10AS066K2F35E1HG - Arria 10 SX SoC FPGA, 660K LE, 1152-FBGA | Altera
MPN: 10AS066K2F35E1HG ✓ সক্রিয়10AS066K2F35E1HG সারাংশ
An SoC FPGA is a heterogeneous computing device that combines a general-purpose processor subsystem with programmable logic on a single die, enabling hardware/software co-design for latency-critical and parallel workloads. Within the broader taxonomy, this places the Arria 10 SX under FPGA & CPLD > System on Chip > embedded programmable logic, sitting between traditional microcontrollers (software-only) and discrete FPGAs (logic-only). The Arria 10 family also pioneered 20 nm process technology in mid-range FPGAs, balancing transceiver bandwidth against power.
Key features include 660K logic elements, 1.5 GHz maximum core clock for the HPS, embedded multi-gigabit transceivers supporting protocols such as PCIe Gen3, 10G Ethernet, and CPRI, plus hardened memory controllers, variable-precision DSP blocks, and floating-point hardware assist. Hardened floating-point blocks in the arithmetic logic deliver IEEE 754 single-precision performance critical for DSP pipelines, while dedicated PCI Express Gen3 hard IP blocks save fabric resources.
Typical applications include wireless baseband processing, radar and electronic-warfare signal chains, high-speed serial protocol bridging, broadcast video processing, and medical imaging pre-processing. The -1 speed grade indicates industrial-grade placement, suitable for moderate thermal envelopes and mid-bandwidth SERDES.
When designing with this SoC, ensure the PCB has a 1152-ball FCBGA land pattern with proper microvia stack-up for breakout routing, and provide decoupling per Intel/Altera's pin connection guidelines. For power sequencing, follow the Arria 10 SoC EMIF and HPS power-up sequence in the device family datasheet to avoid in-rush latch-up.
This page synthesizes distributor pricing, drop-in Arria 10 family alternatives, and practical SoC design notes not found in the standalone datasheet PDF.
এর জন্য ড্রপ-ইন বিকল্প 10AS066K2F35E1HG — একই package, pin-to-pin compatible। ভিন্ন package-এর যেসব পার্টে PCB rework প্রয়োজন সেগুলো বাদ দেওয়া হয়েছে।
এই সিরিজের ভ্যারিয়েন্ট
একই সিরিজের মডেল যেগুলো drop-in compatible 10AS066K2F35E1HG (একই form factor এবং footprint) — পার্থক্য রয়েছে Package, Logic Elements, Temperature Grade, Mounting Type, RoHS Status.
10AS066K2F35I1HG
✅ ড্রপ-ইন📋 রেফারেন্স বিকল্প (ক্যাটালগে নেই)
10AS066K1F35E1HG
✅ ড্রপ-ইনমূল্যের জন্য যোগাযোগ করুন
ডেটাশিট দেখুন →10AS066K1F35I1HG
✅ ড্রপ-ইনমূল্যের জন্য যোগাযোগ করুন
ডেটাশিট দেখুন →10AS066K2F35E1HG সর্বোচ্চ রেটিং ও বৈদ্যুতিক বৈশিষ্ট্য
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 660,000 (660K) |
| Hard Processor Subsystem (HPS) | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Clock Frequency | 1.5 GHz |
| প্যাকেজ | 1152-FBGA, FC (35x35 mm) |
| Process Node | 20 nm |
| Speed Grade | -1 (industrial) |
| Temperature Grade | E (extended) |
| Transceivers | Up to 17.4 Gbps (multi-gigabit) |
| DSP Blocks | Variable-precision, hardened floating-point |
| Memory Interfaces | Hardened DDR3/DDR4 controllers |
| PCIe Hard IP | PCI Express Gen3 hard IP blocks |
| RoHS স্ট্যাটাস | Compliant |
| মাউন্টিং টাইপ | Surface Mount (FCBGA) |
| Lead-Free | Yes |
10AS066K2F35E1HG 1152-fbga, fc (35x35 mm) পিন কনফিগারেশন গাইড
10AS066K2F35E1HG (1152-fbga, fc (35x35 mm) প্যাকেজ)-এর পিন কনফিগারেশন। এই ডিজিটাল IC-তে GPIO, কমিউনিকেশন ইন্টারফেস (UART, SPI, I2C) এবং পাওয়ার পিন রয়েছে। বিকল্প পিন ফাংশন ও কনফিগারেশন অপশনের জন্য প্রস্তুতকারকের ডেটাশিট দেখুন। এমবেডেড সিস্টেম ডিজাইন ও PCB লেআউটের জন্য অপরিহার্য।
এর জন্য বিস্তারিত পিনআউট ডেটা পাওয়া যায়নি 10AS066K2F35E1HG.
