10AS066K1F35E1HG - 660K Logic Elements, 1.5 GHz SoC FPGA | Intel
MPN: 10AS066K1F35E1HG ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for 10AS066K1F35E1HG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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Request Alternatives10AS066K1F35E1HG Maximum Ratings & Electrical Characteristics
| Product Type | System On Chip (SoC) IC |
| FPGA Family | Arria 10 SX |
| Logic Elements | 660000 |
| Maximum Clock Frequency | 1.5 GHz |
| Processor | Dual ARM Cortex-A9 MPCore |
| CoreSight | Supported |
| FPGA I/O | 396 I/O |
| Package Type | FCFBGA |
| Pin Count | 1152 |
| Package Dimensions | 35 mm x 35 mm |
| Terminal Form | Ball |
| Technology | TSMC |
| Core Voltage | 0.9 V |
| Mounting Type | Surface Mount |
| RoHS Status | unknown |
| REACH Status | unknown |
10AS066K1F35E1HG 35 mm x 35 mm Pin Configuration Guide
Complete pinout information for 10AS066K1F35E1HG (35 mm x 35 mm package) with 1152 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS066K1F35E1HG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1152 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS066K1F35E1HG is suitable for 6 applications: Cloud-computing infrastructure, Industrial automation controllers, Communications and networking equipment, Internet-of-Things gateways, Embedded vision and data processing, Custom hardware acceleration platforms.
Cloud-computing infrastructure
The 10AS066K1F35E1HG is suitable for cloud-computing infrastructure requiring programmable acceleration together with embedded control software. Its verified 660,000 logic elements and 1.5 GHz clock capability provide resources for custom datapaths, protocol handling, and workload-specific processing. The dual ARM Cortex-A9 MPCore can run supervisory software, operating-system services, and management functions while the FPGA fabric handles parallel operations. In a typical platform, the SoC FPGA would connect to memory, high-speed interfaces, and management networks. System architects must validate power delivery, thermal limits, board signal integrity, and software support before deployment.
Recommended
Industrial automation controllers
The 10AS066K1F35E1HG fits industrial automation controllers that need deterministic FPGA processing and a processor-managed software environment. The 660,000 logic elements can implement control loops, encoder interfaces, data aggregation, and custom real-time functions, while the dual ARM Cortex-A9 MPCore supports protocol stacks, diagnostics, and system management. Its 396 FPGA I/O figure indicates substantial user-I/O capacity, although the exact I/O standard and bank assignment require manufacturer documentation. The 35 mm by 35 mm FCFBGA package supports dense integration but demands disciplined power, thermal, and escape-layout design. Engineers should verify environmental grades and operating conditions before field use.
Recommended
Communications and networking equipment
The 10AS066K1F35E1HG can support communications equipment that combines high-throughput programmable logic with embedded network control. The 1.5 GHz device capability and 660,000 logic elements are useful for packet processing, interface adaptation, filtering, and protocol-specific acceleration, while the dual ARM Cortex-A9 MPCore can manage control-plane tasks and software services. The verified 1152-pin FCFBGA package and 396 FPGA I/O listing indicate a high-density platform rather than a simple peripheral device. Designers must confirm transceiver details, supported I/O standards, power rails, impedance requirements, and thermal performance from the official documentation before selecting it for a communications design.
Recommended
Internet-of-Things gateways
The 10AS066K1F35E1HG is appropriate for Internet-of-Things gateways where software connectivity and hardware-level sensor or protocol processing must coexist. The dual ARM Cortex-A9 MPCore provides a processor subsystem for networking, security services, device management, and application software. The FPGA fabric can accelerate sensor aggregation, custom interfaces, filtering, and data conversion. Its 660,000 logic elements and 1.5 GHz clock capability offer meaningful programmable capacity, but the verified data does not state power consumption or supported memory configurations. For battery or thermally constrained systems, compare the complete power budget and verify the available package and board-level implementation requirements.
