10AS066K1F35E1HG - 660K Logic Elements, 1.5 GHz SoC FPGA | Intel
MPN: 10AS066K1F35E1HG ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
10AS066K1F35E1HG Overview
A system-on-chip FPGA is an integrated circuit that combines programmable logic with a processor subsystem. The programmable logic implements parallel datapaths, interface bridges, signal processing, and application-specific accelerators, while the ARM processors support operating systems, control software, networking stacks, and supervisory functions. Within the product hierarchy, this part is an FPGA, programmable logic device, SoC FPGA, system-on-chip, embedded integrated circuit, and semiconductor. The SoC architecture helps designers replace separate processor and FPGA devices with one programmable platform.
The verified distributor data identifies 660,000 logic elements and 1.5 GHz operation as the principal functional figures. The device also exposes 396 FPGA I/O according to the comparison search result. Its 1152-ball package supports the high pin density required by the Arria 10 SX platform, while the 35 mm by 35 mm package format is intended for advanced BGA PCB assembly. The embedded dual-core ARM Cortex-A9 MPCore and CoreSight subsystem provide a practical basis for software-managed control of programmable hardware.
The product is part of Intel's Arria 10 SX family, which is designed for systems that need an integrated combination of processor performance and programmable logic. The MPN indicates the 10AS066 device in an F35 package, with the final ordering characters identifying the specific device option. Because the supplied web results do not provide a detailed pin table, transceiver count, memory capacity, temperature grade, or power figures, those values are explicitly marked as unavailable rather than inferred. Engineers should consult the manufacturer documentation for device-specific implementation limits and board requirements.
Typical applications include cloud-computing infrastructure, Internet-of-Things gateways, industrial automation controllers, communications equipment, and embedded systems requiring deterministic hardware acceleration alongside software control. The integrated ARM subsystem can manage protocols and system services while the FPGA fabric handles parallel processing, data conversion, or custom I/O. The 1.5 GHz capability and 660,000 logic elements make the device suitable for computationally substantial programmable designs when supported by appropriate power, thermal, signal-integrity, and PCB resources.
The principal design trade-off is integration versus BGA implementation complexity. A 1152-pin FCFBGA device requires controlled-impedance routing, escape analysis, reliable power distribution, thermal planning, and manufacturer-recommended assembly processes. Designers should validate the complete device configuration, transceiver usage, memory interface requirements, and software support before release. This product page synthesizes the verified distributor specifications, official ordering-page information, package details, pricing-availability references, and explicit engineering uncertainties.
Drop-in alternatives for 10AS066K1F35E1HG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10AS066K1F35E1HG (same form factor and footprint) — differing in Package, Logic Elements, Mounting Type, Speed Grade, RoHS Status.
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No drop-in alternatives available for this product.
Request Alternatives10AS066K1F35E1HG Maximum Ratings & Electrical Characteristics
| Product Type | System On Chip (SoC) IC |
| FPGA Family | Arria 10 SX |
| Logic Elements | 660000 |
| Maximum Clock Frequency | 1.5 GHz |
| Processor | Dual ARM Cortex-A9 MPCore |
| CoreSight | Supported |
| FPGA I/O | 396 I/O |
| Package Type | FCFBGA |
| Pin Count | 1152 |
| Package Dimensions | 35 mm x 35 mm |
| Terminal Form | Ball |
| Technology | TSMC |
| Core Voltage | 0.9 V |
| Mounting Type | Surface Mount |
| RoHS Status | unknown |
| REACH Status | unknown |
10AS066K1F35E1HG 35 mm x 35 mm Pin Configuration Guide
Pin configuration for 10AS066K1F35E1HG (35 mm x 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS066K1F35E1HG.
Refer to the datasheet for full pin configuration.
Typical Applications
10AS066K1F35E1HG is suitable for 6 applications: Cloud-computing infrastructure, Industrial automation controllers, Communications and networking equipment, Internet-of-Things gateways, Embedded vision and data processing, Custom hardware acceleration platforms.
Cloud-computing infrastructure
The 10AS066K1F35E1HG is suitable for cloud-computing infrastructure requiring programmable acceleration together with embedded control software. Its verified 660,000 logic elements and 1.5 GHz clock capability provide resources for custom datapaths, protocol handling, and workload-specific processing. The dual ARM Cortex-A9 MPCore can run supervisory software, operating-system services, and management functions while the FPGA fabric handles parallel operations. In a typical platform, the SoC FPGA would connect to memory, high-speed interfaces, and management networks. System architects must validate power delivery, thermal limits, board signal integrity, and software support before deployment.
Recommended
Industrial automation controllers
The 10AS066K1F35E1HG fits industrial automation controllers that need deterministic FPGA processing and a processor-managed software environment. The 660,000 logic elements can implement control loops, encoder interfaces, data aggregation, and custom real-time functions, while the dual ARM Cortex-A9 MPCore supports protocol stacks, diagnostics, and system management. Its 396 FPGA I/O figure indicates substantial user-I/O capacity, although the exact I/O standard and bank assignment require manufacturer documentation. The 35 mm by 35 mm FCFBGA package supports dense integration but demands disciplined power, thermal, and escape-layout design. Engineers should verify environmental grades and operating conditions before field use.