দেখুন ডেটাশিট সম্পূর্ণ পিন কনফিগারেশনের জন্য।
সাধারণ ব্যবহার
10AS066K2F35E1HG এর জন্য উপযুক্ত 6 অ্যাপ্লিকেশনs: Wireless Baseband Processing, Radar and Electronic Warfare Signal Chains, Broadcast Video Processing, High-Speed Serial Protocol Bridging, Medical Imaging Pre-Processing, Industrial Automation and Vision.
Wireless Baseband Processing
The 10AS066K2F35E1HG fits wireless baseband cards where its 660K logic elements implement channel cards while the dual 1.5 GHz ARM Cortex-A9 MPCore HPS runs the PHY control stack. Placed between antenna interfaces and the backhaul, it provides 24 multi-gigabit transceivers at up to 17.4 Gbps for CPRI or OBSAI fronthaul, plus hardened PCIe Gen3 IP for backhaul. The 17.4 Gbps transceivers and DSP blocks enable LTE/5G NR FFT and FEC offload. Unlike a pure ASIC, the FPGA fabric accelerates protocol upgrades without re-spin.
সুপারিশকৃত
Radar and Electronic Warfare Signal Chains
The 10AS066K2F35E1HG suits radar receiver/exciter designs where its hardened variable-precision DSP with floating-point assist performs pulse compression and FFT at sustained rates. With 660K LE the device implements multi-channel beamforming, while the dual 1.5 GHz Cortex-A9 HPS handles scheduling and tracking algorithms. The K2 transceiver tier supplies 24 channels of 17.4 Gbps serial link to ADCs/DACs and to neighbouring antenna cards. Its hardened PCIe Gen3 IP streams processed tracks to a host mission computer.
সুপারিশকৃত
Broadcast Video Processing
The 10AS066K2F35E1HG supports 4K/UHD broadcast pipelines where its 660K LE fabric runs multi-stream HEVC/H.264 encode-decode, color conversion, and graphics overlay in parallel. The dual 1.5 GHz ARM Cortex-A9 HPS hosts a Linux control plane with file ingest and stream management. Its 24 multi-gigabit transceivers provide SDI (SMPTE 2022/2082), HDMI 2.0, and 12G-SDI connectivity. Compared with merchant video SoCs, the FPGA fabric accelerates codec upgrades and custom watermarking without re-spin.
সুপারিশকৃত
High-Speed Serial Protocol Bridging
The 10AS066K2F35E1HG serves as a multi-protocol bridge converting PCIe Gen3, 10/40 GbE, SATA, and CPRI traffic on a single board. With 24 transceivers at 17.4 Gbps, the device aggregates lanes from multiple physical interfaces and presents a unified logical endpoint. The dual Cortex-A9 HPS at 1.5 GHz handles slow-path control while the 660K LE fabric implements cut-through switching and DMA. Hardened PCIe Gen3 blocks eliminate soft-IP resource overhead and simplify timing closure.
সুপারিশকৃত
Medical Imaging Pre-Processing
The 10AS066K2F35E1HG accelerates CT, MRI, and ultrasound front-ends where its variable-precision DSP and floating-point blocks perform back-projection, beamforming, and noise filtering in real time. The dual 1.5 GHz Cortex-A9 HPS runs the patient interface and DICOM stack while the 660K LE fabric accelerates the inner imaging loop. Its 17.4 Gbps transceivers connect to high-channel-count ADCs at the probe head. The SoC architecture lets the device replace separate CPU + FPGA + DSP boards.
