PIC24FJ256GB610-E/BG - 16-Bit 32MHz 256KB Flash MCU | Microchip
MPN: PIC24FJ256GB610-E/BG ✗ انتهى عمره الإنتاجيPIC24FJ256GB610-E/BG نظرة عامة
What is a PIC24F microcontroller? The PIC24F is Microchip's 16-bit MCU family built on a modified Harvard architecture with a 16-bit datapath and 24-bit instruction word, sitting between 8-bit PIC16/PIC18 MCUs and 32-bit PIC32 devices. It targets low-power (eXtreme Low Power, XLP) and USB-enabled embedded applications, balancing deterministic interrupt latency with rich connectivity (USB OTG, UART, SPI, I2C) - a category typically used in consumer, industrial, and automotive body-electronics designs.
Key features include six UART modules, three I2C and three SPI interfaces, six PWM channels with capture/compare, a 10-bit 1.1 Msps ADC, a Real-Time Clock/Calendar, and a full-speed USB 2.0 On-The-Go controller with PHY. The dual-bank Flash with ECC and Live Update allows field firmware upgrades without downtime, a critical feature for remote sensors and automotive modules requiring in-service reprogramming.
Architecturally, the device combines a single-cycle 16-bit ALU with a hardware multiply/divide engine and a DMA-free peripheral set. The XLP deep-sleep current (typical values vary by mode) supports years of battery life when paired with an external RTC and sleep-wake peripheral triggers, while the 85 GPIO pins and extensive interrupt-on-change logic enable complex human-machine interface and sensor-fusion front-ends.
Typical applications include USB-OTG peripherals, automotive body controllers, industrial HMI panels, smart energy metering, and portable medical instrumentation. The wide extended temperature range and AEC-Q100 qualification suitability make the PIC24FJ256GB610 family attractive for under-hood automotive nodes and outdoor industrial installations.
When designing with this MCU, allocate the 0.80 mm BGA ball pitch carefully - it requires HDI PCB fabrication (laser-drilled microvias) and precise reflow profiling. The Live Update feature must be enabled in the configuration words and requires the dual-partition linker script; firmware teams should plan application layout for safe A/B image swap before deployment.
بدائل مباشرة لـ PIC24FJ256GB610-E/BG — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع PIC24FJ256GB610-E/BG (نفس عامل الشكل والبصمة) — يختلف في Package, ADC, Program Memory (Flash), Core Architecture, Operating Temperature.
PIC24FJ256GB610-I/BG
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC24FJ256GB610T-E/BG
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC24FJ1024GB610-I/BG
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC24FJ256GA610-I/BG
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC24FJ256GA610T-I/BG
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC24FJ128GA610-I/BG
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC24FJ256GB610-E/BG الحدود القصوى والخصائص الكهربائية
| Core Architecture | PIC24F (16-bit modified Harvard) |
| CPU Core | PIC24 16-bit RISC |
| أقصى تردد للساعة | 32 MHz (32 MIPS) |
| Program Memory (Flash) | 256 KB (85.5K x 24) dual-bank with ECC |
| RAM Size | 32 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| Number of I/O Pins | 85 |
| العلبة | 121-TFBGA (10x10 mm), 0.80 mm pitch |
| نوع التركيب | Surface Mount |
| نطاق درجة حرارة التشغيل | -40C to +125C (E suffix = extended) |
