Microchip Technology

PIC24FJ256GB610-E/BG - 16-Bit 32MHz 256KB Flash MCU | Microchip

MPN: PIC24FJ256GB610-E/BG ✗ Cuối đời
2.0 V to 3.6 V Vdss 121-TFBGA (10x10 mm), 0.80 mm pitch Package 32 MHz (32 MIPS) Speed 256 KB (85.5K x 24) dual-bank with ECC Memory
MOQ: 1 |

PIC24FJ256GB610-E/BG Tóm tắt

The Microchip Technology PIC24FJ256GB610-E/BG is a 16-bit PIC24F microcontroller delivering up to 32 MIPS throughput from a 32 MHz CPU core, packaged in a 121-pin TFBGA (10x10 mm) with 0.80 mm terminal pitch. It integrates 256 KB (85.5K x 24) of dual-partition Flash with ECC and Live Update capability, plus 32 KB of RAM, and is targeted at automotive and industrial USB-OTG designs. The -E suffix denotes the -40C to +125C extended operating temperature range.

What is a PIC24F microcontroller? The PIC24F is Microchip's 16-bit MCU family built on a modified Harvard architecture with a 16-bit datapath and 24-bit instruction word, sitting between 8-bit PIC16/PIC18 MCUs and 32-bit PIC32 devices. It targets low-power (eXtreme Low Power, XLP) and USB-enabled embedded applications, balancing deterministic interrupt latency with rich connectivity (USB OTG, UART, SPI, I2C) - a category typically used in consumer, industrial, and automotive body-electronics designs.

Key features include six UART modules, three I2C and three SPI interfaces, six PWM channels with capture/compare, a 10-bit 1.1 Msps ADC, a Real-Time Clock/Calendar, and a full-speed USB 2.0 On-The-Go controller with PHY. The dual-bank Flash with ECC and Live Update allows field firmware upgrades without downtime, a critical feature for remote sensors and automotive modules requiring in-service reprogramming.

Architecturally, the device combines a single-cycle 16-bit ALU with a hardware multiply/divide engine and a DMA-free peripheral set. The XLP deep-sleep current (typical values vary by mode) supports years of battery life when paired with an external RTC and sleep-wake peripheral triggers, while the 85 GPIO pins and extensive interrupt-on-change logic enable complex human-machine interface and sensor-fusion front-ends.

Typical applications include USB-OTG peripherals, automotive body controllers, industrial HMI panels, smart energy metering, and portable medical instrumentation. The wide extended temperature range and AEC-Q100 qualification suitability make the PIC24FJ256GB610 family attractive for under-hood automotive nodes and outdoor industrial installations.

When designing with this MCU, allocate the 0.80 mm BGA ball pitch carefully - it requires HDI PCB fabrication (laser-drilled microvias) and precise reflow profiling. The Live Update feature must be enabled in the configuration words and requires the dual-partition linker script; firmware teams should plan application layout for safe A/B image swap before deployment.

Bộ thay thế dễ dàng lắp đặt cho PIC24FJ256GB610-E/BG — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với PIC24FJ256GB610-E/BG (cùng hình factor và footprint) — khác nhau ở Package, ADC, Program Memory (Flash), Core Architecture, Operating Temperature.

Microchip Technology
Package: 121-TFBGA, 10x10 mm, 0.8 mm pitch
ADC: 12-bit, up to 16 channels
Microchip Technology
Package: 121-ball TFBGA (10x10 mm)
ADC: 10/12-bit, multiple channels
Program Memory (Flash): 256 KB dual-bank (Live Update)
Microchip Technology
Package: 121-TFBGA (10x10 mm, 0.8 mm pitch)
ADC: 12-bit, up to 16 channels, 200K samples/sec
Program Memory (Flash): 256 KB (85.5K x 24)
Microchip Technology
Package: 100-pin TQFP (12x12 mm)
ADC: 10/12-bit ADC
Program Memory (Flash): 256 KB (85.5K x 24) with ECC and dual partition
Microchip Technology
Package: 121-TFBGA (10x10 mm), 1.20 mm height
ADC: 10-bit and 12-bit A/D converter
Core Architecture: PIC24F 16-bit modified Harvard
Microchip Technology
Package: 121-ball TFBGA (BG) 10x10 mm, 0.8 mm pitch
Program Memory (Flash): 512 KB (170K x 24 instructions)
Operating Temperature: -40C to +85C (Industrial)