সুপারিশকৃত
Industrial Automation and Vision
The 10AS066K2F35E1HG suits factory-automation vision and motion controllers where its dual 1.5 GHz ARM Cortex-A9 HPS runs deterministic EtherCAT or PROFINET masters while the 660K LE fabric accelerates machine-vision pipelines (edge detection, classification, defect inspection). The hardened PCIe Gen3 IP connects to host SCADA systems and 24 transceivers link multi-gigabit camera interfaces. Compared with discrete MCU + GPU stacks, the SoC FPGA reduces BOM, latency, and PCB footprint.
সুপারিশকৃত
সুপারিশকৃত পণ্যের সারসংক্ষেপ
এর জন্য ইঞ্জিনিয়ারিং রেফারেন্স ডেটা 10AS066K2F35E1HG — তুলনা, ডিজাইন গাইডেন্স এবং কমপ্লায়েন্স তথ্য।
নির্বাচন গাইড
বিকল্পের সাথে তুলনা
| পারামিটার | এই পণ্য | 10AS066K2F35I1HG | 10AS066K1F35E1HG | 10AS066K1F35I1HG |
|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-FBGA, FC (35x35) | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same |
| Logic Elements | 660K | 660K | 660K | 660K |
| HPS | Dual Cortex-A9 @ 1.5 GHz | Dual Cortex-A9 @ 1.5 GHz | Dual Cortex-A9 @ 1.5 GHz | Dual Cortex-A9 @ 1.5 GHz |
| Transceiver Configuration | K2 (24 channels) | K2 (24 channels) | K1 (12 channels) | K1 (12 channels) |
| Max Transceiver Rate | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps |
| Temperature Grade | E (extended) | I (industrial) | E (extended) | I (industrial) |
| Hardened PCIe Gen3 IP | Yes | Yes | Yes | Yes |
মূল পার্থক্যসমূহ
- K2 transceiver configuration with 24 channels (বনাম10AS066K1F35E1HG)
- Extended (E) temperature grade cost optimization (বনাম10AS066K2F35I1HG)
- Hardened PCIe Gen3 IP blocks (বনাম10AS048H1F34I1HG)
ডিজাইন নোট
The 1152-FBGA F35 package requires a high-density PCB stack-up with 1-2-1 or 1-2-3-2-1 microvia layers for signal breakout. Use laser-drilled microvias under the BGA balls and standard through-vias on outer breakout layers. Decoupling per Intel/Altera pin connection guidelines: 0.1 uF + 1 uF + 10 uF per power rail as close to the package as possible. Maintain continuous ground return beneath the BGA for signal integrity.
At industrial E grade, the 10AS066K2F35E1HG is rated for junction temperatures up to 100C. Estimated power dissipation at full fabric utilization plus active HPS is typically 15-25 W. Provide a heat spreader or heatsink with at least 4 C/W thermal resistance and ensure PCB inner copper planes are stitched with thermal vias to the top-side spreader. Airflow at 1-2 m/s is recommended in enclosed chassis.
Do not confuse the F35 designator (1152-FBGA) with F34 or F29 packages from other Arria 10 SKUs. The 10AS066K2F35E1HG and 10AS048E2F29I1HG are NOT pin-compatible despite sharing part-number prefix 10AS. Always verify the package code on the Altera ordering part number page before laying out a new PCB or sourcing alternatives.
Differential transceiver channels require length-matched routing within 0.127 mm tolerance to meet 17.4 Gbps eye-mask. Use a 100-ohm differential stack-up with ground reference plane immediately beneath the traces. AC-coupling capacitors must be placed close to the receiver pins and rated for 6 GHz+ bandwidth to avoid attenuating 17.4 Gbps signals.
কমপ্লায়েন্স তথ্য
RoHS and REACH compliant per Altera/Intel product page. Not AEC-Q100 qualified (industrial-grade FPGAs are typically AEC-Q100 only in dedicated auto part numbers).