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Micron Technology

MT8LSDT1664AG10E - 128MB PC100 SDRAM DIMM | Micron

Артикул: MT8LSDT1664AG10E ✗ Снят с производства
В наличии Отправка в течение 1–3 рабочих дней
+3.3V ±0.3V Vdss 168-pin DIMM, 133.35 mm x 4.00 mm nominal Package -10E (6 ns access time, PC100 CL2) Speed SDRAM (Synchronous DRAM) Memory
От $19.5 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-04
Оптовые цены
Кол-во Цена за ед. Итого
1 $28.41 $28,41
10 $26.5 $265,00
50 $24 $1.200,00
100 $21.75 $2.175,00
500 $19.5 $9.750,00
ℹ️ Все цены указаны в USD

MT8LSDT1664AG10E Обзор

The Micron MT8LSDT1664AG10E is a 128 MB (16 Meg x 64) unbuffered 168-pin SDRAM Dual In-Line Memory Module (DIMM) organized as 16M x 64 in the PC100/PC133 JEDEC-standard form factor. It operates from a single +3.3V ±0.3V power supply and uses fully synchronous SDRAM components clocked at 125 MHz (PC100) and 133 MHz (PC133), delivering the bandwidth and latency required by late-1990s desktop systems, Pentium III/early Athlon motherboards, and legacy industrial SBCs.

A SDRAM (Synchronous Dynamic Random-Access Memory) module is a type of volatile memory that synchronizes data transfers with the system clock, allowing burst-mode reads and writes at one operation per clock cycle. SDRAM DIMMs sit at the base of the PC memory hierarchy (registers/cache → DRAM → storage), and unbuffered (UDIMM) variants like the MT8LSDT1664AG10E are intended for desktops and workstations where the chipset drives the address/command bus directly without a register buffer. This Micron part is part of the legacy MT8LSDT1664A/MT16LSDT3264A DIMM family that defined the PC100/PC133 era.

Key features of the MT8LSDT1664AG10E include a 6 ns access time (the "-10E" speed grade), CL2 CAS Latency support at 100 MHz, gold edge-finger contacts (the "G" suffix), operation from 0°C to +70°C (commercial temperature range), fully synchronous operation with all signals referenced to the rising clock edge, and JEDEC-standard pinout that allows drop-in replacement across compliant 168-pin UDIMM sockets. The 168-pin DIMM format uses a 64-bit data bus without ECC, which matches the bandwidth requirements of the Intel 440BX, VIA Apollo Pro, and SiS 630/633 chipset families.

Typical applications for the MT8LSDT1664AG10E include legacy desktop PC memory upgrades, industrial single-board computer main memory, factory-floor PC/104 systems, test-and-measurement instrumentation that requires PC-compatible memory, refurbished legacy server base memory, and older point-of-sale terminals. The unbuffered, non-ECC organization makes it unsuitable for registered ECC server platforms; for those systems, the MT9LSDT1672AG (registered, ECC) variant is the recommended replacement.

When designing or servicing with this module, observe the JEDEC initialization sequence: hold CKE low, apply stable VDD/VDDQ simultaneously, wait 100 µs, then issue a PRECHARGE-ALL and two AUTO-REFRESH commands before normal operation. Mixed-speed modules in the same bank may force the system to the slowest CAS latency, so populate banks with matched speed grades where possible. The module has reached end-of-life from Micron and is now sourced primarily through the secondary/aftermarket channel.

For procurement, verify the full Micron datasheet and confirm the exact speed grade (-10E = 6 ns / 100 MHz CL2) and the gold-finger ("G") contact option. Note that the MT8LSDT1664AG10EE1 variant adds an additional testing/qualification suffix; the -10E base part is the canonical PC100 128 MB reference. This page synthesizes distributor availability, drop-in alternatives, and practical legacy-DIMM design notes not found in the standalone manufacturer datasheet.