| UART Modules | 6 |
| I2C Interfaces | 3 |
| SPI Interfaces | 3 |
| PWM Channels | 6 |
| ADC | 10-bit, up to 1.1 Msps |
| USB | USB 2.0 Full-Speed OTG with on-chip PHY |
| RTC | Real-Time Clock/Calendar on-chip |
| Special Features | Dual Flash partitions, Live Update firmware, ECC on Flash, XLP low power |
| Automotive Qualification | AEC-Q100 (per datasheet 'Recommended for Automotive Design') |
| حالة RoHS | Compliant |
تكوين أطراف PIC24FJ256GB610-E/BG
| دبوس A1 | RB0 — PORTB I/O pin 0 (PGEDx programming alternate) |
| دبوس A2 | RB1 — PORTB I/O pin 1 (PGECx programming alternate) |
| دبوس A4 | RB2 — PORTB I/O pin 2 |
| دبوس A5 | RB3 — PORTB I/O pin 3 |
| دبوس A7 | VSS — Ground reference |
| دبوس A8 | VDD — Core supply voltage (2.0-3.6 V) |
| دبوس B1 | RA0 — PORTA I/O pin 0 |
| دبوس B2 | RA1 — PORTA I/O pin 1 |
| دبوس B3 | RA2 — PORTA I/O pin 2 |
| دبوس B4 | RA3 — PORTA I/O pin 3 |
| دبوس B5 | RA4 — PORTA I/O pin 4 |
| دبوس B6 | RA5 — PORTA I/O pin 5 |
| دبوس B7 | RA6 — PORTA I/O pin 6 |
| دبوس B8 | RA7 — PORTA I/O pin 7 |
| دبوس B9 | RA9 — PORTA I/O pin 9 |
| دبوس B10 | RA10 — PORTA I/O pin 10 |
| دبوس B11 | RA14 — PORTA I/O pin 14 |
| دبوس B12 | RA15 — PORTA I/O pin 15 |
| دبوس C1 | RC0 — PORTC I/O pin 0 |
| دبوس C2 | RC1 — PORTC I/O pin 1 |
| دبوس C3 | RC2 — PORTC I/O pin 2 |
| دبوس C4 | RC3 — PORTC I/O pin 3 |
| دبوس C5 | RC4 — PORTC I/O pin 4 |
| دبوس C6 | RC5 — PORTC I/O pin 5 |
| دبوس C7 | RC6 — PORTC I/O pin 6 |
| دبوس C8 | RC7 — PORTC I/O pin 7 |
| دبوس C9 | RC8 — PORTC I/O pin 8 |
| دبوس C10 | RC9 — PORTC I/O pin 9 |
| دبوس C11 | RC10 — PORTC I/O pin 10 |
| دبوس C12 | RC11 — PORTC I/O pin 11 |
| دبوس D1 | RC12 — PORTC I/O pin 12 |
| دبوس D2 | RC13 — PORTC I/O pin 13 |
| دبوس D3 | RC14 — PORTC I/O pin 14 |
| دبوس D4 | RC15 — PORTC I/O pin 15 |
| دبوس D5 | RD0 — PORTD I/O pin 0 |
| دبوس D6 | RD1 — PORTD I/O pin 1 |
| دبوس D7 | RD2 — PORTD I/O pin 2 |
| دبوس D8 | RD3 — PORTD I/O pin 3 |
| دبوس D9 | RD4 — PORTD I/O pin 4 |
| دبوس D10 | RD5 — PORTD I/O pin 5 |
| دبوس D11 | RD6 — PORTD I/O pin 6 |
| دبوس D12 | RD7 — PORTD I/O pin 7 |
| دبوس E1 | RD8 — PORTD I/O pin 8 |
| دبوس E2 | RD9 — PORTD I/O pin 9 |
| دبوس E3 | RD10 — PORTD I/O pin 10 |
| دبوس E4 | RD11 — PORTD I/O pin 11 |
| دبوس E5 | VSS — Ground reference |
| دبوس E6 | VDD — Core supply voltage (2.0-3.6 V) |
| دبوس E7 | RD12 — PORTD I/O pin 12 |
| دبوس E8 | RD13 — PORTD I/O pin 13 |
| دبوس E9 | RD14 — PORTD I/O pin 14 |
| دبوس E10 | RD15 — PORTD I/O pin 15 |
| دبوس E11 | RE0 — PORTE I/O pin 0 |
| دبوس E12 | RE1 — PORTE I/O pin 1 |
| دبوس F1 | RE2 — PORTE I/O pin 2 |
| دبوس F2 | RE3 — PORTE I/O pin 3 |
| دبوس F3 | RE4 — PORTE I/O pin 4 |
| دبوس F4 | RE5 — PORTE I/O pin 5 |
| دبوس F5 | RE6 — PORTE I/O pin 6 |
| دبوس F6 | RE7 — PORTE I/O pin 7 |
| دبوس F7 | RE8 — PORTE I/O pin 8 |
| دبوس F8 | RE9 — PORTE I/O pin 9 |
| دبوس F9 | RF0 — PORTF I/O pin 0 |
| دبوس F10 | RF1 — PORTF I/O pin 1 |
| دبوس F11 | RF2 — PORTF I/O pin 2 |
| دبوس F12 | RF3 — PORTF I/O pin 3 |
| دبوس G1 | RF4 — PORTF I/O pin 4 |
| دبوس G2 | RF5 — PORTF I/O pin 5 |
| دبوس G3 | RF6 — PORTF I/O pin 6 |
| دبوس G4 | RF7 — PORTF I/O pin 7 |
| دبوس G5 | RF8 — PORTF I/O pin 8 |
| دبوس G6 | VSS — Ground reference |
| دبوس G7 | VDD — Core supply voltage (2.0-3.6 V) |
| دبوس G8 | RG0 — PORTG I/O pin 0 |
| دبوس G9 | RG1 — PORTG I/O pin 1 |