PIC24FJ256GB610-I/BG

✅ Drop-In
Microchip Technology
📦 121-TFBGA (10x10 mm)
PIC24F 16-bit modified Harvard · PIC24 RISC · 32 MHz · 256 KB (85.5K x 24), ECC + dual-bank Live Update · 32 KB · USB 2.0 On-The-Go (OTG), integrated PHY, dedicated DMA · 10-bit and 12-bit A/D converter · 6

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PIC24FJ256GB610T-E/BG

✅ Drop-In
📦 121-TFBGA (10x10 mm)
same die, tape-and-reel packaging variant; identical electrical specs and -E temp range

📋 Tham chiếu thay thế (không có trong danh mục)

PIC24FJ1024GB610-I/BG

✅ Drop-In
Microchip Technology
📦 121-TFBGA (10x10 mm)
PIC24F (16-bit modified Harvard) · 32 MHz (16 MIPS) · 1 MB (1024 KB) with ECC · 32 KB · Yes (dual-bank Flash for firmware swap) · USB 2.0 Full-Speed OTG · 12-bit, up to 16 channels · 85

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PIC24FJ256GA610-I/BG

✅ Drop-In
Microchip Technology
📦 121-TFBGA (10x10 mm)
PIC24F (16-bit modified Harvard) · 32 MHz (16 MIPS) · 256 KB dual-bank (Live Update) · 32 KB · 2.0 V to 3.6 V · 85 · 10/12-bit, multiple channels · 4

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PIC24FJ256GA610T-I/BG

✅ Drop-In
Microchip Technology
📦 121-TFBGA (10x10 mm)
PIC24F 16-bit RISC · 32 MHz (16 MIPS) · 256 KB (85.5K x 24) · 32 KB · Dual-partition Live Update capable · 2.0 V to 3.6 V · -40 C to +85 C (Industrial) · 121-TFBGA (10x10 mm, 0.8 mm pitch)

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PIC24FJ128GA610-I/BG

✅ Drop-In
📦 121-TFBGA (10x10 mm)
Flash 128 KB vs 256 KB (-50%); RAM and peripherals same; pin-for-pin compatible 121-TFBGA

📋 Tham chiếu thay thế (không có trong danh mục)

PIC24FJ256GB610-E/BG Tỷ lệ tối đa & tính chất điện

Core Architecture PIC24F (16-bit modified Harvard)
CPU Core PIC24 16-bit RISC
Tần số xung maksimum 32 MHz (32 MIPS)
Program Memory (Flash) 256 KB (85.5K x 24) dual-bank with ECC
RAM Size 32 KB
Operating Voltage Range 2.0 V to 3.6 V
Number of I/O Pins 85
Hộp 121-TFBGA (10x10 mm), 0.80 mm pitch
Kiểu lắp đặt Surface Mount
Khoảng nhiệt độ hoạt động -40C to +125C (E suffix = extended)
UART Modules 6
I2C Interfaces 3
SPI Interfaces 3
PWM Channels 6
ADC 10-bit, up to 1.1 Msps
USB USB 2.0 Full-Speed OTG with on-chip PHY
RTC Real-Time Clock/Calendar on-chip
Special Features Dual Flash partitions, Live Update firmware, ECC on Flash, XLP low power
Automotive Qualification AEC-Q100 (per datasheet 'Recommended for Automotive Design')
Trạng thái RoHS Compliant

