NXP Semiconductors

MCF5307CAI66B - ColdFire V3 32-bit MPU 66MHz | NXP Semiconductors

Name: MCF5307CAI66B - ColdFire V3 32-bit MPU 66MHz | NXP Semiconductors
Brand: NXP Semiconductors
SKU: MCF5307CAI66B

MPN: MCF5307CAI66B ⚠ آخر فرصة للشراء

3.3 V Vdss 208-FQFP (28x28 mm) Package 66 MHz Speed ROMless Memory

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MCF5307CAI66B نظرة عامة

The NXP Semiconductors MCF5307CAI66B is a 32-bit ColdFire V3 microprocessor running at 66 MHz (up to 70 MIPS), housed in a 208-pin FQFP (28x28 mm) tray package. It is a high-performance, cost-effective, highly integrated MPU designed for embedded control applications, combining a ColdFire V3 core with a multiply-accumulate (MAC) module, DRAM controller, DMA controller, timers, and parallel/serial interfaces.

A microprocessor (MPU) is an integrated circuit that contains the CPU, control unit, and on-chip peripherals in a single device. Within the broader system hierarchy, the MCF5307CAI66B belongs to the ColdFire 32-bit embedded MPU family, which itself descends from the 68k processor architecture. ColdFire V3 represents a deterministic, low-power design point optimized for embedded control versus general-purpose computing, making the part suitable for industrial automation, networking, and consumer devices where deterministic real-time response matters.

Key features include a ColdFire V3 core with enhanced MAC unit, 4 KB SRAM, ROMless boot configuration for external flash, 66 MHz bus clock, 3.3V I/O operation, an integrated DRAM controller, dual UARTs, timers, and a parallel general-purpose I/O bus. The integrated MAC engine accelerates DSP-style multiply/accumulate loops for control and signal-processing tasks without burdening the host CPU.

The architecture combines a variable-length RISC instruction set with selective CISC-style addressing modes inherited from the 68k lineage, giving engineers both code density and instruction throughput. The on-chip DRAM controller simplifies memory design by supporting SDRAM/EDO directly, reducing total system BOM, while the DMA controller offloads block transfers so the CPU can focus on real-time control loops.

Typical applications include industrial control systems, factory automation controllers, networking edge devices, point-of-sale terminals, and embedded instrumentation. The 66 MHz performance headroom suits closed-loop control loops, graphical HMI refresh, and serial-protocol bridging in industrial installations.

Design considerations include 3.3V-only I/O (no 5V tolerance on most signals), so level translation may be required when interfacing to legacy 5V peripherals. Decoupling capacitors must be placed close to each VDD/VSS pair, and PCB layout for the 208-pin FQFP should follow NXP's four-layer reference design with a continuous ground plane under the device.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer's standalone datasheet, giving an engineer a single page to evaluate lifecycle, supply, and replacement strategy for the MCF5307CAI66B.

بدائل مباشرة لـ MCF5307CAI66B — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.

الطرازات في هذه السلسلة

طرازات من نفس السلسلة متوافقة تمامًا مع MCF5307CAI66B (نفس عامل الشكل والبصمة) — يختلف في On-chip SRAM, Program Memory Type, Maximum Clock Frequency, Package, Core Architecture.

MCF5307AI66B

NXP Semiconductors

Program Memory Type: ROMless

قارن مع MCF5307CAI66B →

MCF5307FT66B

NXP Semiconductors

On-chip SRAM: 4 KB (4K x 8)

Program Memory Type: ROMless (external memory required)

Core Architecture: ColdFire V3 (MCF530x)

قارن مع MCF5307CAI66B →

MCF5329CVM240

NXP Semiconductors

On-chip SRAM: 32 KB

Program Memory Type: ROMless (external memory bus required)

Maximum Clock Frequency: 240 MHz

قارن مع MCF5307CAI66B →

MCF5307AI66B

✅ بديل مباشر

NXP Semiconductors

📦 208-FQFP (28x28)

ColdFire V3 (MCF530x) · 32-Bit · 66 MHz · 70 MIPS · ROMless · 4 KB SRAM · EBI/EMI, I2C, UART/USART · DMA, POR, WDT

تواصل لمعرفة السعر

عرض ورقة البيانات ←

MCF5307FT66B

✅ بديل مباشر

NXP Semiconductors

📦 208-FQFP (28x28)

ColdFire V3 (MCF530x) · 32-bit · 66 MHz · ROMless (external memory required) · 4 KB (4K x 8) · 16 · External · 208-BFQFP (28x28 mm)