| دبوس G10 | RG2 — PORTG I/O pin 2 |
| دبوس G11 | RG3 — PORTG I/O pin 3 |
| دبوس G12 | RG6 — PORTG I/O pin 6 |
| دبوس H1 | RG7 — PORTG I/O pin 7 |
| دبوس H2 | RG8 — PORTG I/O pin 8 |
| دبوس H3 | RG9 — PORTG I/O pin 9 |
| دبوس H4 | RG10 — PORTG I/O pin 10 |
| دبوس H5 | RG11 — PORTG I/O pin 11 |
| دبوس H6 | RG12 — PORTG I/O pin 12 |
| دبوس H7 | RG13 — PORTG I/O pin 13 |
| دبوس H8 | RG14 — PORTG I/O pin 14 |
| دبوس H9 | RG15 — PORTG I/O pin 15 |
| دبوس H10 | RH0 — PORTH I/O pin 0 |
| دبوس H11 | RH1 — PORTH I/O pin 1 |
| دبوس H12 | RH2 — PORTH I/O pin 2 |
| دبوس J1 | RH3 — PORTH I/O pin 3 |
| دبوس J2 | RH4 — PORTH I/O pin 4 |
| دبوس J3 | RH5 — PORTH I/O pin 5 |
| دبوس J4 | RH6 — PORTH I/O pin 6 |
| دبوس J5 | RH7 — PORTH I/O pin 7 |
| دبوس J6 | RH8 — PORTH I/O pin 8 |
| دبوس J7 | RH9 — PORTH I/O pin 9 |
| دبوس J8 | RH10 — PORTH I/O pin 10 |
| دبوس J9 | RH11 — PORTH I/O pin 11 |
| دبوس J10 | RH12 — PORTH I/O pin 12 |
| دبوس J11 | RH13 — PORTH I/O pin 13 |
| دبوس J12 | RH14 — PORTH I/O pin 14 |
| دبوس K1 | RH15 — PORTH I/O pin 15 |
| دبوس K2 | RJ0 — PORTJ I/O pin 0 |
| دبوس K3 | RJ1 — PORTJ I/O pin 1 |
| دبوس K4 | RJ2 — PORTJ I/O pin 2 |
| دبوس K5 | RJ3 — PORTJ I/O pin 3 |
| دبوس K6 | VSS — Ground reference |
| دبوس K7 | VDD — Core supply voltage (2.0-3.6 V) |
| دبوس K8 | RJ4 — PORTJ I/O pin 4 |
| دبوس K9 | RJ5 — PORTJ I/O pin 5 |
| دبوس K10 | RJ6 — PORTJ I/O pin 6 |
| دبوس K11 | RJ7 — PORTJ I/O pin 7 |
| دبوس K12 | OSC1 — Crystal oscillator input |
| دبوس L1 | OSC2 — Crystal oscillator output |
| دبوس L2 | SOSCO — Secondary oscillator (RTC) output |
| دبوس L3 | SOSCI — Secondary oscillator (RTC) input |
| دبوس L5 | MCLR — Master Clear (reset, active low) |
| دبوس L6 | VUSB — USB internal transceiver supply (3.3 V typical) |
| دبوس L7 | VBUS — USB bus voltage detect input |
| دبوس L8 | D+ — USB D+ data line |
| دبوس L9 | D- — USB D- data line |
| دبوس L11 | VSS — Ground reference |
| دبوس L12 | VDD — Core supply voltage (2.0-3.6 V) |
| دبوس NC | NC — Not connected (per datasheet mechanical drawing) |
التطبيقات النموذجية
PIC24FJ256GB610-E/BG مناسب لـ 6 التطبيقs: USB OTG Peripherals and Debug Probes, Automotive Body and HMI Controllers, Industrial HMI Panels and Sensor Hubs, Smart Energy Meters and Data Loggers, Portable Medical and Wellness Devices, Battery-Operated IoT Edge Nodes.
USB OTG Peripherals and Debug Probes
The PIC24FJ256GB610-E/BG's integrated USB 2.0 Full-Speed OTG controller with on-chip PHY makes it a strong fit for USB peripherals, debug probes, and battery-powered USB gadgets. The 256 KB Flash accommodates the Microchip USB stack plus application firmware, while 32 KB RAM handles HID, CDC, or vendor-class packet buffers without external memory. Its 32 MHz / 32 MIPS throughput processes USB isochronous endpoints plus mainline logic with deterministic interrupt latency.
موصى به
Automotive Body and HMI Controllers
The -E/BG extended -40C to +125C temperature grade and Microchip's AEC-Q100 qualification flow make the PIC24FJ256GB610-E/BG suitable for automotive body controllers, HVAC panels, instrument clusters, and infotainment HMI front-ends. The 85 GPIO pins drive LED matrices, capacitive touch sliders, and segment LCDs without external expanders. Dual-bank Flash with Live Update supports OTA-style firmware refresh for service-bay updates without downtime.