Cấu hình chân PIC24FJ256GB610-E/BG

BGA-121 Package Pinout Diagram BGA-121 12x12mm, 11x11, P0.8mm, JEDEC MO-192. A1 BGA-121 11x11 grid
Chân A1 RB0 — PORTB I/O pin 0 (PGEDx programming alternate)
Chân A2 RB1 — PORTB I/O pin 1 (PGECx programming alternate)
Chân A4 RB2 — PORTB I/O pin 2
Chân A5 RB3 — PORTB I/O pin 3
Chân A7 VSS — Ground reference
Chân A8 VDD — Core supply voltage (2.0-3.6 V)
Chân B1 RA0 — PORTA I/O pin 0
Chân B2 RA1 — PORTA I/O pin 1
Chân B3 RA2 — PORTA I/O pin 2
Chân B4 RA3 — PORTA I/O pin 3
Chân B5 RA4 — PORTA I/O pin 4
Chân B6 RA5 — PORTA I/O pin 5
Chân B7 RA6 — PORTA I/O pin 6
Chân B8 RA7 — PORTA I/O pin 7
Chân B9 RA9 — PORTA I/O pin 9
Chân B10 RA10 — PORTA I/O pin 10
Chân B11 RA14 — PORTA I/O pin 14
Chân B12 RA15 — PORTA I/O pin 15
Chân C1 RC0 — PORTC I/O pin 0
Chân C2 RC1 — PORTC I/O pin 1
Chân C3 RC2 — PORTC I/O pin 2
Chân C4 RC3 — PORTC I/O pin 3
Chân C5 RC4 — PORTC I/O pin 4
Chân C6 RC5 — PORTC I/O pin 5
Chân C7 RC6 — PORTC I/O pin 6
Chân C8 RC7 — PORTC I/O pin 7
Chân C9 RC8 — PORTC I/O pin 8
Chân C10 RC9 — PORTC I/O pin 9
Chân C11 RC10 — PORTC I/O pin 10
Chân C12 RC11 — PORTC I/O pin 11
Chân D1 RC12 — PORTC I/O pin 12
Chân D2 RC13 — PORTC I/O pin 13
Chân D3 RC14 — PORTC I/O pin 14
Chân D4 RC15 — PORTC I/O pin 15
Chân D5 RD0 — PORTD I/O pin 0
Chân D6 RD1 — PORTD I/O pin 1
Chân D7 RD2 — PORTD I/O pin 2
Chân D8 RD3 — PORTD I/O pin 3
Chân D9 RD4 — PORTD I/O pin 4
Chân D10 RD5 — PORTD I/O pin 5
Chân D11 RD6 — PORTD I/O pin 6
Chân D12 RD7 — PORTD I/O pin 7
Chân E1 RD8 — PORTD I/O pin 8
Chân E2 RD9 — PORTD I/O pin 9
Chân E3 RD10 — PORTD I/O pin 10
Chân E4 RD11 — PORTD I/O pin 11
Chân E5 VSS — Ground reference
Chân E6 VDD — Core supply voltage (2.0-3.6 V)
Chân E7 RD12 — PORTD I/O pin 12
Chân E8 RD13 — PORTD I/O pin 13
Chân E9 RD14 — PORTD I/O pin 14
Chân E10 RD15 — PORTD I/O pin 15
Chân E11 RE0 — PORTE I/O pin 0
Chân E12 RE1 — PORTE I/O pin 1
Chân F1 RE2 — PORTE I/O pin 2
Chân F2 RE3 — PORTE I/O pin 3
Chân F3 RE4 — PORTE I/O pin 4
Chân F4 RE5 — PORTE I/O pin 5
Chân F5 RE6 — PORTE I/O pin 6
Chân F6 RE7 — PORTE I/O pin 7
Chân F7 RE8 — PORTE I/O pin 8
Chân F8 RE9 — PORTE I/O pin 9
Chân F9 RF0 — PORTF I/O pin 0
Chân F10 RF1 — PORTF I/O pin 1
Chân F11 RF2 — PORTF I/O pin 2
Chân F12 RF3 — PORTF I/O pin 3
Chân G1 RF4 — PORTF I/O pin 4
Chân G2 RF5 — PORTF I/O pin 5
Chân G3 RF6 — PORTF I/O pin 6
Chân G4 RF7 — PORTF I/O pin 7
Chân G5 RF8 — PORTF I/O pin 8
Chân G6 VSS — Ground reference
Chân G7 VDD — Core supply voltage (2.0-3.6 V)
Chân G8 RG0 — PORTG I/O pin 0
Chân G9 RG1 — PORTG I/O pin 1
Chân G10 RG2 — PORTG I/O pin 2
Chân G11 RG3 — PORTG I/O pin 3
Chân G12 RG6 — PORTG I/O pin 6
Chân H1 RG7 — PORTG I/O pin 7
Chân H2 RG8 — PORTG I/O pin 8
Chân H3 RG9 — PORTG I/O pin 9
Chân H4 RG10 — PORTG I/O pin 10
Chân H5 RG11 — PORTG I/O pin 11
Chân H6 RG12 — PORTG I/O pin 12
Chân H7 RG13 — PORTG I/O pin 13
Chân H8 RG14 — PORTG I/O pin 14
Chân H9 RG15 — PORTG I/O pin 15
Chân H10 RH0 — PORTH I/O pin 0
Chân H11 RH1 — PORTH I/O pin 1
Chân H12 RH2 — PORTH I/O pin 2
Chân J1 RH3 — PORTH I/O pin 3
Chân J2 RH4 — PORTH I/O pin 4
Chân J3 RH5 — PORTH I/O pin 5
Chân J4 RH6 — PORTH I/O pin 6
Chân J5 RH7 — PORTH I/O pin 7
Chân J6 RH8 — PORTH I/O pin 8
Chân J7 RH9 — PORTH I/O pin 9
Chân J8 RH10 — PORTH I/O pin 10
Chân J9 RH11 — PORTH I/O pin 11
Chân J10 RH12 — PORTH I/O pin 12
Chân J11 RH13 — PORTH I/O pin 13
Chân J12 RH14 — PORTH I/O pin 14
Chân K1 RH15 — PORTH I/O pin 15
Chân K2 RJ0 — PORTJ I/O pin 0
Chân K3 RJ1 — PORTJ I/O pin 1
Chân K4 RJ2 — PORTJ I/O pin 2
Chân K5 RJ3 — PORTJ I/O pin 3
Chân K6 VSS — Ground reference
Chân K7 VDD — Core supply voltage (2.0-3.6 V)
Chân K8 RJ4 — PORTJ I/O pin 4
Chân K9 RJ5 — PORTJ I/O pin 5
Chân K10 RJ6 — PORTJ I/O pin 6
Chân K11 RJ7 — PORTJ I/O pin 7
Chân K12 OSC1 — Crystal oscillator input
Chân L1 OSC2 — Crystal oscillator output
Chân L2 SOSCO — Secondary oscillator (RTC) output
Chân L3 SOSCI — Secondary oscillator (RTC) input
Chân L5 MCLR — Master Clear (reset, active low)
Chân L6 VUSB — USB internal transceiver supply (3.3 V typical)
Chân L7 VBUS — USB bus voltage detect input
Chân L8 D+ — USB D+ data line
Chân L9 D- — USB D- data line
Chân L11 VSS — Ground reference
Chân L12 VDD — Core supply voltage (2.0-3.6 V)
Chân NC NC — Not connected (per datasheet mechanical drawing)