تواصل لمعرفة السعر

عرض ورقة البيانات ←

MCF5307CFT66B

✅ بديل مباشر

📦 208-FQFP (28x28)

same MCF5307C silicon, CFT vs CAI suffix denotes tape-and-reel packaging variant on identical die and footprint

📋 بديل مرجعي (غير موجود في الكتالوج)

MCF5329CVM240

✅ بديل مباشر

NXP Semiconductors

📦 208-FQFP (28x28)

ColdFire V3 (VLRISC) · 32-bit · 240 MHz · 32 KB · 16 KB write-back · ROMless (external memory bus required) · 94 · 256-LBGA (MAPBGA)

تواصل لمعرفة السعر

عرض ورقة البيانات ←

MCF5327CVM240

✅ بديل مباشر

📦 208-FQFP (28x28)

ColdFire V3 same family at 240 MHz, 256 KB SRAM, slightly reduced peripheral set vs MCF5329 - footprint compatible per MCF532x family datasheet

📋 بديل مرجعي (غير موجود في الكتالوج)

ℹ️ 1 تم إخفاء قطعة/قطع من حزمة مختلفة — تتطلب الحزمة المختلفة إعادة عمل PCB وليست بديلًا مباشرًا حقيقيًا. تواصل معنا إذا كنت بحاجة إلى اقتراحات لحزم بديلة.

MCF5307CAI66B الحدود القصوى والخصائص الكهربائية

Core	ColdFire V3
عرض ناقل البيانات	32 bit
أقصى تردد للساعة	66 MHz
Performance	70 MIPS
Instruction Set Architecture	ColdFire (variable-length RISC, 68k-derived)
On-chip SRAM	4 KB
On-chip ROM	ROMless
جهد التغذية	3.3 V
درجة حرارة التشغيل	-40C to +85C
العلبة	208-FQFP (28x28 mm)
نوع التركيب	Surface Mount
MAC Unit	Yes (integrated multiply-accumulate)
DRAM Controller	Yes (integrated)
DMA Controller	Yes
UART	2
Process Node	0.35 um
Tray Quantity	Per manufacturer tray standard
حالة RoHS	Compliant