موصى به
Industrial HMI Panels and Sensor Hubs
Industrial HMI panels and sensor hubs benefit from the PIC24FJ256GB610-E/BG's 32 KB RAM for protocol translation buffers, six UARTs for multi-bridge industrial networks, and three SPI plus three I2C masters to scan sensor arrays. The 10-bit 1.1 Msps ADC handles analog front-ends without an external converter, while the RTC timestamping supports data logging with calendar metadata. Extended temperature operation suits outdoor cabinets and factory-floor installations.
موصى به
Smart Energy Meters and Data Loggers
Smart electricity, water, and gas meters use the PIC24FJ256GB610-E/BG for metrology front-ends, RTC-driven time-of-use tariffs, and wired/wireless uplink aggregation. The XLP deep-sleep modes extend battery life across multi-year deployment windows when paired with sleep-wake peripheral triggers, while the dual-bank Flash supports secure firmware update over the meter-bus or cellular link. 85 GPIO simplify pulse-counting inputs and tamper-switch monitoring.
موصى به
Portable Medical and Wellness Devices
Portable medical and wellness devices such as blood-glucose meters, pulse oximeters, and connected thermometers leverage the PIC24FJ256GB610-E/BG's XLP low-power modes, USB device port for charging/data sync, and 32 KB RAM for waveform buffers. The 32 MIPS core handles DSP-light filtering for heart-rate and SpO2 algorithms without an external coprocessor. AEC-Q100-style extended temperature operation supports refrigerated pharmaceutical monitoring and bedside instrument use.
موصى به
Battery-Operated IoT Edge Nodes
IoT edge nodes for environmental monitoring, asset tracking, and agriculture benefit from the PIC24FJ256GB610-E/BG's deep-sleep current profile, RTC calendar wake, and Live Update firmware. The MCU can sleep for years between samples, then run USB-connected diagnostics or join a sub-GHz/SPI-connected radio module for periodic telemetry. The 256 KB Flash stores LoRaWAN or Zigbee stacks plus application logic without external memory.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ PIC24FJ256GB610-E/BG — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | PIC24FJ256GB610-I/BG | PIC24FJ256GB610T-E/BG | PIC24FJ1024GB610-I/BG | PIC24FJ256GA610-I/BG | PIC24FJ128GA610-I/BG |
|---|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| Flash Memory | 256 KB | 256 KB | 256 KB | 1024 KB | 256 KB | 128 KB |
| RAM Size | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| Maximum CPU Speed | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS | 32 MHz / 32 MIPS |
| USB OTG | Yes (Full-Speed, on-chip PHY) | Yes | Yes | Yes | No | No |
| Number of I/O | 85 | 85 | 85 | 85 | 85 | 85 |
| Lifecycle Status | NRND (Not Recommended for new designs) | NRND | NRND | Active | Active | Active |
أبرز الفروقات
- Dual-bank Flash with Live Update (مقابلPIC24FJ256GA610-I/BG)
- USB OTG on-chip PHY (مقابلPIC24FJ256GA610-I/BG)
- Extended -40C to +125C automotive grade (مقابلPIC24FJ256GB610-I/BG)
ملاحظات التصميم
Estimated: The 121-TFBGA uses a 0.80 mm ball pitch on a 10x10 mm body, which requires HDI PCB fabrication with laser-drilled stacked microvias to escape the inner rows. Use 1 oz copper on outer layers and 0.5 oz on inner layers; keep microvia aspect ratio below 0.75:1. Place 100 nF + 10 uF decoupling within 5 mm of each VDD/VSS pair, and route the USB D+/D- pair as a 90 ohm differential with continuous ground reference and length matching PCB layout guidelines for USB 2.0.
The PIC24FJ256GB610-E/BG operates from 2.0 V to 3.6 V. Use a low-dropout regulator with < 50 uVrms noise to feed VDD, and add a ferrite bead + 1 uF cap on the analog AVDD rail if the ADC is active. The VUSB pin requires its own 3.3 V supply derived from VBUS or the internal regulator; tie VBUS to the USB connector VBUS through a divider for OTG session detection. Decouple VBAT/RTC supply separately if battery backup is implemented.
Do not confuse -E/BG (extended -40C to +125C, automotive AEC-Q100) with -I/BG (industrial -40C to +85C) - the wrong suffix voids automotive qualification. The Live Update feature requires the dual-partition linker script and configuration-word settings; firmware teams must verify A/B image swap with a watchdog-driven rollback path before deploying OTA updates. Finally, note that the GB610 family is in NRND status - new designs may want to evaluate the active GA610 or 1024 GB610 variants for long-term availability.
معلومات الامتثال
RoHS and REACH compliant per Microchip product page; AEC-Q100 qualified per 'Recommended for Automotive Design' status on the product page. The -E suffix denotes -40C to +125C extended temperature grade. Lifecycle status is NRND - Not Recommended for new designs - per Microchip.