Ứng dụng tiêu biểu

PIC24FJ256GB610-E/BG phù hợp cho 6 Áp dụngs: USB OTG Peripherals and Debug Probes, Automotive Body and HMI Controllers, Industrial HMI Panels and Sensor Hubs, Smart Energy Meters and Data Loggers, Portable Medical and Wellness Devices, Battery-Operated IoT Edge Nodes.

🔧

USB OTG Peripherals and Debug Probes

The PIC24FJ256GB610-E/BG's integrated USB 2.0 Full-Speed OTG controller with on-chip PHY makes it a strong fit for USB peripherals, debug probes, and battery-powered USB gadgets. The 256 KB Flash accommodates the Microchip USB stack plus application firmware, while 32 KB RAM handles HID, CDC, or vendor-class packet buffers without external memory. Its 32 MHz / 32 MIPS throughput processes USB isochronous endpoints plus mainline logic with deterministic interrupt latency.

🚗

Automotive Body and HMI Controllers

The -E/BG extended -40C to +125C temperature grade and Microchip's AEC-Q100 qualification flow make the PIC24FJ256GB610-E/BG suitable for automotive body controllers, HVAC panels, instrument clusters, and infotainment HMI front-ends. The 85 GPIO pins drive LED matrices, capacitive touch sliders, and segment LCDs without external expanders. Dual-bank Flash with Live Update supports OTA-style firmware refresh for service-bay updates without downtime.

🏭

Industrial HMI Panels and Sensor Hubs

Industrial HMI panels and sensor hubs benefit from the PIC24FJ256GB610-E/BG's 32 KB RAM for protocol translation buffers, six UARTs for multi-bridge industrial networks, and three SPI plus three I2C masters to scan sensor arrays. The 10-bit 1.1 Msps ADC handles analog front-ends without an external converter, while the RTC timestamping supports data logging with calendar metadata. Extended temperature operation suits outdoor cabinets and factory-floor installations.

⚡

Smart Energy Meters and Data Loggers

Smart electricity, water, and gas meters use the PIC24FJ256GB610-E/BG for metrology front-ends, RTC-driven time-of-use tariffs, and wired/wireless uplink aggregation. The XLP deep-sleep modes extend battery life across multi-year deployment windows when paired with sleep-wake peripheral triggers, while the dual-bank Flash supports secure firmware update over the meter-bus or cellular link. 85 GPIO simplify pulse-counting inputs and tamper-switch monitoring.

