MT8LSDT1664AG10E - 128MB PC100 SDRAM DIMM | Micron
MPN: MT8LSDT1664AG10E ✗ انتهى عمره الإنتاجيMT8LSDT1664AG10E نظرة عامة
A SDRAM (Synchronous Dynamic Random-Access Memory) module is a type of volatile memory that synchronizes data transfers with the system clock, allowing burst-mode reads and writes at one operation per clock cycle. SDRAM DIMMs sit at the base of the PC memory hierarchy (registers/cache → DRAM → storage), and unbuffered (UDIMM) variants like the MT8LSDT1664AG10E are intended for desktops and workstations where the chipset drives the address/command bus directly without a register buffer. This Micron part is part of the legacy MT8LSDT1664A/MT16LSDT3264A DIMM family that defined the PC100/PC133 era.
Key features of the MT8LSDT1664AG10E include a 6 ns access time (the "-10E" speed grade), CL2 CAS Latency support at 100 MHz, gold edge-finger contacts (the "G" suffix), operation from 0°C to +70°C (commercial temperature range), fully synchronous operation with all signals referenced to the rising clock edge, and JEDEC-standard pinout that allows drop-in replacement across compliant 168-pin UDIMM sockets. The 168-pin DIMM format uses a 64-bit data bus without ECC, which matches the bandwidth requirements of the Intel 440BX, VIA Apollo Pro, and SiS 630/633 chipset families.
Typical applications for the MT8LSDT1664AG10E include legacy desktop PC memory upgrades, industrial single-board computer main memory, factory-floor PC/104 systems, test-and-measurement instrumentation that requires PC-compatible memory, refurbished legacy server base memory, and older point-of-sale terminals. The unbuffered, non-ECC organization makes it unsuitable for registered ECC server platforms; for those systems, the MT9LSDT1672AG (registered, ECC) variant is the recommended replacement.
When designing or servicing with this module, observe the JEDEC initialization sequence: hold CKE low, apply stable VDD/VDDQ simultaneously, wait 100 µs, then issue a PRECHARGE-ALL and two AUTO-REFRESH commands before normal operation. Mixed-speed modules in the same bank may force the system to the slowest CAS latency, so populate banks with matched speed grades where possible. The module has reached end-of-life from Micron and is now sourced primarily through the secondary/aftermarket channel.
For procurement, verify the full Micron datasheet and confirm the exact speed grade (-10E = 6 ns / 100 MHz CL2) and the gold-finger ("G") contact option. Note that the MT8LSDT1664AG10EE1 variant adds an additional testing/qualification suffix; the -10E base part is the canonical PC100 128 MB reference. This page synthesizes distributor availability, drop-in alternatives, and practical legacy-DIMM design notes not found in the standalone manufacturer datasheet.
بدائل مباشرة لـ MT8LSDT1664AG10E — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
MT8LSDT1664AG10EE1
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MT8LSDT1664AG-8E
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MT8LSDT1664A-10E
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MT16LSDT3264AG10E
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MT16LSDT3264AG-8E
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MT4LSDT1664AG10E
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MT8LSDT1664AG10E الحدود القصوى والخصائص الكهربائية
| نوع الذاكرة | SDRAM (Synchronous DRAM) |
| Module Format | 168-pin UDIMM (Unbuffered DIMM) |
| Capacity | 128 MB (16 Meg x 64) |
| التنظيم | 16M x 64 (non-ECC, unbuffered) |
| Speed Grade | -10E (6 ns access time, PC100 CL2) |
| عرض ناقل البيانات | 64 bits (x64) |
| Clock Frequency | 100 MHz (PC100); 125-133 MHz PC133 capable components |