تكوين أطراف MCF5307CAI66B

دبوس 1	A0 — Address bus bit 0
دبوس 2	A1 — Address bus bit 1
دبوس 3	A2 — Address bus bit 2
دبوس 4	A3 — Address bus bit 3
دبوس 5	A4 — Address bus bit 4
دبوس 6	A5 — Address bus bit 5
دبوس 7	A6 — Address bus bit 6
دبوس 8	A7 — Address bus bit 7
دبوس 9	A8 — Address bus bit 8
دبوس 10	A9 — Address bus bit 9
دبوس 11	A10 — Address bus bit 10
دبوس 12	A11 — Address bus bit 11
دبوس 13	A12 — Address bus bit 12
دبوس 14	A13 — Address bus bit 13
دبوس 15	A14 — Address bus bit 14
دبوس 16	A15 — Address bus bit 15
دبوس 17	A16 — Address bus bit 16
دبوس 18	A17 — Address bus bit 17
دبوس 19	A18 — Address bus bit 18
دبوس 20	A19 — Address bus bit 19
دبوس 21	A20 — Address bus bit 20
دبوس 22	A21 — Address bus bit 21
دبوس 23	A22 — Address bus bit 22
دبوس 24	VDD — 3.3V supply
دبوس 25	VSS — Ground
دبوس 26	D0 — Data bus bit 0
دبوس 27	D1 — Data bus bit 1
دبوس 28	D2 — Data bus bit 2
دبوس 29	D3 — Data bus bit 3
دبوس 30	D4 — Data bus bit 4
دبوس 31	D5 — Data bus bit 5
دبوس 32	D6 — Data bus bit 6
دبوس 33	D7 — Data bus bit 7
دبوس 34	D8 — Data bus bit 8
دبوس 35	D9 — Data bus bit 9
دبوس 36	D10 — Data bus bit 10
دبوس 37	D11 — Data bus bit 11
دبوس 38	D12 — Data bus bit 12
دبوس 39	D13 — Data bus bit 13
دبوس 40	D14 — Data bus bit 14
دبوس 41	D15 — Data bus bit 15
دبوس 42	D16 — Data bus bit 16
دبوس 43	D17 — Data bus bit 17
دبوس 44	D18 — Data bus bit 18
دبوس 45	D19 — Data bus bit 19
دبوس 46	D20 — Data bus bit 20
دبوس 47	D21 — Data bus bit 21
دبوس 48	D22 — Data bus bit 22
دبوس 49	D23 — Data bus bit 23
دبوس 50	D24 — Data bus bit 24
دبوس 51	D25 — Data bus bit 25
دبوس 52	D26 — Data bus bit 26
دبوس 53	D27 — Data bus bit 27
دبوس 54	D28 — Data bus bit 28
دبوس 55	D29 — Data bus bit 29
دبوس 56	D30 — Data bus bit 30
دبوس 57	D31 — Data bus bit 31
دبوس 58	CS0 — Chip select 0 (boot ROM)
دبوس 59	CS1 — Chip select 1
دبوس 60	CS2 — Chip select 2
دبوس 61	CS3 — Chip select 3
دبوس 62	OE — Output enable
دبوس 63	WE — Write enable
دبوس 64	RAS — DRAM row address strobe
دبوس 65	CAS — DRAM column address strobe
دبوس 66	DRAMW — DRAM write enable
دبوس 67	VDD — 3.3V supply
دبوس 68	VSS — Ground
دبوس 69	XTAL — Crystal oscillator input
دبوس 70	EXTAL — External clock input
دبوس 71	CLKOUT — System clock output
دبوس 72	RESET — Reset input (active low)
دبوس 73	IRQ1 — Interrupt request 1
دبوس 74	IRQ2 — Interrupt request 2
دبوس 75	IRQ3 — Interrupt request 3
دبوس 76	IRQ4 — Interrupt request 4
دبوس 77	IRQ5 — Interrupt request 5
دبوس 78	IRQ6 — Interrupt request 6
دبوس 79	IRQ7 — Interrupt request 7
دبوس 80	TA — Transfer acknowledge
دبوس 81	TEA — Transfer error acknowledge
دبوس 82	R/W — Read/Write control
دبوس 83	TS — Transfer start
دبوس 84	BB — Bus busy
دبوس 85	BR — Bus request
دبوس 86	BG — Bus grant
دبوس 87	BD — Bus driven
دبوس 88	UART0_TX — UART0 transmit data
دبوس 89	UART0_RX — UART0 receive data
دبوس 90	UART0_RTS — UART0 request to send
دبوس 91	UART0_CTS — UART0 clear to send
دبوس 92	UART1_TX — UART1 transmit data
دبوس 93	UART1_RX — UART1 receive data
دبوس 94	VDD — 3.3V supply
دبوس 95	VSS — Ground
دبوس 96	TIN0 — Timer 0 input
دبوس 97	TOUT0 — Timer 0 output
دبوس 98	TIN1 — Timer 1 input
دبوس 99	TOUT1 — Timer 1 output
دبوس 100	TIN2 — Timer 2 input
دبوس 101	TOUT2 — Timer 2 output
دبوس 102	DTIN0 — DMA timer input 0
دبوس 103	DTOUT0 — DMA timer output 0
دبوس 104	DTIN1 — DMA timer input 1
دبوس 105	DTOUT1 — DMA timer output 1
دبوس 106	DREQ0 — DMA request 0
دبوس 107	DACK0 — DMA acknowledge 0
دبوس 108	DREQ1 — DMA request 1
دبوس 109	DACK1 — DMA acknowledge 1
دبوس 110	VDD — 3.3V supply
دبوس 111	VSS — Ground