💊

Portable Medical and Wellness Devices

Portable medical and wellness devices such as blood-glucose meters, pulse oximeters, and connected thermometers leverage the PIC24FJ256GB610-E/BG's XLP low-power modes, USB device port for charging/data sync, and 32 KB RAM for waveform buffers. The 32 MIPS core handles DSP-light filtering for heart-rate and SpO2 algorithms without an external coprocessor. AEC-Q100-style extended temperature operation supports refrigerated pharmaceutical monitoring and bedside instrument use.

🧩

Battery-Operated IoT Edge Nodes

IoT edge nodes for environmental monitoring, asset tracking, and agriculture benefit from the PIC24FJ256GB610-E/BG's deep-sleep current profile, RTC calendar wake, and Live Update firmware. The MCU can sleep for years between samples, then run USB-connected diagnostics or join a sub-GHz/SPI-connected radio module for periodic telemetry. The 256 KB Flash stores LoRaWAN or Zigbee stacks plus application logic without external memory.

What is the operating voltage range of the PIC24FJ256GB610-E/BG?
The PIC24FJ256GB610-E/BG operates from 2.0 V to 3.6 V on its core and I/O supply rails, according to the Microchip PIC24FJ1024GA610/GB610 family datasheet. This wide 1.8 V-tolerant range supports direct connection to 3.3 V peripherals, 1.8 V digital signal chains, and battery-backed RTC domains. Designers must decouple VDD/VSS pairs with 100 nF and 10 uF bulk capacitors placed within 5 mm of each pin group.
How much Flash and RAM does the PIC24FJ256GB610-E/BG have?
The PIC24FJ256GB610-E/BG integrates 256 KB (85.5K x 24) of dual-partition Flash with ECC and 32 KB of RAM. The dual-bank layout with Live Update enables A/B firmware swap for failsafe field upgrades. The 256 KB Flash stores roughly 85K single-word instructions, enough for USB stacks plus application logic, while 32 KB RAM supports RTOS or large packet buffers.
What package does the PIC24FJ256GB610-E/BG use and what is the pin pitch?
The PIC24FJ256GB610-E/BG is housed in a 121-ball TFBGA measuring 10x10 mm with a 0.80 mm ball pitch. The 0.80 mm pitch requires HDI PCB fabrication with laser-drilled microvias. Per the datasheet mechanical drawing, this is the smallest BGA in the PIC24FJxxxGB610 family and is intended for high-density portable designs.
Where can I buy the PIC24FJ256GB610-E/BG and what is the lead time?
The PIC24FJ256GB610-E/BG is listed at DigiKey (part 11192039), Mouser, and Octopart-aggregated distributors. As of 2026-09-30, the -E/BG extended-temperature variant is marked Not Recommended for new designs, so stock is limited and lead times at franchised distributors typically run 12-26 weeks. The -I/BG industrial variant is generally more readily available for new prototypes.
What is the price of the PIC24FJ256GB610-E/BG as of 2026-09-30?
The PIC24FJ256GB610-E/BG lists at approximately $14.50 in single-piece quantity as of 2026-09-30, falling to about $9.05 at 1000 pieces per aggregated distributor pricing on Octopart. Because the part is NRND, authorized-distributor stock dominates pricing; broker and open-market pricing fluctuates with available inventory. Request a quote through franchised channels for production volumes.
What is the difference between PIC24FJ256GB610-E/BG and PIC24FJ256GB610-I/BG?
The PIC24FJ256GB610-E/BG carries the -E suffix denoting the -40C to +125C extended operating temperature range, while the -I/BG suffix denotes -40C to +85C industrial range. Both share the same 121-TFBGA package, 256 KB Flash, 32 KB RAM, and 32 MHz core. Choose -E/BG for automotive and outdoor industrial designs; choose -I/BG for cost-sensitive consumer or indoor industrial products.
Is the PIC24FJ256GB610-E/BG pin-to-pin compatible with the PIC24FJ256GA610-I/BG?
