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10AS066K2F35E1HG - Arria 10 SX SoC FPGA, 660K LE, 1152-FBGA | Altera

MPN: 10AS066K2F35E1HG ✓ Active
In Stock Ships in 1-3 business days
1152-FBGA, FC (35x35 mm) Package 1.5 GHz Speed Hardened DDR3/DDR4 controllers Memory
From $3290 USD / Unit
MOQ: 1 |
Price updated: 2026-09-04
Volume Pricing
Qty Unit Price Extended
1 $4250 $4,250.00
10 $3990 $39,900.00
50 $3750 $187,500.00
100 $3520 $352,000.00
500 $3290 $1,645,000.00
ℹ️ All prices are in USD

Drop-in alternatives for 10AS066K2F35E1HG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

10AS066K2F35I1HG

✅ Drop-In
📦 1152-FBGA, FC (35x35)
same 660K LE + dual Cortex-A9 + K2 transceiver count, but industrial temperature grade (I) vs extended (E)

📋 Reference alternative (not in catalog)

10AS066K1F35E1HG

✅ Drop-In
Intel
📦 1152-FBGA, FC (35x35)
System On Chip (SoC) IC · Arria 10 SX · 660000 · 1.5 GHz · Dual ARM Cortex-A9 MPCore · Supported · 396 I/O · FCFBGA

✓ In Stock

Contact for price

View Datasheet →

10AS066K1F35I1HG

✅ Drop-In
Intel
📦 1152-FBGA, FC (35x35)
10AS066K1F35I1HG · Intel (formerly Altera) · Arria 10 SX · 660,000 · Dual ARM Cortex-A9 MPCore with CoreSight · 1.5 GHz · 1152-FBGA, FC (35x35 mm) · TSMC 20 nm

✓ In Stock

$2275 / Unit

View Datasheet →

10AS066K2F35E1HG Maximum Ratings & Electrical Characteristics

Family Arria 10 SX SoC FPGA
Logic Elements 660,000 (660K)
Hard Processor Subsystem (HPS) Dual ARM Cortex-A9 MPCore with CoreSight
HPS Maximum Clock Frequency 1.5 GHz
Package 1152-FBGA, FC (35x35 mm)
Process Node 20 nm
Speed Grade -1 (industrial)
Temperature Grade E (extended)
Transceivers Up to 17.4 Gbps (multi-gigabit)
DSP Blocks Variable-precision, hardened floating-point
Memory Interfaces Hardened DDR3/DDR4 controllers
PCIe Hard IP PCI Express Gen3 hard IP blocks
RoHS Status Compliant
Mounting Type Surface Mount (FCBGA)
Lead-Free Yes

10AS066K2F35E1HG 1152-fbga, fc (35x35 mm) Pin Configuration Guide

Complete pinout information for 10AS066K2F35E1HG (1152-fbga, fc (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

1152-fbga, fc (35x35 mm) package pinout diagram for 10AS066K2F35E1HG

No detailed pinout data available for 10AS066K2F35E1HG.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for 10AS066K2F35E1HG Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

10AS066K2F35E1HG is suitable for 6 applications: Wireless Baseband Processing, Radar and Electronic Warfare Signal Chains, Broadcast Video Processing, High-Speed Serial Protocol Bridging, Medical Imaging Pre-Processing, Industrial Automation and Vision.

🌐

Wireless Baseband Processing

The 10AS066K2F35E1HG fits wireless baseband cards where its 660K logic elements implement channel cards while the dual 1.5 GHz ARM Cortex-A9 MPCore HPS runs the PHY control stack. Placed between antenna interfaces and the backhaul, it provides 24 multi-gigabit transceivers at up to 17.4 Gbps for CPRI or OBSAI fronthaul, plus hardened PCIe Gen3 IP for backhaul. The 17.4 Gbps transceivers and DSP blocks enable LTE/5G NR FFT and FEC offload. Unlike a pure ASIC, the FPGA fabric accelerates protocol upgrades without re-spin.

✈️

Radar and Electronic Warfare Signal Chains

The 10AS066K2F35E1HG suits radar receiver/exciter designs where its hardened variable-precision DSP with floating-point assist performs pulse compression and FFT at sustained rates. With 660K LE the device implements multi-channel beamforming, while the dual 1.5 GHz Cortex-A9 HPS handles scheduling and tracking algorithms. The K2 transceiver tier supplies 24 channels of 17.4 Gbps serial link to ADCs/DACs and to neighbouring antenna cards. Its hardened PCIe Gen3 IP streams processed tracks to a host mission computer.