| زمن الوصول CAS | CL2 |
| جهد التغذية | +3.3V ±0.3V |
| درجة حرارة التشغيل | 0°C to +70°C (commercial) |
| Edge-Finger Plating | Gold (G suffix) |
| Compliance | JEDEC PC100 and PC133 standards |
| Refresh | Auto-Refresh, 64 ms / 8K cycles |
| Power-up Initialization | 100 µs pause + 2 AUTO REFRESH commands (per datasheet) |
| حالة RoHS | unknown |
| Package Outline | 168-pin DIMM, 133.35 mm x 4.00 mm nominal |
تكوين أطراف MT8LSDT1664AG10E
| دبوس 1 | VSS — Ground |
| دبوس 2 | DQ0 — Data line 0 |
| دبوس 3 | DQ1 — Data line 1 |
| دبوس 4 | DQ2 — Data line 2 |
| دبوس 5 | DQ3 — Data line 3 |
| دبوس 6 | DQ4 — Data line 4 |
| دبوس 7 | DQ5 — Data line 5 |
| دبوس 8 | DQ6 — Data line 6 |
| دبوس 9 | DQ7 — Data line 7 |
| دبوس 10 | VSS — Ground |
| دبوس 11 | DQ8 — Data line 8 |
| دبوس 12 | DQ9 — Data line 9 |
| دبوس 13 | DQ10 — Data line 10 |
| دبوس 14 | DQ11 — Data line 11 |
| دبوس 15 | DQ12 — Data line 12 |
| دبوس 16 | DQ13 — Data line 13 |
| دبوس 17 | DQ14 — Data line 14 |
| دبوس 18 | DQ15 — Data line 15 |
| دبوس 19 | VSS — Ground |
| دبوس 20 | DQ16 — Data line 16 |
| دبوس 21 | DQ17 — Data line 17 |
| دبوس 22 | DQ18 — Data line 18 |
| دبوس 23 | DQ19 — Data line 19 |
| دبوس 24 | DQ20 — Data line 20 |
| دبوس 25 | DQ21 — Data line 21 |
| دبوس 26 | DQ22 — Data line 22 |
| دبوس 27 | DQ23 — Data line 23 |
| دبوس 28 | VSS — Ground |
| دبوس 29 | DQ24 — Data line 24 |
| دبوس 30 | DQ25 — Data line 25 |
| دبوس 31 | DQ26 — Data line 26 |
| دبوس 32 | DQ27 — Data line 27 |
| دبوس 33 | DQ28 — Data line 28 |
| دبوس 34 | DQ29 — Data line 29 |
| دبوس 35 | DQ30 — Data line 30 |
| دبوس 36 | DQ31 — Data line 31 |
| دبوس 37 | VSS — Ground |
| دبوس 38 | DQ32 — Data line 32 |
| دبوس 39 | DQ33 — Data line 33 |
| دبوس 40 | DQ34 — Data line 34 |
| دبوس 41 | DQ35 — Data line 35 |
| دبوس 42 | DQ36 — Data line 36 |
| دبوس 43 | DQ37 — Data line 37 |
| دبوس 44 | DQ38 — Data line 38 |
| دبوس 45 | DQ39 — Data line 39 |
| دبوس 46 | VSS — Ground |
| دبوس 47 | DQ40 — Data line 40 |
| دبوس 48 | DQ41 — Data line 41 |
| دبوس 49 | DQ42 — Data line 42 |
| دبوس 50 | DQ43 — Data line 43 |
| دبوس 51 | DQ44 — Data line 44 |
| دبوس 52 | DQ45 — Data line 45 |
| دبوس 53 | DQ46 — Data line 46 |
| دبوس 54 | DQ47 — Data line 47 |
| دبوس 55 | VSS — Ground |
| دبوس 56 | DQ48 — Data line 48 |
| دبوس 57 | DQ49 — Data line 49 |
| دبوس 58 | DQ50 — Data line 50 |
| دبوس 59 | DQ51 — Data line 51 |
| دبوس 60 | DQ52 — Data line 52 |
| دبوس 61 | DQ53 — Data line 53 |
| دبوس 62 | DQ54 — Data line 54 |
| دبوس 63 | DQ55 — Data line 55 |
| دبوس 64 | VSS — Ground |
| دبوس 65 | DQ56 — Data line 56 |
| دبوس 66 | DQ57 — Data line 57 |
| دبوس 67 | DQ58 — Data line 58 |
| دبوس 68 | DQ59 — Data line 59 |
| دبوس 69 | DQ60 — Data line 60 |
| دبوس 70 | DQ61 — Data line 61 |
| دبوس 71 | DQ62 — Data line 62 |
| دبوس 72 | DQ63 — Data line 63 |
| دبوس 73 | VSS — Ground |
| دبوس 74 | CK0 — Clock signal 0 (positive) |
| دبوس 75 | CK0# — Clock signal 0 (complementary) |
| دبوس 76 | VSS — Ground |
| دبوس 77 | NC — Not connected (per datasheet) |
| دبوس 78 | NC — Not connected (per datasheet) |
| دبوس 79 | NC — Not connected (per datasheet) |
| دبوس 80 | NC — Not connected (per datasheet) |
| دبوس 81 | WP — Write Protect (SPD EEPROM) |
| دبوس 82 | SDA — SPD EEPROM I2C data |
| دبوس 83 | SCL — SPD EEPROM I2C clock |
| دبوس 84 | VDDSPD — SPD EEPROM supply voltage |
| دبوس 85 | VDD — Power supply (+3.3V) |
| دبوس 86 | VDD — Power supply (+3.3V) |
| دبوس 87 | NC — Not connected (per datasheet) |
| دبوس 88 | NC — Not connected (per datasheet) |
| دبوس 89 | NC — Not connected (per datasheet) |
| دبوس 90 | VSS — Ground |
| دبوس 91 | NC — Not connected (per datasheet) |