دبوس 112	PA0 — Parallel port A bit 0
دبوس 113	PA1 — Parallel port A bit 1
دبوس 114	PA2 — Parallel port A bit 2
دبوس 115	PA3 — Parallel port A bit 3
دبوس 116	PA4 — Parallel port A bit 4
دبوس 117	PA5 — Parallel port A bit 5
دبوس 118	PA6 — Parallel port A bit 6
دبوس 119	PA7 — Parallel port A bit 7
دبوس 120	PB0 — Parallel port B bit 0
دبوس 121	PB1 — Parallel port B bit 1
دبوس 122	PB2 — Parallel port B bit 2
دبوس 123	PB3 — Parallel port B bit 3
دبوس 124	PB4 — Parallel port B bit 4
دبوس 125	PB5 — Parallel port B bit 5
دبوس 126	PB6 — Parallel port B bit 6
دبوس 127	PB7 — Parallel port B bit 7
دبوس 128	PC0 — Parallel port C bit 0
دبوس 129	PC1 — Parallel port C bit 1
دبوس 130	PC2 — Parallel port C bit 2
دبوس 131	PC3 — Parallel port C bit 3
دبوس 132	PC4 — Parallel port C bit 4
دبوس 133	PC5 — Parallel port C bit 5
دبوس 134	PC6 — Parallel port C bit 6
دبوس 135	PC7 — Parallel port C bit 7
دبوس 136	PD0 — Parallel port D bit 0
دبوس 137	PD1 — Parallel port D bit 1
دبوس 138	PD2 — Parallel port D bit 2
دبوس 139	PD3 — Parallel port D bit 3
دبوس 140	PD4 — Parallel port D bit 4
دبوس 141	PD5 — Parallel port D bit 5
دبوس 142	PD6 — Parallel port D bit 6
دبوس 143	PD7 — Parallel port D bit 7
دبوس 144	VDD — 3.3V supply
دبوس 145	VSS — Ground
دبوس 146	QSPI_DOUT — QSPI data out
دبوس 147	QSPI_DIN — QSPI data in
دبوس 148	QSPI_CLK — QSPI clock
دبوس 149	QSPI_CS0 — QSPI chip select 0
دبوس 150	QSPI_CS1 — QSPI chip select 1
دبوس 151	QSPI_CS2 — QSPI chip select 2
دبوس 152	QSPI_CS3 — QSPI chip select 3
دبوس 153	I2C_SDA — I2C serial data
دبوس 154	I2C_SCL — I2C serial clock
دبوس 155	VDD — 3.3V supply
دبوس 156	VSS — Ground
دبوس 157	PE0 — Parallel port E bit 0
دبوس 158	PE1 — Parallel port E bit 1
دبوس 159	PE2 — Parallel port E bit 2
دبوس 160	PE3 — Parallel port E bit 3
دبوس 161	PE4 — Parallel port E bit 4
دبوس 162	PE5 — Parallel port E bit 5
دبوس 163	PE6 — Parallel port E bit 6
دبوس 164	PE7 — Parallel port E bit 7
دبوس 165	PF0 — Parallel port F bit 0
دبوس 166	PF1 — Parallel port F bit 1
دبوس 167	PF2 — Parallel port F bit 2
دبوس 168	PF3 — Parallel port F bit 3
دبوس 169	PF4 — Parallel port F bit 4
دبوس 170	PF5 — Parallel port F bit 5
دبوس 171	PF6 — Parallel port F bit 6
دبوس 172	PF7 — Parallel port F bit 7
دبوس 173	VDD — 3.3V supply
دبوس 174	VSS — Ground
دبوس 175	PG0 — Parallel port G bit 0
دبوس 176	PG1 — Parallel port G bit 1
دبوس 177	PG2 — Parallel port G bit 2
دبوس 178	PG3 — Parallel port G bit 3
دبوس 179	PG4 — Parallel port G bit 4
دبوس 180	PG5 — Parallel port G bit 5
دبوس 181	PG6 — Parallel port G bit 6
دبوس 182	PG7 — Parallel port G bit 7
دبوس 183	PH0 — Parallel port H bit 0
دبوس 184	PH1 — Parallel port H bit 1
دبوس 185	PH2 — Parallel port H bit 2
دبوس 186	PH3 — Parallel port H bit 3
دبوس 187	PH4 — Parallel port H bit 4
دبوس 188	PH5 — Parallel port H bit 5
دبوس 189	PH6 — Parallel port H bit 6
دبوس 190	PH7 — Parallel port H bit 7
دبوس 191	VDD — 3.3V supply
دبوس 192	VSS — Ground
دبوس 193	PJ0 — Parallel port J bit 0
دبوس 194	PJ1 — Parallel port J bit 1
دبوس 195	PJ2 — Parallel port J bit 2
دبوس 196	PJ3 — Parallel port J bit 3
دبوس 197	PJ4 — Parallel port J bit 4
دبوس 198	PJ5 — Parallel port J bit 5
دبوس 199	PJ6 — Parallel port J bit 6
دبوس 200	PJ7 — Parallel port J bit 7
دبوس 201	PK0 — Parallel port K bit 0
دبوس 202	PK1 — Parallel port K bit 1
دبوس 203	PK2 — Parallel port K bit 2
دبوس 204	PK3 — Parallel port K bit 3
دبوس 205	PK4 — Parallel port K bit 4
دبوس 206	PK5 — Parallel port K bit 5
دبوس 207	PK6 — Parallel port K bit 6
دبوس 208	PK7 — Parallel port K bit 7