Recommended
Communications and networking equipment
The 10AS066K1F35E1HG can support communications equipment that combines high-throughput programmable logic with embedded network control. The 1.5 GHz device capability and 660,000 logic elements are useful for packet processing, interface adaptation, filtering, and protocol-specific acceleration, while the dual ARM Cortex-A9 MPCore can manage control-plane tasks and software services. The verified 1152-pin FCFBGA package and 396 FPGA I/O listing indicate a high-density platform rather than a simple peripheral device. Designers must confirm transceiver details, supported I/O standards, power rails, impedance requirements, and thermal performance from the official documentation before selecting it for a communications design.
Recommended
Internet-of-Things gateways
The 10AS066K1F35E1HG is appropriate for Internet-of-Things gateways where software connectivity and hardware-level sensor or protocol processing must coexist. The dual ARM Cortex-A9 MPCore provides a processor subsystem for networking, security services, device management, and application software. The FPGA fabric can accelerate sensor aggregation, custom interfaces, filtering, and data conversion. Its 660,000 logic elements and 1.5 GHz clock capability offer meaningful programmable capacity, but the verified data does not state power consumption or supported memory configurations. For battery or thermally constrained systems, compare the complete power budget and verify the available package and board-level implementation requirements.
Recommended
Embedded vision and data processing
The 10AS066K1F35E1HG can serve embedded vision and data-processing systems that need parallel FPGA execution and embedded software control. Its 660,000 logic elements support pixel processing, filtering, feature extraction, and interface adaptation, while the dual ARM Cortex-A9 MPCore can run application software, device control, and data-management tasks. The 1.5 GHz clock figure provides a verified headline frequency, but image throughput depends on memory bandwidth, I/O configuration, internal resources, and firmware architecture. A complete design should include a reliable image-sensor or host interface, timing closure, thermal analysis, and validation of processor-to-FPGA communication. Confirm resource and pin assignments using the device documentation.
Recommended
Custom hardware acceleration platforms
The 10AS066K1F35E1HG is well suited to custom hardware acceleration platforms that require both programmable logic and a software-managed control subsystem. The 660,000 logic elements allow designers to implement parallel algorithms, protocol engines, or application-specific accelerators, while the ARM Cortex-A9 MPCore can manage setup, telemetry, control, and data movement. The 1152-ball FCFBGA package supports high integration but requires controlled BGA assembly and careful power distribution. The verified data does not provide internal memory, DSP, transceiver, or power figures, so those specifications are [DATA_NEEDED: resource and power details]. Evaluate the device through a representative benchmark and the current Intel design flow.
Recommended
Recommended Products Summary
Engineering reference data for 10AS066K1F35E1HG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product |
|---|---|
| Brand | Intel |
| Package | 1152-pin FCFBGA, 35 mm x 35 mm |
| Logic Elements | 660000 |
| Clock Capability | 1.5 GHz |
| Processor | Dual ARM Cortex-A9 MPCore |
| FPGA I/O | 396 I/O |
| Technology | TSMC |
| Core Voltage | 0.9 V |
| Drop-in Verification | No verified replacement identified |
Key Differentiators
- Higher verified logic capacity in the target listing (vs 10AS057K1F35E1HG)
- Integrated processor subsystem (vs 10AS066H2F34I1HG)
- Large 1152-ball package with 396 listed I/O (vs 10AS027H1F34I1SG)
Design Notes
Use a manufacturer-approved power architecture for the 10AS066K1F35E1HG and validate every rail, sequencing requirement, tolerance, and current limit against the applicable device documentation. The verified data establishes a 0.9 V core voltage but does not provide a complete power budget. Estimate rail power only after selecting the final FPGA configuration, clock rates, I/O activity, memory interfaces, and processor workload; then confirm the result with simulation and hardware measurements.
Treat the 1152-pin FCFBGA package as a high-speed BGA design rather than a conventional low-pin-count IC. Follow the official land pattern, escape strategy, via arrangement, and reference-plane recommendations. Maintain continuous reference planes, minimize return-path discontinuities, control differential-pair geometry where applicable, and verify signal integrity with the actual stack-up, connectors, and peripherals. The supplied data does not include a complete public ball map, so obtain it before routing.
Plan thermal management from the device's worst-case configuration, not from the headline 660,000-logic-element or 1.5 GHz figures alone. The verified web data does not provide junction temperature, thermal resistance, or package power limits. Use the manufacturer thermal model and power estimator, calculate an estimated junction rise only after defining the configuration and ambient condition, and validate the result with board measurements. Keep airflow or conduction paths consistent with the final system enclosure.
Do not infer interchangeability from the Arria 10 family name or a related ordering code. The target is listed with 396 I/O and a 1152-pin FCFBGA package, but the supplied cross-reference results do not prove identical pinout, logic capacity, temperature grade, speed grade, or power behavior for any candidate. Before replacement, compare the complete MPN, package drawing, ball map, configuration limits, software support, and lifecycle status. If those values differ, budget for PCB redesign and revalidation.
Compliance Information
The supplied verified data does not provide RoHS, REACH, lead-free, halogen-free, conflict-minerals, or automotive-qualification information. AEC-Q100 is not established and is not assumed for this FPGA.