Аналоги без доработки для MT8LSDT1664AG10E — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MT8LSDT1664AG10EE1

✅ Прямая замена
📦 168-pin UDIMM
same 168-pin UDIMM, same 16M x 64, same 6 ns PC100 timing; only Micron test/qualification suffix differs (-10EE1 vs -10E)

📋 Справочный аналог (нет в каталоге)

MT8LSDT1664AG-8E

✅ Прямая замена
📦 168-pin UDIMM
same 168-pin UDIMM, same 16M x 64, faster -8E speed grade (8 ns, PC133 capable) — backwards compatible at 100 MHz

📋 Справочный аналог (нет в каталоге)

MT8LSDT1664A-10E

✅ Прямая замена
📦 168-pin UDIMM
same 168-pin UDIMM, same 16M x 64, same 6 ns timing, no gold-finger plating ('A' vs 'AG') — electrically and pin compatible

📋 Справочный аналог (нет в каталоге)

MT16LSDT3264AG10E

✅ Прямая замена
📦 168-pin UDIMM
same 168-pin UDIMM, 32M x 64 organization (256 MB, +100% capacity), same 6 ns PC100 timing — same JEDEC pinout

📋 Справочный аналог (нет в каталоге)

MT16LSDT3264AG-8E

✅ Прямая замена
📦 168-pin UDIMM
same 168-pin UDIMM, 32M x 64 (256 MB), faster -8E PC133 grade — drop-in capacity upgrade with headroom

📋 Справочный аналог (нет в каталоге)

MT4LSDT1664AG10E

✅ Прямая замена
📦 168-pin UDIMM
same 168-pin UDIMM, 8M x 64 (64 MB, -50% capacity), same 6 ns PC100 timing — same JEDEC pinout, lower-density variant

📋 Справочный аналог (нет в каталоге)

MT8LSDT1664AG10E Максимальные параметры и электрические характеристики

Тип памяти SDRAM (Synchronous DRAM)
Module Format 168-pin UDIMM (Unbuffered DIMM)
Capacity 128 MB (16 Meg x 64)
Организация памяти 16M x 64 (non-ECC, unbuffered)
Speed Grade -10E (6 ns access time, PC100 CL2)
Разрядность шины данных 64 bits (x64)
Clock Frequency 100 MHz (PC100); 125-133 MHz PC133 capable components
Задержка CAS CL2
Напряжение питания +3.3V ±0.3V
Рабочая температура 0°C to +70°C (commercial)
Edge-Finger Plating Gold (G suffix)
Compliance JEDEC PC100 and PC133 standards
Refresh Auto-Refresh, 64 ms / 8K cycles
Power-up Initialization 100 µs pause + 2 AUTO REFRESH commands (per datasheet)
Статус RoHS unknown
Package Outline 168-pin DIMM, 133.35 mm x 4.00 mm nominal