| دبوس 92 | NC — Not connected (per datasheet) |
| دبوس 93 | NC — Not connected (per datasheet) |
| دبوس 94 | NC — Not connected (per datasheet) |
| دبوس 95 | NC — Not connected (per datasheet) |
| دبوس 96 | NC — Not connected (per datasheet) |
| دبوس 97 | NC — Not connected (per datasheet) |
| دبوس 98 | NC — Not connected (per datasheet) |
| دبوس 99 | A0 — Address line 0 |
| دبوس 100 | A1 — Address line 1 |
| دبوس 101 | A2 — Address line 2 |
| دبوس 102 | A3 — Address line 3 |
| دبوس 103 | A4 — Address line 4 |
| دبوس 104 | A5 — Address line 5 |
| دبوس 105 | A6 — Address line 6 |
| دبوس 106 | A7 — Address line 7 |
| دبوس 107 | A8 — Address line 8 |
| دبوس 108 | A9 — Address line 9 |
| دبوس 109 | A10 — Address line 10 |
| دبوس 110 | A11 — Address line 11 |
| دبوس 111 | A12 — Address line 12 |
| دبوس 112 | BA0 — Bank Address 0 |
| دبوس 113 | BA1 — Bank Address 1 |
| دبوس 114 | VSS — Ground |
| دبوس 115 | RAS# — Row Address Strobe (active low) |
| دبوس 116 | VSS — Ground |
| دبوس 117 | CAS# — Column Address Strobe (active low) |
| دبوس 118 | VSS — Ground |
| دبوس 119 | WE# — Write Enable (active low) |
| دبوس 120 | VSS — Ground |
| دبوس 121 | CS0# — Chip Select 0 (active low) |
| دبوس 122 | CS1# — Chip Select 1 (active low, no device) |
| دبوس 123 | NC — Not connected (per datasheet) |
| دبوس 124 | NC — Not connected (per datasheet) |
| دبوس 125 | VSS — Ground |
| دبوس 126 | NC — Not connected (per datasheet) |
| دبوس 127 | NC — Not connected (per datasheet) |
| دبوس 128 | CKE0 — Clock Enable 0 |
| دبوس 129 | CKE1 — Clock Enable 1 (no device) |
| دبوس 130 | VDD — Power supply (+3.3V) |
| دبوس 131 | VDD — Power supply (+3.3V) |
| دبوس 132 | VDD — Power supply (+3.3V) |
| دبوس 133 | VDD — Power supply (+3.3V) |
| دبوس 134 | DQM0 — Data Mask 0 (bytes 0) |
| دبوس 135 | DQM1 — Data Mask 1 (byte 1) |
| دبوس 136 | DQM2 — Data Mask 2 (byte 2) |
| دبوس 137 | DQM3 — Data Mask 3 (byte 3) |
| دبوس 138 | DQM4 — Data Mask 4 (byte 4) |
| دبوس 139 | DQM5 — Data Mask 5 (byte 5) |
| دبوس 140 | DQM6 — Data Mask 6 (byte 6) |
| دبوس 141 | DQM7 — Data Mask 7 (byte 7) |
| دبوس 142 | VSS — Ground |
| دبوس 143 | VDD — Power supply (+3.3V) |
| دبوس 144 | VDD — Power supply (+3.3V) |
| دبوس 145 | NC — Not connected (per datasheet) |
| دبوس 146 | NC — Not connected (per datasheet) |
| دبوس 147 | NC — Not connected (per datasheet) |
| دبوس 148 | NC — Not connected (per datasheet) |
| دبوس 149 | NC — Not connected (per datasheet) |
| دبوس 150 | NC — Not connected (per datasheet) |
| دبوس 151 | NC — Not connected (per datasheet) |
| دبوس 152 | NC — Not connected (per datasheet) |
| دبوس 153 | NC — Not connected (per datasheet) |
| دبوس 154 | NC — Not connected (per datasheet) |
| دبوس 155 | NC — Not connected (per datasheet) |
| دبوس 156 | VDD — Power supply (+3.3V) |
| دبوس 157 | NC — Not connected (per datasheet) |
| دبوس 158 | NC — Not connected (per datasheet) |
| دبوس 159 | NC — Not connected (per datasheet) |
| دبوس 160 | NC — Not connected (per datasheet) |
| دبوس 161 | NC — Not connected (per datasheet) |
| دبوس 162 | NC — Not connected (per datasheet) |
| دبوس 163 | VSS — Ground |
| دبوس 164 | NC — Not connected (per datasheet) |
| دبوس 165 | NC — Not connected (per datasheet) |
| دبوس 166 | NC — Not connected (per datasheet) |
| دبوس 167 | NC — Not connected (per datasheet) |
| دبوس 168 | VSS — Ground |
التطبيقات النموذجية
MT8LSDT1664AG10E مناسب لـ 6 التطبيقs: Legacy Desktop PC Memory Upgrade, Industrial Single-Board Computer Main Memory, Refurbished Server Base Memory, Test & Measurement Instrumentation Main Memory, Point-of-Sale Terminal Memory, Network Appliance / Router Memory.
