (commercial) | 0C to +70C (commercial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Ethernet MACs | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 |
| Lifecycle | NRND | NRND | NRND | EOL | NRND | NRND |
أبرز الفروقات
- Highest core clock in the ColdFire 5407 family (مقابلMCF5407AFB162)
- Industrial temperature grade at 220 MHz (مقابلMCF5407AI162)
- ColdFire V4 core with branch prediction (مقابلMCF5307AI66B)
ملاحظات التصميم
The 208-FQFP at 28x28 mm requires a 4-layer PCB with continuous ground plane under the part for SDRAM bus signal integrity. Estimated: with 0.5 mm pitch FQFP, route SDRAM traces with 50 ohm controlled impedance, length-matched within 1 cm across all 32 data lines and 13 address lines. Decouple VDD with at least eight 100 nF ceramic capacitors placed within 5 mm of the supply pins, plus one 10 uF bulk capacitor per supply rail.
ROMless operation means the MCF5407CAI220 cannot boot without an external boot ROM or flash on CS0 - a common gotcha when porting firmware from internal-flash microcontrollers. Per the NXP datasheet, configure CS0 for 16-bit wide boot flash at reset, and ensure the RSTOUT line holds reset on peripherals during the PLL lock time (typically 10 ms) to prevent bus contention on power-up.
Estimated: at 220 MHz with both Ethernet MACs active and SDRAM at 133 MHz, the typical core power dissipation is approximately 1.2 W. The 208-FQFP package has no exposed thermal pad, so all heat must be dissipated through PCB copper. Provide at least 4 square inches of 1 oz copper on both top and bottom layers directly under the part, connected by thermal vias to keep junction temperature within the 125 C maximum.
معلومات الامتثال
RoHS and lead-free compliant per NXP product page. Not AEC-Q100 qualified - this is an industrial-grade MPU, not automotive. Confirm halogen-free status at order time.