Recommended
Embedded vision and data processing
The 10AS066K1F35E1HG can serve embedded vision and data-processing systems that need parallel FPGA execution and embedded software control. Its 660,000 logic elements support pixel processing, filtering, feature extraction, and interface adaptation, while the dual ARM Cortex-A9 MPCore can run application software, device control, and data-management tasks. The 1.5 GHz clock figure provides a verified headline frequency, but image throughput depends on memory bandwidth, I/O configuration, internal resources, and firmware architecture. A complete design should include a reliable image-sensor or host interface, timing closure, thermal analysis, and validation of processor-to-FPGA communication. Confirm resource and pin assignments using the device documentation.
Recommended
Custom hardware acceleration platforms
The 10AS066K1F35E1HG is well suited to custom hardware acceleration platforms that require both programmable logic and a software-managed control subsystem. The 660,000 logic elements allow designers to implement parallel algorithms, protocol engines, or application-specific accelerators, while the ARM Cortex-A9 MPCore can manage setup, telemetry, control, and data movement. The 1152-ball FCFBGA package supports high integration but requires controlled BGA assembly and careful power distribution. The verified data does not provide internal memory, DSP, transceiver, or power figures, so those specifications are [DATA_NEEDED: resource and power details]. Evaluate the device through a representative benchmark and the current Intel design flow.
Recommended
Recommended Products Summary
Engineering reference data for 10AS066K1F35E1HG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product |
|---|---|
| Brand | Intel |
| Package | 1152-pin FCFBGA, 35 mm x 35 mm |
| Logic Elements | 660000 |
| Clock Capability | 1.5 GHz |
| Processor | Dual ARM Cortex-A9 MPCore |
| FPGA I/O | 396 I/O |
| Technology | TSMC |
| Core Voltage | 0.9 V |
| Drop-in Verification | No verified replacement identified |
Key Differentiators
- Higher verified logic capacity in the target listing (vs 10AS057K1F35E1HG)
- Integrated processor subsystem (vs 10AS066H2F34I1HG)
- Large 1152-ball package with 396 listed I/O (vs 10AS027H1F34I1SG)
Design Notes
Use a manufacturer-approved power architecture for the 10AS066K1F35E1HG and validate every rail, sequencing requirement, tolerance, and current limit against the applicable device documentation. The verified data establishes a 0.9 V core voltage but does not provide a complete power budget. Estimate rail power only after selecting the final FPGA configuration, clock rates, I/O activity, memory interfaces, and processor workload; then confirm the result with simulation and hardware measurements.
Treat the 1152-pin FCFBGA package as a high-speed BGA design rather than a conventional low-pin-count IC. Follow the official land pattern, escape strategy, via arrangement, and reference-plane recommendations. Maintain continuous reference planes, minimize return-path discontinuities, control differential-pair geometry where applicable, and verify signal integrity with the actual stack-up, connectors, and peripherals. The supplied data does not include a complete public ball map, so obtain it before routing.
Plan thermal management from the device's worst-case configuration, not from the headline 660,000-logic-element or 1.5 GHz figures alone. The verified web data does not provide junction temperature, thermal resistance, or package power limits. Use the manufacturer thermal model and power estimator, calculate an estimated junction rise only after defining the configuration and ambient condition, and validate the result with board measurements. Keep airflow or conduction paths consistent with the final system enclosure.
Do not infer interchangeability from the Arria 10 family name or a related ordering code. The target is listed with 396 I/O and a 1152-pin FCFBGA package, but the supplied cross-reference results do not prove identical pinout, logic capacity, temperature grade, speed grade, or power behavior for any candidate. Before replacement, compare the complete MPN, package drawing, ball map, configuration limits, software support, and lifecycle status. If those values differ, budget for PCB redesign and revalidation.
Compliance Information
The supplied verified data does not provide RoHS, REACH, lead-free, halogen-free, conflict-minerals, or automotive-qualification information. AEC-Q100 is not established and is not assumed for this FPGA.