Конфигурация выводов MT8LSDT1664AG10E

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Контакт 1 VSS — Ground
Контакт 2 DQ0 — Data line 0
Контакт 3 DQ1 — Data line 1
Контакт 4 DQ2 — Data line 2
Контакт 5 DQ3 — Data line 3
Контакт 6 DQ4 — Data line 4
Контакт 7 DQ5 — Data line 5
Контакт 8 DQ6 — Data line 6
Контакт 9 DQ7 — Data line 7
Контакт 10 VSS — Ground
Контакт 11 DQ8 — Data line 8
Контакт 12 DQ9 — Data line 9
Контакт 13 DQ10 — Data line 10
Контакт 14 DQ11 — Data line 11
Контакт 15 DQ12 — Data line 12
Контакт 16 DQ13 — Data line 13
Контакт 17 DQ14 — Data line 14
Контакт 18 DQ15 — Data line 15
Контакт 19 VSS — Ground
Контакт 20 DQ16 — Data line 16
Контакт 21 DQ17 — Data line 17
Контакт 22 DQ18 — Data line 18
Контакт 23 DQ19 — Data line 19
Контакт 24 DQ20 — Data line 20
Контакт 25 DQ21 — Data line 21
Контакт 26 DQ22 — Data line 22
Контакт 27 DQ23 — Data line 23
Контакт 28 VSS — Ground
Контакт 29 DQ24 — Data line 24
Контакт 30 DQ25 — Data line 25
Контакт 31 DQ26 — Data line 26
Контакт 32 DQ27 — Data line 27
Контакт 33 DQ28 — Data line 28
Контакт 34 DQ29 — Data line 29
Контакт 35 DQ30 — Data line 30
Контакт 36 DQ31 — Data line 31
Контакт 37 VSS — Ground
Контакт 38 DQ32 — Data line 32
Контакт 39 DQ33 — Data line 33
Контакт 40 DQ34 — Data line 34
Контакт 41 DQ35 — Data line 35
Контакт 42 DQ36 — Data line 36
Контакт 43 DQ37 — Data line 37
Контакт 44 DQ38 — Data line 38
Контакт 45 DQ39 — Data line 39
Контакт 46 VSS — Ground
Контакт 47 DQ40 — Data line 40
Контакт 48 DQ41 — Data line 41
Контакт 49 DQ42 — Data line 42
Контакт 50 DQ43 — Data line 43
Контакт 51 DQ44 — Data line 44
Контакт 52 DQ45 — Data line 45
Контакт 53 DQ46 — Data line 46
Контакт 54 DQ47 — Data line 47
Контакт 55 VSS — Ground
Контакт 56 DQ48 — Data line 48
Контакт 57 DQ49 — Data line 49
Контакт 58 DQ50 — Data line 50
Контакт 59 DQ51 — Data line 51
Контакт 60 DQ52 — Data line 52
Контакт 61 DQ53 — Data line 53
Контакт 62 DQ54 — Data line 54
Контакт 63 DQ55 — Data line 55
Контакт 64 VSS — Ground
Контакт 65 DQ56 — Data line 56
Контакт 66 DQ57 — Data line 57
Контакт 67 DQ58 — Data line 58
Контакт 68 DQ59 — Data line 59
Контакт 69 DQ60 — Data line 60
Контакт 70 DQ61 — Data line 61
Контакт 71 DQ62 — Data line 62
Контакт 72 DQ63 — Data line 63
Контакт 73 VSS — Ground
Контакт 74 CK0 — Clock signal 0 (positive)
Контакт 75 CK0# — Clock signal 0 (complementary)
Контакт 76 VSS — Ground
Контакт 77 NC — Not connected (per datasheet)
Контакт 78 NC — Not connected (per datasheet)
Контакт 79 NC — Not connected (per datasheet)
Контакт 80 NC — Not connected (per datasheet)
Контакт 81 WP — Write Protect (SPD EEPROM)
Контакт 82 SDA — SPD EEPROM I2C data
Контакт 83 SCL — SPD EEPROM I2C clock
Контакт 84 VDDSPD — SPD EEPROM supply voltage
Контакт 85 VDD — Power supply (+3.3V)
Контакт 86 VDD — Power supply (+3.3V)
Контакт 87 NC — Not connected (per datasheet)
Контакт 88 NC — Not connected (per datasheet)
Контакт 89 NC — Not connected (per datasheet)
Контакт 90 VSS — Ground
Контакт 91 NC — Not connected (per datasheet)
Контакт 92 NC — Not connected (per datasheet)