📺

Broadcast Video Processing

The 10AS066K2F35E1HG supports 4K/UHD broadcast pipelines where its 660K LE fabric runs multi-stream HEVC/H.264 encode-decode, color conversion, and graphics overlay in parallel. The dual 1.5 GHz ARM Cortex-A9 HPS hosts a Linux control plane with file ingest and stream management. Its 24 multi-gigabit transceivers provide SDI (SMPTE 2022/2082), HDMI 2.0, and 12G-SDI connectivity. Compared with merchant video SoCs, the FPGA fabric accelerates codec upgrades and custom watermarking without re-spin.

🖥️

High-Speed Serial Protocol Bridging

The 10AS066K2F35E1HG serves as a multi-protocol bridge converting PCIe Gen3, 10/40 GbE, SATA, and CPRI traffic on a single board. With 24 transceivers at 17.4 Gbps, the device aggregates lanes from multiple physical interfaces and presents a unified logical endpoint. The dual Cortex-A9 HPS at 1.5 GHz handles slow-path control while the 660K LE fabric implements cut-through switching and DMA. Hardened PCIe Gen3 blocks eliminate soft-IP resource overhead and simplify timing closure.

💊

Medical Imaging Pre-Processing

The 10AS066K2F35E1HG accelerates CT, MRI, and ultrasound front-ends where its variable-precision DSP and floating-point blocks perform back-projection, beamforming, and noise filtering in real time. The dual 1.5 GHz Cortex-A9 HPS runs the patient interface and DICOM stack while the 660K LE fabric accelerates the inner imaging loop. Its 17.4 Gbps transceivers connect to high-channel-count ADCs at the probe head. The SoC architecture lets the device replace separate CPU + FPGA + DSP boards.

🏭

Industrial Automation and Vision

The 10AS066K2F35E1HG suits factory-automation vision and motion controllers where its dual 1.5 GHz ARM Cortex-A9 HPS runs deterministic EtherCAT or PROFINET masters while the 660K LE fabric accelerates machine-vision pipelines (edge detection, classification, defect inspection). The hardened PCIe Gen3 IP connects to host SCADA systems and 24 transceivers link multi-gigabit camera interfaces. Compared with discrete MCU + GPU stacks, the SoC FPGA reduces BOM, latency, and PCB footprint.

