FPGA & CPLD

XC7A75T-2FGG484I

XC7A75T-2FGG484I - Artix-7 FPGA, 75K Logic Cells | AMD

The AMD XC7A75T-2FGG484I is an Artix-7 field programmable gate array (FPGA) with 75,520 logic cells, 285 user I/O pins, and 3,870,720 bits of block RAM. It is supplied in a 484-ball FBGA (FGG484) package, uses a 28nm CMOS process, operates from a 1V core supply, and is rated for industrial temperature from -40C to +100C. The '2' in the part number denotes the -2 speed grade, the fastest standard option for this device family. A field-programmable gate array (FPGA) is a reconfigurable semiconductor device that implements digital logic by configuring a fabric of LUTs, flip-flops, block RAM, and DSP slices through a bitstream. FPGAs fill the design gap between ASSPs and ASICs: they provide parallel execution, low-latency I/O, and field upgradeability. In a system hierarchy, the FPGA often sits beside an embedded processor, handling high-throughput signal conditioning while the processor runs control stacks. Key features of the XC7A75T-2FGG484I include 3,870,720 block RAM bits, 285 versatile user I/Os with LVCMOS/LVDS and other standard interfaces, and integrated clock management tiles containing MMCM and PLL circuits. The FGG484 package enables easy migration between selected Artix-7 family members, reducing redesign risk when scaling density. All packages are lead-free (Pb-free) options. The Artix-7 architecture is optimized for low-power, cost-sensitive applications while retaining DDR3/DDR4 memory interfaces, multi-gigabit transceivers where available, and PCIe hard blocks in larger devices. The 28nm high-k metal gate process balances static and dynamic power. Designers use AMD Vivado Design Suite for synthesis, implementation, and bitstream generation, with support for IP cores such as MIG, AXI interconnects, and error correction. Typical applications for the XC7A75T-2FGG484I include industrial motor control and factory automation, software-defined radio baseband processing, machine vision and video pipelines, medical imaging front ends, and test and measurement instrumentation. The industrial temperature range makes it suitable for harsh environments in transportation, energy, and rugged communications. When designing with this FPGA, pay close attention to power integrity: decouple the 1.0V VCCINT rail with multiple low-ESR ceramic capacitors and follow AMD's PCB design recommendations. The FGG484 package must be assembled with proper BGA reflow profiles, and the JTAG/configuration pins should be made accessible for system-level debug and field updates.