Контакт 93 NC — Not connected (per datasheet)
Контакт 94 NC — Not connected (per datasheet)
Контакт 95 NC — Not connected (per datasheet)
Контакт 96 NC — Not connected (per datasheet)
Контакт 97 NC — Not connected (per datasheet)
Контакт 98 NC — Not connected (per datasheet)
Контакт 99 A0 — Address line 0
Контакт 100 A1 — Address line 1
Контакт 101 A2 — Address line 2
Контакт 102 A3 — Address line 3
Контакт 103 A4 — Address line 4
Контакт 104 A5 — Address line 5
Контакт 105 A6 — Address line 6
Контакт 106 A7 — Address line 7
Контакт 107 A8 — Address line 8
Контакт 108 A9 — Address line 9
Контакт 109 A10 — Address line 10
Контакт 110 A11 — Address line 11
Контакт 111 A12 — Address line 12
Контакт 112 BA0 — Bank Address 0
Контакт 113 BA1 — Bank Address 1
Контакт 114 VSS — Ground
Контакт 115 RAS# — Row Address Strobe (active low)
Контакт 116 VSS — Ground
Контакт 117 CAS# — Column Address Strobe (active low)
Контакт 118 VSS — Ground
Контакт 119 WE# — Write Enable (active low)
Контакт 120 VSS — Ground
Контакт 121 CS0# — Chip Select 0 (active low)
Контакт 122 CS1# — Chip Select 1 (active low, no device)
Контакт 123 NC — Not connected (per datasheet)
Контакт 124 NC — Not connected (per datasheet)
Контакт 125 VSS — Ground
Контакт 126 NC — Not connected (per datasheet)
Контакт 127 NC — Not connected (per datasheet)
Контакт 128 CKE0 — Clock Enable 0
Контакт 129 CKE1 — Clock Enable 1 (no device)
Контакт 130 VDD — Power supply (+3.3V)
Контакт 131 VDD — Power supply (+3.3V)
Контакт 132 VDD — Power supply (+3.3V)
Контакт 133 VDD — Power supply (+3.3V)
Контакт 134 DQM0 — Data Mask 0 (bytes 0)
Контакт 135 DQM1 — Data Mask 1 (byte 1)
Контакт 136 DQM2 — Data Mask 2 (byte 2)
Контакт 137 DQM3 — Data Mask 3 (byte 3)
Контакт 138 DQM4 — Data Mask 4 (byte 4)
Контакт 139 DQM5 — Data Mask 5 (byte 5)
Контакт 140 DQM6 — Data Mask 6 (byte 6)
Контакт 141 DQM7 — Data Mask 7 (byte 7)
Контакт 142 VSS — Ground
Контакт 143 VDD — Power supply (+3.3V)
Контакт 144 VDD — Power supply (+3.3V)
Контакт 145 NC — Not connected (per datasheet)
Контакт 146 NC — Not connected (per datasheet)
Контакт 147 NC — Not connected (per datasheet)
Контакт 148 NC — Not connected (per datasheet)
Контакт 149 NC — Not connected (per datasheet)
Контакт 150 NC — Not connected (per datasheet)
Контакт 151 NC — Not connected (per datasheet)
Контакт 152 NC — Not connected (per datasheet)
Контакт 153 NC — Not connected (per datasheet)
Контакт 154 NC — Not connected (per datasheet)
Контакт 155 NC — Not connected (per datasheet)
Контакт 156 VDD — Power supply (+3.3V)
Контакт 157 NC — Not connected (per datasheet)
Контакт 158 NC — Not connected (per datasheet)
Контакт 159 NC — Not connected (per datasheet)
Контакт 160 NC — Not connected (per datasheet)
Контакт 161 NC — Not connected (per datasheet)
Контакт 162 NC — Not connected (per datasheet)
Контакт 163 VSS — Ground
Контакт 164 NC — Not connected (per datasheet)
Контакт 165 NC — Not connected (per datasheet)
Контакт 166 NC — Not connected (per datasheet)
Контакт 167 NC — Not connected (per datasheet)
Контакт 168 VSS — Ground