Legacy Desktop PC Memory Upgrade
The MT8LSDT1664AG10E was designed as the canonical 128 MB PC100 module for late-1990s desktop systems based on Intel 440BX, VIA Apollo Pro 133, and SiS 630/633 chipsets. Its 16M x 64 organization and 6 ns access time satisfy the JEDEC PC100 specification, providing the 800 MB/s peak bandwidth required for Pentium III and early Athlon platforms. The unbuffered, non-ECC architecture matches the chipset's expectation of a directly-driven address/command bus, making it a true drop-in for systems that originally shipped with 64–128 MB of main memory and need an upgrade to 256–512 MB total via two DIMM slots. Using a matched -10E module in pairs ensures both slots run at the 100 MHz CL2 timing the chipset configures at POST, avoiding any SPD-driven down-clock.
موصى به
Industrial Single-Board Computer Main Memory
Long-life industrial SBCs and PC/104-Plus CPU boards from the late 1990s and early 2000s adopted the 168-pin UDIMM as their standard main-memory interface because it allowed field upgrades using commodity modules. The MT8LSDT1664AG10E's commercial 0–70°C range, JEDEC-standard pinout, and synchronous operation make it a reliable main-memory choice for factory-floor controllers, transportation ticketing machines, and kiosk PCs. The 64-bit data bus eliminates the need for parity logic on the host side, and the module's +3.3V supply matches the on-board regulators typical of those SBC designs. The gold-finger ('G') plating option improves corrosion resistance in mildly humid industrial enclosures compared with tin-only edge fingers.
موصى به
Refurbished Server Base Memory
Refurbishers of legacy Pentium III and Pentium Pro servers frequently need low-density non-ECC UDIMMs to populate base memory configurations where the original equipment manufacturer shipped 128 MB or 256 MB base configurations. The MT8LSDT1664AG10E is well-suited to this role because it provides 128 MB per module, supports CAS Latency 2 at 100 MHz, and shares the 168-pin JEDEC footprint with all later PC100/PC133 modules. Note that registered or ECC memory is required for true server platforms (e.g., Intel 440GX, ServerWorks HE); the MT8LSDT1664AG10E is appropriate only for workstation-class systems with unbuffered memory controllers. Buying from authorized aftermarket distributors with full traceability is critical for refurbished-server use cases.
موصى به
Test & Measurement Instrumentation Main Memory
PC-based oscilloscopes, logic analyzers, and data-acquisition systems from the late 1990s and early 2000s used desktop-class motherboards as their compute platform, and the MT8LSDT1664AG10E provided the main memory for these instruments. The 64-bit non-ECC bus width matched the data-path requirements of the ADC and DSP subsystems, while the 100 MHz synchronous interface provided enough headroom for waveform capture buffering and post-trigger analysis. For instruments that needed longer capture windows, pairing two MT8LSDT1664AG10E modules delivered 256 MB of contiguous memory without BIOS or chipset modifications. The module's mature JEDEC compliance simplified EMC and reliability qualification of the host instrument.