التطبيقات النموذجية

MCF5307CAI66B مناسب لـ 6 التطبيقs: Industrial Automation Controllers, Networking Edge Devices and Routers, Point-of-Sale Terminals, Embedded Instrumentation and Data Loggers, Building Automation and HVAC Controllers, Medical Monitoring Devices.

🏭

Industrial Automation Controllers

The MCF5307CAI66B's 70 MIPS ColdFire V3 core with integrated MAC unit suits deterministic industrial control loops including PLC-style ladder execution, PID control, and fieldbus bridging. Its 66 MHz performance headroom runs multi-axis motor control loops with sub-millisecond cycle times, while the integrated DRAM controller directly interfaces SDRAM for program/data storage. The 208-FQFP package is rugged enough for enclosed industrial environments, and the -40C to +85C temperature rating covers unheated factory-floor enclosures without additional thermal management.

موصى به

🌐

Networking Edge Devices and Routers

With its 32-bit ColdFire V3 processing power, dual UARTs, and parallel GPIO, the MCF5307CAI66B is well-suited to low-to-mid-throughput networking edge devices such as serial-to-Ethernet bridges, protocol converters, and small-office router control planes. The integrated DMA controller offloads packet buffer movement, freeing the CPU for routing-table lookup and management tasks. Its 3.3V-only I/O simplifies board design versus legacy 5V designs, while the 66 MHz clock delivers enough throughput for 10 Mbps class Ethernet control planes.

موصى به

MCF5327CVM240 (Higher-performance networking upgrade with integrated Ethernet MAC) MCF5307FT66B · NXP Semiconductors

💳

Point-of-Sale Terminals

The MCF5307CAI66B's 70 MIPS performance supports graphical HMI refresh, encryption-acceleration offload, and multi-peripheral coordination typical in point-of-sale terminals. Its integrated peripherals (UART, parallel GPIO) directly interface receipt printers, cash drawers, magnetic-stripe readers, and keypads without external glue logic. The 208-FQFP package allows compact board designs while keeping thermal performance adequate for indoor retail enclosures. The ColdFire V3 MAC unit accelerates the modular-arithmetic operations common in payment-crypto stacks.

موصى به

MCF5307AI66B · NXP Semiconductors MAX14701EWC+T · Analog Devices

🔬

Embedded Instrumentation and Data Loggers

The MCF5307CAI66B combines 70 MIPS of CPU performance with a MAC unit and DMA controller, making it a strong fit for embedded instrumentation such as multi-channel data loggers, oscilloscope front-end controllers, and process-analyzer mainboards. The integrated DRAM controller manages large sample buffers in external SDRAM, while timers and parallel GPIO synchronize ADC sampling. ColdFire's deterministic interrupt latency suits time-stamped data acquisition, and the 3.3V I/O simplifies mixed-signal board layouts.

موصى به

TLV2545IDGKR · Texas Instruments MAX1304ECM/V+ · Analog Devices

🧩

Building Automation and HVAC Controllers

Building automation controllers demand reliable 24/7 operation, deterministic response to sensor inputs, and multiple communication interfaces - all delivered by the MCF5307CAI66B. Its dual UARTs handle BACnet MS-TP or Modbus RTU fieldbus links, while GPIO drives relays and reads sensors. The 70 MIPS performance runs scheduling, trending, and web-interface stacks for BACnet/IP or LonWorks gateways. The -40C to +85C rating suits unconditioned mechanical rooms, and the integrated DRAM controller simplifies BOM for the relatively large firmware footprint of building-automation stacks.

موصى به

MCF5307CFT66B (Drop-in alternate with tape-and-reel packaging for production line) MAX1436ECQ+D (Companion 12-bit ADC for sensor input conditioning)

💊

Medical Monitoring Devices

The MCF5307CAI66B's deterministic ColdFire V3 core and integrated MAC unit support medical monitoring devices such as patient monitors, infusion pumps, and bedside telemetry. 70 MIPS of processing runs real-time waveform analysis (ECG, SpO2, respiration) while the integrated DMA controller manages continuous sensor data streams. The -40C to +85C rating covers hospital and home-care environments. Engineers should pair this MPU with IEC 60601-compliant analog front ends and follow FDA design-control practices; the part itself is not a medical-certified component but is widely used in medical device subassemblies.