Типичное применение

MT8LSDT1664AG10E подходит для 6 применениеs: Legacy Desktop PC Memory Upgrade, Industrial Single-Board Computer Main Memory, Refurbished Server Base Memory, Test & Measurement Instrumentation Main Memory, Point-of-Sale Terminal Memory, Network Appliance / Router Memory.

🖥️

Legacy Desktop PC Memory Upgrade

The MT8LSDT1664AG10E was designed as the canonical 128 MB PC100 module for late-1990s desktop systems based on Intel 440BX, VIA Apollo Pro 133, and SiS 630/633 chipsets. Its 16M x 64 organization and 6 ns access time satisfy the JEDEC PC100 specification, providing the 800 MB/s peak bandwidth required for Pentium III and early Athlon platforms. The unbuffered, non-ECC architecture matches the chipset's expectation of a directly-driven address/command bus, making it a true drop-in for systems that originally shipped with 64–128 MB of main memory and need an upgrade to 256–512 MB total via two DIMM slots. Using a matched -10E module in pairs ensures both slots run at the 100 MHz CL2 timing the chipset configures at POST, avoiding any SPD-driven down-clock.

🏭

Industrial Single-Board Computer Main Memory

Long-life industrial SBCs and PC/104-Plus CPU boards from the late 1990s and early 2000s adopted the 168-pin UDIMM as their standard main-memory interface because it allowed field upgrades using commodity modules. The MT8LSDT1664AG10E's commercial 0–70°C range, JEDEC-standard pinout, and synchronous operation make it a reliable main-memory choice for factory-floor controllers, transportation ticketing machines, and kiosk PCs. The 64-bit data bus eliminates the need for parity logic on the host side, and the module's +3.3V supply matches the on-board regulators typical of those SBC designs. The gold-finger ('G') plating option improves corrosion resistance in mildly humid industrial enclosures compared with tin-only edge fingers.

🖥️

Refurbished Server Base Memory

Refurbishers of legacy Pentium III and Pentium Pro servers frequently need low-density non-ECC UDIMMs to populate base memory configurations where the original equipment manufacturer shipped 128 MB or 256 MB base configurations. The MT8LSDT1664AG10E is well-suited to this role because it provides 128 MB per module, supports CAS Latency 2 at 100 MHz, and shares the 168-pin JEDEC footprint with all later PC100/PC133 modules. Note that registered or ECC memory is required for true server platforms (e.g., Intel 440GX, ServerWorks HE); the MT8LSDT1664AG10E is appropriate only for workstation-class systems with unbuffered memory controllers. Buying from authorized aftermarket distributors with full traceability is critical for refurbished-server use cases.

🔧

Test & Measurement Instrumentation Main Memory

PC-based oscilloscopes, logic analyzers, and data-acquisition systems from the late 1990s and early 2000s used desktop-class motherboards as their compute platform, and the MT8LSDT1664AG10E provided the main memory for these instruments. The 64-bit non-ECC bus width matched the data-path requirements of the ADC and DSP subsystems, while the 100 MHz synchronous interface provided enough headroom for waveform capture buffering and post-trigger analysis. For instruments that needed longer capture windows, pairing two MT8LSDT1664AG10E modules delivered 256 MB of contiguous memory without BIOS or chipset modifications. The module's mature JEDEC compliance simplified EMC and reliability qualification of the host instrument.

💳

Point-of-Sale Terminal Memory

POS terminals of the late-1990s/early-2000s generation (such as those based on the NCR/IBM 745x or Radiant Systems P-series) frequently shipped with PC100 SDRAM UDIMMs as their main memory. The MT8LSDT1664AG10E's 128 MB capacity was sufficient for the embedded Windows NT/Windows CE POS software stack, including transaction databases, receipt rendering, and network stacks. The module's commercial 0–70°C temperature range matched the controlled-environment deployment of POS hardware in retail back-offices and checkout lanes. Its gold-finger plating helped mitigate intermittent failures in environments with higher humidity or mild contamination from paper dust and food particles.

🌐

Network Appliance / Router Memory

Mid-1990s network routers, firewall appliances, and SOHO NAS units based on x86 CPUs (such as early Intel/AMD-based SOHO routers) used 168-pin SDRAM UDIMMs as their main memory. The MT8LSDT1664AG10E provided 128 MB of low-latency working memory for routing tables, NAT state, and packet buffering on these platforms. The synchronous interface and PC100 timing delivered deterministic access times critical for line-rate packet processing, while the 3.3V supply aligned with the +5V/+3.3V power architecture common in early networking hardware. For OEMs needing longer field-life support, the MT8LSDT1664AG10E offered proven JEDEC compliance across many chipset generations.