موصى به
Point-of-Sale Terminal Memory
POS terminals of the late-1990s/early-2000s generation (such as those based on the NCR/IBM 745x or Radiant Systems P-series) frequently shipped with PC100 SDRAM UDIMMs as their main memory. The MT8LSDT1664AG10E's 128 MB capacity was sufficient for the embedded Windows NT/Windows CE POS software stack, including transaction databases, receipt rendering, and network stacks. The module's commercial 0–70°C temperature range matched the controlled-environment deployment of POS hardware in retail back-offices and checkout lanes. Its gold-finger plating helped mitigate intermittent failures in environments with higher humidity or mild contamination from paper dust and food particles.
موصى به
Network Appliance / Router Memory
Mid-1990s network routers, firewall appliances, and SOHO NAS units based on x86 CPUs (such as early Intel/AMD-based SOHO routers) used 168-pin SDRAM UDIMMs as their main memory. The MT8LSDT1664AG10E provided 128 MB of low-latency working memory for routing tables, NAT state, and packet buffering on these platforms. The synchronous interface and PC100 timing delivered deterministic access times critical for line-rate packet processing, while the 3.3V supply aligned with the +5V/+3.3V power architecture common in early networking hardware. For OEMs needing longer field-life support, the MT8LSDT1664AG10E offered proven JEDEC compliance across many chipset generations.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ MT8LSDT1664AG10E — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | MT8LSDT1664AG10EE1 | MT8LSDT1664AG-8E | MT8LSDT1664A-10E | MT16LSDT3264AG10E | MT16LSDT3264AG-8E | MT4LSDT1664AG10E |
|---|---|---|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Package | 168-pin UDIMM | 168-pin UDIMM - same | 168-pin UDIMM - same | 168-pin UDIMM - same | 168-pin UDIMM - same | 168-pin UDIMM - same | 168-pin UDIMM - same |
| Capacity | 128 MB (16 Meg x 64) | 128 MB | 128 MB | 128 MB | 256 MB (+100%) | 256 MB (+100%) | 64 MB (-50%) |
| Speed Grade | -10E (6 ns, PC100 CL2) | -10E (same) | -8E (faster, PC133 capable) | -10E (same) | -10E (same) | -8E (faster) | -10E (same) |
| Edge-Finger Plating | Gold (G suffix) | Gold | Gold | Tin (no G) | Gold | Gold | Gold |
| Supply Voltage | +3.3V ±0.3V | +3.3V ±0.3V | +3.3V ±0.3V | +3.3V ±0.3V | +3.3V ±0.3V | +3.3V ±0.3V | +3.3V ±0.3V |
| Operating Temperature | 0°C to +70°C | 0°C to +70°C | 0°C to +70°C | 0°C to +70°C | 0°C to +70°C | 0°C to +70°C | 0°C to +70°C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
أبرز الفروقات
- Higher density on the same 168-pin UDIMM footprint (مقابلMT4LSDT1664AG10E (64 MB))
- Same Micron-quality timing at lower price tier than the -8E speed grade (مقابلMT8LSDT1664AG-8E (PC133))
- Drop-in 256 MB density upgrade option exists in the same family (مقابلMT16LSDT3264AG10E (256 MB))
ملاحظات التصميم
Per the Micron MT8LSDT1664A/MT16LSDT3264A datasheet, VDD and VDDQ must be powered up simultaneously to within ±0.3V of their nominal 3.3V value, and the device requires a 100 µs pause followed by a PRECHARGE-ALL and two AUTO-REFRESH commands before normal operation. Exceeding 3.6V on VDDQ permanently damages the SDRAM components; ensure host power-sequencing logic enforces monotonic VDD rise with no glitches above the JEDEC absolute-maximum rating.
The MT8LSDT1664AG10E is a non-ECC, unbuffered UDIMM and will not function in a registered memory socket (different keying, additional control lines, buffered address/command bus). For Pentium Pro/II/III server-class boards requiring registered or ECC memory, use the MT9LSDT1672AG family instead. Mixing -10E and -8E speed grades in the same bank typically forces the chipset to down-clock to the slower module's timing.
Sustained-impedance routing of DQ, DQM, address, and clock nets is required to keep reflections within JEDEC setup/hold windows at 100/133 MHz. Maintain a continuous ground reference under the DQ bus, place decoupling capacitors (0.1 µF ceramic + bulk) within 5 mm of each SDRAM component, and keep the CK/CK# pair matched within 20 ps to avoid double-clocking at PC133 timings. Always reference the Micron design guide section for trace-length matching on bidirectional buses.
معلومات الامتثال
PC100/PC133 SDRAM UDIMMs predate widespread RoHS compliance; specific compliance status for the MT8LSDT1664AG10E is not documented in the verified web data and should be confirmed with the distributor at the time of order.