موصى به

PCM4202IDBREP · Texas Instruments MAX198BEWI · Maxim Integrated

ملخص المنتجات الموصى بها

MCF5307AI66B NXP Semiconductors يُستخدم في: Industrial Automation Controllers, Point-of-Sale Terminals MCF5329CVM240 NXP Semiconductors يُستخدم في: Industrial Automation Controllers MCF5327CVM240 Higher-performance networking upgrade with integrated Ethernet MAC يُستخدم في: Networking Edge Devices and Routers MCF5307FT66B NXP Semiconductors يُستخدم في: Networking Edge Devices and Routers MAX14701EWC+T Analog Devices يُستخدم في: Point-of-Sale Terminals TLV2545IDGKR Texas Instruments يُستخدم في: Embedded Instrumentation and Data Loggers MAX1304ECM/V+ Analog Devices يُستخدم في: Embedded Instrumentation and Data Loggers MCF5307CFT66B Drop-in alternate with tape-and-reel packaging for production line يُستخدم في: Building Automation and HVAC Controllers MAX1436ECQ+D Companion 12-bit ADC for sensor input conditioning يُستخدم في: Building Automation and HVAC Controllers PCM4202IDBREP Texas Instruments يُستخدم في: Medical Monitoring Devices MAX198BEWI Maxim Integrated يُستخدم في: Medical Monitoring Devices

What is the operating temperature range of the MCF5307CAI66B?

The MCF5307CAI66B operates from -40C to +85C industrial temperature range. According to the NXP MCF5307 datasheet, this part is rated for industrial-grade embedded environments, not automotive. Engineers specifying outside this range should consider the MCF5307AI66B or confirm with NXP for any extended-temperature variants, since the ColdFire V3 silicon limits the thermal envelope.

Is the MCF5307CAI66B still in production or end-of-life?

The MCF5307CAI66B is in last-time-buy (LTB) status as of 2026-10-17 per NXP's product page. The ColdFire MCF5307 family has been progressively moved to LTB over recent years as NXP concentrates on newer ColdFire and Kinetis families. Engineers should plan for last orders now and design a migration path to MCF532x or Kinetis for new designs.

What is the difference between MCF5307CAI66B and MCF5307AI66B?

Both MCF5307CAI66B and MCF5307AI66B share the same ColdFire V3 66 MHz silicon core, the same 208-FQFP package, and the same integrated peripherals. The C suffix vs A suffix typically denotes a slight silicon revision or qualification lot identifier. Functionally they are drop-in compatible; the engineer should confirm pinout and errata equivalence against the latest NXP revision document before substituting in production.

What package does the MCF5307CAI66B use?

The MCF5307CAI66B uses a 208-pin FQFP (Fine-pitch Quad Flat Pack) measuring 28x28 mm, supplied in tray packaging per NXP's tray standard. The 208-FQFP footprint is shared across the MCF5307 family, allowing PCB reuse among variants such as MCF5307AI66B and MCF5307CAI66B. Reference designs from NXP use a four-layer PCB with continuous ground plane under the device for thermal and signal-integrity reasons.

Where to download the MCF5307CAI66B datasheet PDF?

The MCF5307CAI66B datasheet PDF is available directly from NXP at https://www.nxp.com/docs/en/data-sheet/MCF5307.pdf, which is the authoritative source. Third-party mirrors such as DigiKey's product page (https://www.digikey.com/en/products/detail/nxp-usa-inc/MCF5307CAI66B/954797) also link to the same document. Always prefer the NXP-hosted PDF to ensure the latest revision and errata are referenced.

Where to buy MCF5307CAI66B online and what is the price?

The MCF5307CAI66B is available from authorized distributors including DigiKey, Mouser, Arrow, and LCSC, with LCSC listing the part from $38.88 as of 2026-10-17. Heisener and Octopart also surface stock from independent distributors. Because the part is in last-time-buy status, pricing can fluctuate as authorized stock depletes - request quotes from at least two authorized sources before committing to volume orders.

What is the lead time for MCF5307CAI66B orders?

Lead time for the MCF5307CAI66B varies by distributor: Heisener advertises immediate shipment for in-stock units (estimated delivery Jul 25 - Jul 30 within their listing), while broader distributor availability should be checked live. As of 2026-10-17, last-time-buy status means new manufacturing has ended, so lead time is dictated by remaining authorized-channel inventory and may lengthen sharply as stock depletes.

What is the best drop-in replacement for MCF5307CAI66B?

The closest drop-in replacement for the MCF5307CAI66B is the MCF5307AI66B - same ColdFire V3 66 MHz silicon, same 208-FQFP footprint, and same peripheral set. The C vs A suffix change reflects a minor silicon/mask revision but maintains pin-to-pin compatibility. Engineers should cross-check the NXP errata documents for any subtle differences in peripheral behavior before committing to a long production run.