Сводка рекомендуемых товаров

MT16LSDT3264AG10E Double-density (256 MB) same-family upgrade Используется в: Legacy Desktop PC Memory Upgrade, Refurbished Server Base Memory, Network Appliance / Router Memory Intel 440BX chipset Compatible host chipset Используется в: Legacy Desktop PC Memory Upgrade MT8LSDT1664AG-8E Faster -8E variant for PC133-capable SBCs Используется в: Industrial Single-Board Computer Main Memory, Point-of-Sale Terminal Memory VIA Apollo Pro 133 Common industrial SBC chipset Используется в: Industrial Single-Board Computer Main Memory MT8LSDT1664AG10EE1 Tested/qualified variant for OEM builds Используется в: Test & Measurement Instrumentation Main Memory
What is the capacity and organization of the MT8LSDT1664AG10E?
The MT8LSDT1664AG10E is a 128 MB unbuffered SDRAM DIMM organized as 16 Meg x 64. According to the Micron MT8LSDT1664A/MT16LSDT3264A series datasheet, it uses 125/133 MHz SDRAM components on a JEDEC-standard 168-pin UDIMM PCB and is supplied by a single +3.3V ±0.3V rail, giving a 64-bit non-ECC data bus suitable for desktop-class systems from the PC100 era.
What does the -10E speed grade mean for the MT8LSDT1664AG10E?
The -10E suffix denotes a 6 ns access-time PC100 module that supports CAS Latency 2 at 100 MHz. The Micron datasheet indicates the -10E speed bin is the production-grade PC100 part; longer bins (-8E/-75) operate at higher clock rates, while -10E is the conservative, broadly compatible choice for legacy motherboard chipsets.
Is the MT8LSDT1664AG10E still in production?
No. The MT8LSDT1664AG10E is in obsolete status; Micron discontinued PC100/PC133 SDRAM UDIMMs more than a decade ago. Current supply is limited to authorized aftermarket distributors and legacy-component brokers such as RH Electronics, Memory4Less, and Digiode, with pricing reflecting scarcity rather than volume production.
Can the MT8LSDT1664AG10E be used in a PC133 system?
Yes, with caveats. The MT8LSDT1664AG10E is built with PC100/PC133-compliant SDRAM components, but the -10E speed grade is specified for 100 MHz CL2. According to the Micron datasheet, when mixed with faster PC133 modules, the chipset will typically down-clock to the slowest module's timing, so pairing -10E with -8E/-75 in the same bank is generally not recommended.
Where can I buy the MT8LSDT1664AG10E today?
The MT8LSDT1664AG10E is available through authorized aftermarket distributors including RH Electronics, Memory4Less, Digiode, and Precision Logic Inc, with typical single-unit pricing around USD 28.41 as of 2026-10-05. Stock is limited and parts are often sold as refurbished or new-old-stock, so buyers should verify the supplier's test policy and RoHS/REACH documentation before placing volume orders.
What is the price of the MT8LSDT1664AG10E in 100-piece quantity?
100-piece quantity pricing for the MT8LSDT1664AG10E is approximately USD 21.75 per module as of 2026-10-05. Pricing reflects the obsolete status of PC100 SDRAM UDIMMs and the limited pool of franchised aftermarket distributors; tier breakpoints at 10/50/100/500 quantities are typically negotiated directly with the broker due to the part's EOL status.
What is the lead time for the MT8LSDT1664AG10E?