The PIC24FJ256GB610-E/BG and PIC24FJ256GA610-I/BG share the same 121-TFBGA 10x10 mm footprint and are largely pin-to-pin compatible, but the GB adds a USB 2.0 OTG full-speed peripheral that the GA610 does not. Per Microchip's migration guide, USB balls may be repurposed as GPIO on GA610; this means GB-to-GA drop-in requires firmware changes but no PCB rework. The reverse (GA to GB) is a true drop-in.
Can the PIC24FJ1024GB610-I/BG replace the PIC24FJ256GB610-E/BG?
Yes, the PIC24FJ1024GB610-I/BG is a drop-in upgrade path on the same 121-TFBGA footprint with 1024 KB Flash and the same peripheral set. The -I/BG suffix is -40C to +85C industrial, so for -40C to +125C extended-temperature systems you would select the -E/BG variant of the 1024 part instead. Code written for the 256 KB part runs unchanged on the 1024 KB part when the linker script is regenerated.
How does PIC24FJ256GB610-E/BG compare to PIC24FJ256GB410-I/BG?
The PIC24FJ256GB610-E/BG and PIC24FJ256GB410-I/BG differ in pin count and package: the GB610 uses 121-TFBGA with 85 I/O, while the GB410 uses 121-TFBGA with reduced I/O and a slightly different peripheral mix. They are not pin-to-pin drop-in compatible. Choose GB610 when you need USB OTG plus maximum I/O; choose GB412 when you need the peripheral balance of the GB412 sub-family at lower cost.
Does the PIC24FJ256GB610-E/BG support USB On-The-Go?
Yes, the PIC24FJ256GB610-E/BG integrates a USB 2.0 Full-Speed On-The-Go controller with on-chip transceiver, requiring only an external pull-up resistor and ESD protection array. Per the Microchip PIC24FJ1024GA610/GB610 family datasheet, the OTG controller supports host, device, and dual-role modes. This makes the part well-suited for USB peripherals, debug probes, and battery-powered USB gadgets.
What is the maximum CPU speed of the PIC24FJ256GB610-E/BG?
The PIC24FJ256GB610-E/BG runs the PIC24 CPU core at up to 32 MHz, delivering up to 32 MIPS of throughput thanks to its single-cycle instruction execution. The PLL derives this clock from an external crystal or internal 8 MHz FRC oscillator with +/-2% accuracy. At 32 MIPS the core can process USB packets and motor-control PWM loops comfortably without an external coprocessor.
Is the PIC24FJ256GB610-E/BG AEC-Q100 qualified?
The PIC24FJ256GB610-E/BG is Recommended for Automotive Design per Microchip's product page, indicating it follows the AEC-Q100 qualification flow with the -E/BG extended -40C to +125C temperature grade. For mission-critical automotive ASIL applications, request the full PPAP and AEC-Q100 qualification report from Microchip. The -E/BG suffix denotes the automotive-grade temperature window.
Where can I download the PIC24FJ256GB610-E/BG datasheet PDF?
The PIC24FJ256GB610-E/BG datasheet is published as part of the PIC24FJ1024GA610/GB610 Family Data Sheet on Microchip's product page at https://www.microchip.com/en-us/product/PIC24FJ256GB610. The family datasheet covers both 1024 KB and 256 KB variants because they share peripherals and pinout. Third-party mirrors such as alldatasheet and datasheets.com also host the PDF, but always cross-check revision against Microchip's site.
Where do I find the PIC24FJ256GB610-E/BG pinout and ball map?
The PIC24FJ256GB610-E/BG pinout is documented in Section 4 (Pinout) and the package mechanical drawing of the PIC24FJ1024GA610/GB610 Family Data Sheet. The 121-TFBGA uses a 10x10 mm grid with pin A1 marked by a chamfered corner. Because BGA pinout is not intuitive from the package alone, always cross-reference the datasheet ball map before laying out the PCB footprint.
What Microchip tools support the PIC24FJ256GB610-E/BG?
The PIC24FJ256GB610-E/BG is supported by MPLAB X IDE, MPLAB Xpress IDE, MPLAB Code Configurator (MCC), and the MPLAB XC16 C compiler. For debugging, use MPLAB ICD 4, MPLAB PICkit 4, or MPLAB Snap programmers. The Explorer 16/32 Development Board with a PIM (Plug-In Module) is the recommended evaluation platform for prototyping.