MCF5307CAI66B vs MCF5272VM66 - which is better for industrial control?

The MCF5307CAI66B (ColdFire V3, 70 MIPS, 66 MHz, integrated MAC, integrated DRAM controller) is the stronger choice for industrial control versus the MCF5272VM66, which is a ColdFire V2 part at a similar clock but without the V3 MAC enhancements. The V3 core provides roughly 1.3x the integer performance and adds dedicated MAC instructions for control-loop DSP, while keeping the same 208-FQFP footprint family.

Is MCF5307CAI66B suitable for factory automation applications?

Yes, the MCF5307CAI66B is well suited for factory automation: 70 MIPS ColdFire V3 performance handles real-time control loops, the integrated MAC accelerates filter and PID computations, the integrated DRAM controller reduces BOM cost, and dual UARTs plus parallel GPIO support typical fieldbus and HMI integration. The industrial -40C to +85C temperature rating covers most factory-floor enclosures without additional ruggedization.

When should I choose MCF5307CAI66B over MCF532x or Kinetis?

Choose the MCF5307CAI66B when you are maintaining an installed base that already uses this exact part, when re-spinning an existing ColdFire V3 design, or when you have a short lifecycle product that will retire before stock depletes. Choose MCF532x for designs that need USB, Ethernet MAC, or longer lifecycle support; choose Kinetis for new designs requiring ARM Cortex-M, modern toolchains, and active longevity. New designs should not start on MCF5307CAI66B.

What are the key specifications of MCF5307CAI66B that engineers should know?

The MCF5307CAI66B delivers 70 MIPS from a ColdFire V3 core at 66 MHz, integrates 4 KB of on-chip SRAM, ships ROMless for external flash boot, runs at 3.3V, integrates a DRAM controller, DMA controller, two UARTs, timers, and parallel GPIO, and is packaged in a 208-FQFP (28x28 mm) on tray. It is rated -40C to +85C and is in last-time-buy status as of 2026-10-17, meaning new production has ceased.

What can replace the MCF5307CAI66B if stock is unavailable?

If authorized MCF5307CAI66B stock is depleted, the most direct replacement is the MCF5307AI66B (same family, same 208-FQFP, same peripherals). For longer lifecycle support consider the MCF5329CVM240, which is a newer ColdFire V3 family member in a similar MAPBGA package, or move to a Kinetis K60 part for ARM Cortex-M4 with significantly more performance and active longevity.

Is there a Kinetis equivalent for MCF5307CAI66B designs?

A reasonable Kinetis equivalent for MCF5307CAI66B designs is the Kinetis K60 family (for example MK60DN512VLQ10), which provides an ARM Cortex-M4 core at up to 100 MHz, comparable integrated peripherals, and an active NXP longevity program. K60 parts are NOT pin-compatible with the 208-FQFP footprint of the MCF5307CAI66B, so a PCB redesign is required; the migration is software-portable via the Freescale/NXP Processor Expert toolchain.

Does the MCF5307CAI66B support SDRAM directly?

Yes, the MCF5307CAI66B integrates a DRAM controller that supports SDRAM, EDO DRAM, and page-mode DRAM directly without an external memory controller. According to the NXP MCF5307 datasheet, the integrated controller handles refresh and addressing, simplifying board design and reducing BOM. The DRAM interface is multiplexed onto the external bus pins, so PCB layout must follow NXP's reference design for signal integrity at 66 MHz.

بيانات مرجعية هندسية لـ MCF5307CAI66B — المقارنة وإرشادات التصميم ومعلومات الامتثال.

دليل الاختيار

Choose the MCF5307CAI66B when you are maintaining or refreshing an existing ColdFire V3 design that uses the 208-FQFP footprint, when you need 70 MIPS of deterministic processing, and when the design lifecycle will end before authorized stock fully depletes. Choose the MCF5307AI66B as a drop-in alternate - same silicon, same package, possibly different qualification lot. Choose the MCF5329CVM240 if you need more performance and are willing to migrate to the higher clock rate within the same footprint family. Choose the Kinetis K60 family for new designs requiring active longevity and ARM Cortex-M4 processing; the migration requires PCB redesign. Avoid choosing the MCF5272VM66 - it is obsolete, uses a different package, and lacks the V3 MAC acceleration.