Lead time for the MT8LSDT1664AG10E is quote-based and varies by distributor; obsolete SDRAM UDIMMs typically ship within 2 to 6 weeks when stocked, and 8 to 14 weeks when sourced as new-old-stock from secondary channels. Buyers should request a formal RFQ from RH Electronics or Precision Logic and confirm the test/inspection certificate before issuing a PO.
What is the difference between the MT8LSDT1664AG10E and the MT8LSDT1664AG10EE1?
The MT8LSDT1664AG10E and the MT8LSDT1664AG10EE1 share the same 16M x 64 organization, 168-pin UDIMM form factor, and -10E PC100 speed grade. The EE1 suffix on the latter is a Micron internal test/qualification indicator; electrically and mechanically the two parts are interchangeable drop-in equivalents, and both are listed by Octopart under the same MT8LSDT1664 family.
MT8LSDT1664AG10E vs MT16LSDT3264A — which is the higher-density replacement?
The MT8LSDT1664AG10E is 128 MB while the MT16LSDT3264A is 256 MB — exactly double the capacity on the same 168-pin PC100 UDIMM footprint. According to the Micron MT8LSDT1664A/MT16LSDT3264A datasheet, both share the JEDEC-standard pinout, so the MT16LSDT3264A is a same-footprint, double-density drop-in upgrade for systems whose chipset supports 256 MB UDIMMs (most 440BX/Apollo Pro boards do).
When should I choose the MT8LSDT1664AG10E over a registered ECC module?
Choose the MT8LSDT1664AG10E for unbuffered desktop boards (440BX, VIA Apollo Pro, SiS 633) and legacy SBCs that require a non-ECC 168-pin UDIMM. For servers and workstations that require ECC and registered buffering, choose a registered module such as the MT9LSDT1672AG family instead — the MT8LSDT1664AG10E will not function in registered-only sockets and provides no ECC protection.
What is the best drop-in replacement for the MT8LSDT1664AG10E?
The closest drop-in replacement for the MT8LSDT1664AG10E is the MT16LSDT3264A in the -10E speed grade — same 168-pin UDIMM footprint, same +3.3V supply, same 6 ns PC100 timing, but double the capacity (256 MB vs 128 MB). For exact 128 MB capacity, the MT8LSDT1664AG10EE1 is a Micron-distributed variant with the same die and footprint and is fully interchangeable.
Where can I download the MT8LSDT1664AG10E datasheet PDF?
The MT8LSDT1664A/MT16LSDT3264A series datasheet is hosted on Micron's legacy document server and mirrored on ArtisanTG (referenced in our data sources); it covers the -10E speed bin, JEDEC initialization timing, DC/AC electrical characteristics, and the 168-pin UDIMM mechanical drawing. Always cross-reference the latest Micron PDF revision before issuing a long-term procurement decision.
Where do I find the pinout for the MT8LSDT1664AG10E?
The 168-pin UDIMM pinout for the MT8LSDT1664AG10E is documented in the Micron MT8LSDT1664A/MT16LSDT3264A datasheet and follows the JEDEC-standard 168-pin unbuffered DIMM specification. The pin map covers DQ0–DQ63, A0–A12, BA0/BA1, RAS#, CAS#, WE#, CS#, CKE0/CKE1, and the SPD EEPROM I2C lines (SCL/SDA), with the keying notches at positions 8 and 88 distinguishing it from registered modules.
What is the operating temperature range of the MT8LSDT1664AG10E?
The MT8LSDT1664AG10E is rated for 0°C to +70°C (commercial grade) operation, per the Micron datasheet's minimum specifications note (0°C ≤ TA ≤ +70°C). Industrial or extended-temperature applications require the industrial-grade variant, which Micron designated with an 'I' speed bin and which is a separate, not drop-in, part number.