What is the logic element count of the 10AS066K2F35E1HG?
The 10AS066K2F35E1HG contains 660,000 logic elements (660K LE) within the FPGA fabric. According to the DigiKey product listing, this places it in the high-density tier of the Arria 10 SX lineup. It combines the 660K-LE fabric with a dual-core ARM Cortex-A9 MPCore hard processor subsystem running up to 1.5 GHz.
What package does the 10AS066K2F35E1HG use?
The 10AS066K2F35E1HG is supplied in a 1152-ball Flip-Chip BGA (FCBGA) package measuring 35x35 mm. The F35 designator in the part number explicitly denotes this 1152-FBGA package. This large BGA requires microvia PCB stack-up for signal breakout and a substantial copper pour for thermal dissipation.
How much does the 10AS066K2F35E1HG cost and is it in stock?
Pricing for the 10AS066K2F35E1HG as of 2026-09-05 starts at approximately $4,250 USD per unit at qty 1, with break-pricing down to roughly $3,290 USD at qty 500. Stock is limited - the part is typically quoted via DigiKey and Mouser with lead times of 8-12 weeks because of its low-volume, high-value SoC FPGA nature.
What is the difference between 10AS066K2F35E1HG and 10AS066K2F35I1HG?
The 10AS066K2F35E1HG is the extended-grade (-1 speed, E temperature) variant while the 10AS066K2F35I1HG is the industrial-grade (-1 speed, I temperature) variant. Both share the same 660K LE, dual Cortex-A9 HPS, and 1152-FBGA F35 package footprint. They are drop-in compatible; choose E for cost-optimized and I for full industrial temp.
Can 10AS066K1F35E1HG replace 10AS066K2F35E1HG?
Yes, the 10AS066K1F35E1HG is a drop-in replacement for the 10AS066K2F35E1HG on the same 1152-FBGA F35 footprint. The only difference is transceiver count: K2 has 24 transceivers vs K1 with 12 transceivers. If your design uses fewer than 12 transceivers, the K1 variant is fully pin-to-pin compatible and typically lower cost.
Where can I download the 10AS066K2F35E1HG datasheet PDF?
The official 10AS066K2F35E1HG datasheet and ordering part number page is hosted at https://www.altera.com/products/fpga/arria/10/sx/10as066-f35/10AS066K2F35E1HG. The Arria 10 device family datasheet (covering all variants) is also available on the Altera/Intel FPGA documentation portal at intel.com/content/www/us/en/docs/programmable.
What are the best Arria 10 SX drop-in alternatives for the 10AS066K2F35E1HG?
The closest drop-in alternatives are 10AS066K2F35I1HG (industrial temperature), 10AS066K1F35E1HG (K1, fewer transceivers), and 10AS066K1F35I1HG (K1 industrial). All share the 1152-FBGA F35 package and pin-out, differing only in transceiver count (K1 vs K2) and temperature grade (E vs I), as documented on the Altera product page.
Is 10AS066K2F35E1HG RoHS compliant?
Yes, the 10AS066K2F35E1HG is RoHS compliant per the Altera/Intel product declaration page. The 1152-FBGA package uses lead-free solder balls and the device is fully compliant with RoHS and REACH environmental directives required for EU market placement.
What is the maximum HPS clock frequency of the 10AS066K2F35E1HG?
The hard processor subsystem (dual ARM Cortex-A9 MPCore) runs at up to 1.5 GHz maximum clock frequency in the 10AS066K2F35E1HG. This is the published DigiKey spec for the Arria 10 SX 660K-LE variant and is independent of the FPGA fabric speed grade which controls logic and transceiver timing.
What applications is the 10AS066K2F35E1HG best suited for?
The 10AS066K2F35E1HG fits wireless baseband processing, radar/EW signal chains, broadcast video processing, high-speed serial bridging, and medical imaging pre-processing. Its 660K LE fabric, dual 1.5 GHz Cortex-A9 HPS, and 17.4 Gbps transceivers enable hardware-accelerated DSP with software control for latency-critical heterogeneous workloads.
What is the operating temperature range of the 10AS066K2F35E1HG?
The 10AS066K2F35E1HG is graded E (extended) per its part-number designator. The E grade typically spans 0C to +100C junction temperature. For full industrial -40C to +100C operation, select the I-grade variant 10AS066K2F35I1HG instead - it is otherwise identical and drop-in compatible.
Hey Google, what can replace the 10AS066K2F35E1HG?
The 10AS066K2F35E1HG can be replaced with any same-package Arria 10 SX 660K-LE variant: 10AS066K2F35I1HG (industrial temp), 10AS066K1F35E1HG (12 transceivers vs 24), or 10AS066K1F35I1HG (K1 + industrial). All are pin-compatible on the 1152-FBGA F35 footprint. No cross-brand drop-in exists - cross-brand replacement requires PCB redesign.
Is 10AS066K2F35E1HG the same as 10AS066K2F35I1HG?
No, they are not the same but they are drop-in compatible. The 10AS066K2F35E1HG is the E (extended) temperature grade while the 10AS066K2F35I1HG is the I (industrial) temperature grade. Both share the identical 1152-FBGA F35 package, 660K LE, dual Cortex-A9 HPS, and K2 transceiver count of 24 channels at up to 17.4 Gbps.
What is the best Xilinx equivalent for the 10AS066K2F35E1HG?
There is no direct drop-in Xilinx equivalent because Arria 10 SX FPGAs use a unique 1152-FBGA F35 footprint that Xilinx parts do not share. Functionally, the closest Xilinx counterpart would be the Zynq-7000 XC7Z100 or Zynq UltraScale+ XCZU9EG family, but these require PCB redesign as the package and pin-out differ entirely.
What are the key engineering specs of 10AS066K2F35E1HG that hardware engineers should know?
The key specifications are: 660K logic elements, dual ARM Cortex-A9 HPS up to 1.5 GHz, 1152-FBGA FCBGA 35x35 mm package, K2 transceiver configuration with 24 channels up to 17.4 Gbps, hardened PCIe Gen3 IP, DDR3/DDR4 memory controllers, variable-precision DSP with floating-point assist, and 20 nm process node with E temperature grade.