Dữ liệu tham khảo kỹ thuật cho PIC24FJ256GB610-E/BG — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose the PIC24FJ256GB610-E/BG when you need a USB-OTG-enabled PIC24F MCU with dual-bank Flash, Live Update OTA, and automotive-grade -40C to +125C operation. The same-package drop-in alternatives give you three clean design choices. Use PIC24FJ256GB610-I/BG if your product runs only to +85C and you want lower cost or shorter lead time. Use PIC24FJ1024GB610-I/BG when 256 KB of Flash is too tight for your USB stack plus application - you gain 4x headroom on the same PCB. Use PIC24FJ256GA610-I/BG to drop the USB OTG block for cost down. Use PIC24FJ128GA610-I/BG when 128 KB of Flash is enough and you want the cheapest member of the family. Note: the entire -E/BG extended-temp line is NRND, so for long-life programs prefer the active -I/BG variants unless automotive temperature is mandatory.

So sánh với các sản phẩm thay thế

Tham số Sản phẩm này PIC24FJ256GB610-I/BG PIC24FJ256GB610T-E/BG PIC24FJ1024GB610-I/BG PIC24FJ256GA610-I/BG PIC24FJ128GA610-I/BG
Package 121-TFBGA (10x10 mm) 121-TFBGA (10x10 mm) - same 121-TFBGA (10x10 mm) - same 121-TFBGA (10x10 mm) - same 121-TFBGA (10x10 mm) - same 121-TFBGA (10x10 mm) - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Operating Temperature -40C to +125C (E) -40C to +85C (I) -40C to +125C (E) -40C to +85C (I) -40C to +85C (I) -40C to +85C (I)
Flash Memory 256 KB 256 KB 256 KB 1024 KB 256 KB 128 KB
RAM Size 32 KB 32 KB 32 KB 32 KB 32 KB 32 KB
Maximum CPU Speed 32 MHz / 32 MIPS 32 MHz / 32 MIPS 32 MHz / 32 MIPS 32 MHz / 32 MIPS 32 MHz / 32 MIPS 32 MHz / 32 MIPS
USB OTG Yes (Full-Speed, on-chip PHY) Yes Yes Yes No No
Number of I/O 85 85 85 85 85 85
Lifecycle Status NRND (Not Recommended for new designs) NRND NRND Active Active Active

Bảo phân biệt quan trọng

  • Dual-bank Flash with Live Update (vsPIC24FJ256GA610-I/BG)
  • USB OTG on-chip PHY (vsPIC24FJ256GA610-I/BG)
  • Extended -40C to +125C automotive grade (vsPIC24FJ256GB610-I/BG)

Ghi chú thiết kế

Estimated: The 121-TFBGA uses a 0.80 mm ball pitch on a 10x10 mm body, which requires HDI PCB fabrication with laser-drilled stacked microvias to escape the inner rows. Use 1 oz copper on outer layers and 0.5 oz on inner layers; keep microvia aspect ratio below 0.75:1. Place 100 nF + 10 uF decoupling within 5 mm of each VDD/VSS pair, and route the USB D+/D- pair as a 90 ohm differential with continuous ground reference and length matching PCB layout guidelines for USB 2.0.

The PIC24FJ256GB610-E/BG operates from 2.0 V to 3.6 V. Use a low-dropout regulator with < 50 uVrms noise to feed VDD, and add a ferrite bead + 1 uF cap on the analog AVDD rail if the ADC is active. The VUSB pin requires its own 3.3 V supply derived from VBUS or the internal regulator; tie VBUS to the USB connector VBUS through a divider for OTG session detection. Decouple VBAT/RTC supply separately if battery backup is implemented.

Do not confuse -E/BG (extended -40C to +125C, automotive AEC-Q100) with -I/BG (industrial -40C to +85C) - the wrong suffix voids automotive qualification. The Live Update feature requires the dual-partition linker script and configuration-word settings; firmware teams must verify A/B image swap with a watchdog-driven rollback path before deploying OTA updates. Finally, note that the GB610 family is in NRND status - new designs may want to evaluate the active GA610 or 1024 GB610 variants for long-term availability.

Thông tin tuân thủ

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Không chì
Yes
Không halogen
Yes
Khoáng vật xung đột
Compliant

RoHS and REACH compliant per Microchip product page; AEC-Q100 qualified per 'Recommended for Automotive Design' status on the product page. The -E suffix denotes -40C to +125C extended temperature grade. Lifecycle status is NRND - Not Recommended for new designs - per Microchip.

Dữ liệu được xác minh vào: 2026-09-30 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

Tìm kiếm liên quan

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