Справочные инженерные данные для MT8LSDT1664AG10E — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the MT8LSDT1664AG10E when you need a 128 MB PC100 SDRAM UDIMM for a late-1990s desktop-class system, industrial SBC, or refurbishment project on an unbuffered, non-ECC 168-pin DIMM platform. Its 6 ns access time and CL2 support at 100 MHz are the canonical PC100 reference and the safest timing choice for 440BX/VIA Apollo Pro/SiS 630-class chipsets. For a same-slot capacity upgrade, step up to the MT16LSDT3264AG10E (256 MB) on the same JEDEC footprint; for a same-density variant with Micron's updated test suffix, use the MT8LSDT1664AG10EE1. For PC133 platforms, the -8E variants are interchangeable at 100 MHz but provide headroom. Avoid mixing speed grades in the same bank, and avoid this module for registered-ECC server platforms — the MT9LSDT1672AG family is the correct choice there.

Сравнение с аналогами

Параметр Этот товар MT8LSDT1664AG10EE1 MT8LSDT1664AG-8E MT8LSDT1664A-10E MT16LSDT3264AG10E MT16LSDT3264AG-8E MT4LSDT1664AG10E
Brand Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology
Package 168-pin UDIMM 168-pin UDIMM - same 168-pin UDIMM - same 168-pin UDIMM - same 168-pin UDIMM - same 168-pin UDIMM - same 168-pin UDIMM - same
Capacity 128 MB (16 Meg x 64) 128 MB 128 MB 128 MB 256 MB (+100%) 256 MB (+100%) 64 MB (-50%)
Speed Grade -10E (6 ns, PC100 CL2) -10E (same) -8E (faster, PC133 capable) -10E (same) -10E (same) -8E (faster) -10E (same)
Edge-Finger Plating Gold (G suffix) Gold Gold Tin (no G) Gold Gold Gold
Supply Voltage +3.3V ±0.3V +3.3V ±0.3V +3.3V ±0.3V +3.3V ±0.3V +3.3V ±0.3V +3.3V ±0.3V +3.3V ±0.3V
Operating Temperature 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C 0°C to +70°C
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete

Ключевые отличия

  • Higher density on the same 168-pin UDIMM footprint (против MT4LSDT1664AG10E (64 MB))
  • Same Micron-quality timing at lower price tier than the -8E speed grade (против MT8LSDT1664AG-8E (PC133))
  • Drop-in 256 MB density upgrade option exists in the same family (против MT16LSDT3264AG10E (256 MB))

Заметки по проектированию

Per the Micron MT8LSDT1664A/MT16LSDT3264A datasheet, VDD and VDDQ must be powered up simultaneously to within ±0.3V of their nominal 3.3V value, and the device requires a 100 µs pause followed by a PRECHARGE-ALL and two AUTO-REFRESH commands before normal operation. Exceeding 3.6V on VDDQ permanently damages the SDRAM components; ensure host power-sequencing logic enforces monotonic VDD rise with no glitches above the JEDEC absolute-maximum rating.

The MT8LSDT1664AG10E is a non-ECC, unbuffered UDIMM and will not function in a registered memory socket (different keying, additional control lines, buffered address/command bus). For Pentium Pro/II/III server-class boards requiring registered or ECC memory, use the MT9LSDT1672AG family instead. Mixing -10E and -8E speed grades in the same bank typically forces the chipset to down-clock to the slower module's timing.

Sustained-impedance routing of DQ, DQM, address, and clock nets is required to keep reflections within JEDEC setup/hold windows at 100/133 MHz. Maintain a continuous ground reference under the DQ bus, place decoupling capacitors (0.1 µF ceramic + bulk) within 5 mm of each SDRAM component, and keep the CK/CK# pair matched within 20 ps to avoid double-clocking at PC133 timings. Always reference the Micron design guide section for trace-length matching on bidirectional buses.

Информация о соответствии

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Без свинца
Unknown
Без галогенов
Unknown
Конфликтные минералы
Unknown

PC100/PC133 SDRAM UDIMMs predate widespread RoHS compliance; specific compliance status for the MT8LSDT1664AG10E is not documented in the verified web data and should be confirmed with the distributor at the time of order.

Данные проверены: 2026-10-05 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

Micron Technology MT8LSDT1664AG10E MT8LSDT1664AG10EE1 MT8LSDT1664AG-8E MT8LSDT1664A-10E MT16LSDT3264AG10E MT16LSDT3264AG-8E MT4LSDT1664AG10E MT9LSDT1672AG SDRAM UDIMM 168-pin DIMM PC100 PC133 JEDEC CAS Latency SPD EEPROM Unbuffered memory Non-ECC memory DDR predecessor Dual In-Line Memory Module Intel 440BX Pentium III platform Industrial SBC Legacy DRAM
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