Engineering reference data for 10AS066K2F35E1HG — comparison, design guidance, and compliance information.

Selection Guide

Choose the 10AS066K2F35E1HG when you need a high-density (660K LE) Arria 10 SX SoC with full K2 transceiver tier (24 channels at 17.4 Gbps) and E temperature grade for cost-optimized indoor or climate-controlled deployments. Choose the 10AS066K2F35I1HG when your enclosure sees full industrial -40C to +100C swings - it is otherwise identical and drop-in compatible. Choose the 10AS066K1F35E1HG or 10AS066K1F35I1HG when your design uses 12 or fewer transceivers, since the K1 variant is typically priced lower while sharing the same F35 footprint. No cross-brand drop-in exists for this part because the 1152-FBGA F35 footprint is unique to Altera/Intel SoC FPGAs.

Comparison with Alternatives

Parameter This Product 10AS066K2F35I1HG 10AS066K1F35E1HG 10AS066K1F35I1HG
Brand Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
Package 1152-FBGA, FC (35x35) 1152-FBGA, FC (35x35) - same 1152-FBGA, FC (35x35) - same 1152-FBGA, FC (35x35) - same
Logic Elements 660K 660K 660K 660K
HPS Dual Cortex-A9 @ 1.5 GHz Dual Cortex-A9 @ 1.5 GHz Dual Cortex-A9 @ 1.5 GHz Dual Cortex-A9 @ 1.5 GHz
Transceiver Configuration K2 (24 channels) K2 (24 channels) K1 (12 channels) K1 (12 channels)
Max Transceiver Rate 17.4 Gbps 17.4 Gbps 17.4 Gbps 17.4 Gbps
Temperature Grade E (extended) I (industrial) E (extended) I (industrial)
Hardened PCIe Gen3 IP Yes Yes Yes Yes

Key Differentiators

  • K2 transceiver configuration with 24 channels (vs 10AS066K1F35E1HG)
  • Extended (E) temperature grade cost optimization (vs 10AS066K2F35I1HG)
  • Hardened PCIe Gen3 IP blocks (vs 10AS048H1F34I1HG)

Design Notes

The 1152-FBGA F35 package requires a high-density PCB stack-up with 1-2-1 or 1-2-3-2-1 microvia layers for signal breakout. Use laser-drilled microvias under the BGA balls and standard through-vias on outer breakout layers. Decoupling per Intel/Altera pin connection guidelines: 0.1 uF + 1 uF + 10 uF per power rail as close to the package as possible. Maintain continuous ground return beneath the BGA for signal integrity.

At industrial E grade, the 10AS066K2F35E1HG is rated for junction temperatures up to 100C. Estimated power dissipation at full fabric utilization plus active HPS is typically 15-25 W. Provide a heat spreader or heatsink with at least 4 C/W thermal resistance and ensure PCB inner copper planes are stitched with thermal vias to the top-side spreader. Airflow at 1-2 m/s is recommended in enclosed chassis.

Do not confuse the F35 designator (1152-FBGA) with F34 or F29 packages from other Arria 10 SKUs. The 10AS066K2F35E1HG and 10AS048E2F29I1HG are NOT pin-compatible despite sharing part-number prefix 10AS. Always verify the package code on the Altera ordering part number page before laying out a new PCB or sourcing alternatives.

Differential transceiver channels require length-matched routing within 0.127 mm tolerance to meet 17.4 Gbps eye-mask. Use a 100-ohm differential stack-up with ground reference plane immediately beneath the traces. AC-coupling capacitors must be placed close to the receiver pins and rated for 6 GHz+ bandwidth to avoid attenuating 17.4 Gbps signals.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and REACH compliant per Altera/Intel product page. Not AEC-Q100 qualified (industrial-grade FPGAs are typically AEC-Q100 only in dedicated auto part numbers).

Data verified on: 2026-09-05 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Altera Intel FPGA 10AS066K2F35E1HG 10AS066K2F35I1HG 10AS066K1F35E1HG 10AS066K1F35I1HG Arria 10 SX System on Chip SoC FPGA ARM Cortex-A9 MPCore CoreSight Flip-Chip BGA 1152-FBGA PCIe Gen3 hard IP Multi-gigabit transceiver DDR4 memory controller variable-precision DSP 20 nm process FPGA RoHS logic element HPS industrial temperature grade wireless baseband radar signal processing
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