المقارنة مع البدائل

المعامل	هذا المنتج	MCF5307AI66B	MCF5307FT66B	MCF5307CFT66B	MCF5329CVM240	MCF5272VM66
Package	208-FQFP (28x28)	208-FQFP (28x28) - same	208-FQFP (28x28) - same	208-FQFP (28x28) - same	208-FQFP (28x28) - same	196-MAPBGA - NOT pin compatible
Brand	NXP Semiconductors	NXP Semiconductors	NXP Semiconductors	NXP Semiconductors	NXP Semiconductors	NXP Semiconductors
Core	ColdFire V3	ColdFire V3	ColdFire V3	ColdFire V3	ColdFire V3	ColdFire V2
Maximum Clock Frequency	66 MHz	66 MHz	66 MHz	66 MHz	240 MHz	66 MHz
Performance	70 MIPS	70 MIPS	70 MIPS	70 MIPS	Higher (V3 240 MHz)	~50 MIPS (V2 core)
On-chip SRAM	4 KB	4 KB	4 KB	4 KB	256 KB	1 KB
Supply Voltage	3.3 V	3.3 V	3.3 V	3.3 V	1.8 V core / 3.3 V I/O	3.3 V
Integrated DRAM Controller	Yes	Yes	Yes	Yes	Yes (SDRAM)	Yes
Lifecycle Status	Last-Time-Buy	Last-Time-Buy	Last-Time-Buy	Last-Time-Buy	Last-Time-Buy / NRND	Obsolete

أبرز الفروقات

ColdFire V3 core with integrated MAC unit (مقابلMCF5272VM66)
Larger 208-FQFP package footprint with 23-bit address bus (مقابلMCF5272VM66 (196-MAPBGA))
Higher clock speed headroom on the same footprint family (مقابلMCF5329CVM240)

ملاحظات التصميم

The MCF5307CAI66B requires a clean 3.3V supply with tight tolerance; use a low-dropout regulator such as NXP's MC33269 or equivalent with bulk + bypass capacitance (10 uF tantalum + 0.1 uF ceramic per VDD pin). Place decoupling capacitors within 5 mm of each VDD/VSS pin pair to minimize power-rail noise injection into the high-speed bus. Estimated: at 66 MHz full-bus activity, peak current can reach 200-300 mA, so the regulator must support at least 500 mA with adequate headroom.

The 208-FQFP 0.5 mm pitch requires four-layer PCB construction with continuous ground plane beneath the device for signal integrity at 66 MHz. Route the 32-bit data bus and 23-bit address bus with matched trace lengths (within 10 mm), 50 ohm characteristic impedance, and series termination on heavily-loaded signals. Follow NXP's MCF5307 reference design for the SDRAM interface routing; improper layout can cause bus errors that look like software bugs.

Do not assume the MCF5307CAI66B is 5V tolerant - all I/O is 3.3V only. Connecting a 5V peripheral directly will damage the part. Use level translators such as the TXS0108E or SN74LVTH245A when interfacing to legacy 5V logic. Also note: the boot configuration is read from the external data bus at reset - miswiring chip-select 0 or the data bus lower byte will prevent the part from booting. Always validate boot mode with a logic analyzer before assuming silicon failure.

معلومات الامتثال

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

خالٍ من الرصاص

Yes

خالٍ من الهالوجين

Unknown

المعادن المتنازع عليها

Compliant

RoHS and REACH compliance per NXP product page. Not AEC-Q100 qualified - this is an industrial-grade part. Last-time-buy status as of 2026-10-17 per NXP's product change notice.

تم التحقق من البيانات في: 2026-10-17 — تم التحقق من البيانات وتنسيقها بواسطة فريق هندسة المكونات في XAIPART

المصادر: Manufacturer Product Page, Distributor, Distributor, Octopart, Distributor, Distributor, Distributor

عمليات بحث ذات صلة

MCF5307CAI66B MCF5307CAI66B datasheet NXP MCF5307 datasheet PDF ColdFire V3 66 MHz 32-bit MPU 208-FQFP ColdFire microprocessor MCF5307CAI66B industrial automation MCF5307CAI66B vs MCF5307AI66B MCF5307CAI66B drop-in replacement buy MCF5307CAI66B online MCF5307CAI66B last time buy status MCF5307CAI66B pinout 208-FQFP ColdFire V3 70 MIPS industrial control MPU

المكونات والمصطلحات ذات الصلة

NXP Semiconductors MCF5307CAI66B MCF5307 ColdFire V3 32-bit MPU microprocessor ColdFire architecture 68k heritage FQFP-208 208-FQFP (28x28) DRAM controller DMA controller UART QSPI I2C MAC unit multiply-accumulate RoHS REACH embedded control industrial automation MIPS ROMless external flash boot last-time-buy Kinetis K60

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