A3PE3000-2FGG484I - 3M-Gate Flash FPGA 341 I/O BGA-484 | Microchip
MPN: A3PE3000-2FGG484I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $132.5 | $132.50 |
| 10 | $122 | $1,220.00 |
| 100 | $109.8 | $10,980.00 |
| 500 | $98.6 | $49,300.00 |
| 1,000 | $89.4 | $89,400.00 |
Drop-in alternatives for A3PE3000-2FGG484I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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M1A3PE3000-2FGG484I
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE3000-2FG484I
✅ Drop-In✓ In Stock
$59.6 / Unit
View Datasheet →A3PE3000-FGG484I
✅ Drop-In✓ In Stock
$1451.56 / Unit
View Datasheet →A3PE3000L-FGG484I
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Contact for price
View Datasheet →A3PE1500-2FGG484I
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →A3PE3000-2FGG484I Maximum Ratings & Electrical Characteristics
| Logic Cells | 75264 |
| System Gates | 3000000 |
| User I/O | 341 |
| Family | ProASIC3E (Flash) |
| Configuration Memory | Nonvolatile on-chip Flash |
| Speed Grade | -2 |
| Package | 484-Ball FBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial, I suffix) |
| Programming | In-system, live field upgrade |
| Soft Processor Support | Optional soft ARM support |
| Configuration Bits | 516096 |
| RoHS Status | Compliant (green package per manufacturer data) |
A3PE3000-2FGG484I 484-ball fbga Pin Configuration Guide
Complete pinout information for A3PE3000-2FGG484I (484-ball fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000-2FGG484I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000-2FGG484I is suitable for 6 applications: Industrial Automation and Motor Control, Aerospace and Defense Processing, Communications Infrastructure Line Cards, Medical Equipment Control Logic, Secure Single-Chip Embedded Systems, Test and Measurement Instrumentation.
Industrial Automation and Motor Control
The A3PE3000-2FGG484I fits industrial automation because its -40C to +100C industrial rating, 3M gates of fabric, and 341 I/Os support multi-axis motor control, PWM generation, and fieldbus interface logic in one chip. Its nonvolatile flash configuration means drives and PLC modules start instantly at power-on with no configuration device to fail in electrically noisy factory environments. Placed as the main sequencing and interface FPGA between industrial Ethernet PHYs and gate-driver circuits, the 341 user I/Os consolidate encoder, PWM, and safety interconnect that would otherwise need multiple CPLDs, reducing BOM count while the live field-upgrade feature allows on-site firmware updates without hardware access.
Recommended
Aerospace and Defense Processing
Defense and aerospace subsystems favor the A3PE3000-2FGG484I because its flash-based configuration has no bitstream-load window vulnerable to upset or interception, a recognized advantage over SRAM FPGAs in secure platforms. The 484-ball FBGA with 341 I/Os supports wide parallel buses to ADCs, memories, and backplanes in avionics interface cards, while the 3M-gate fabric implements glue logic, bus bridging, and custom protocol engines. The related M1A3PE3000-2FGG484I variant provides an upgraded supply flow for high-reliability programs using the same footprint, so a defense board can be sourced with consistent mechanical and electrical interchangeability across build phases and obsolescence mitigation plans.
Recommended
Communications Infrastructure Line Cards
Telecom and networking line cards use the A3PE3000-2FGG484I as system glue: bridging backplane buses to MACs, framer devices, and microprocessors. The 341 I/Os accommodate wide data paths at 1.5V-3.3V logic levels across multiple I/O banks, and the ProASIC3E enhanced I/O resources documented in the family datasheet support the level-shifting flexibility that mixed-voltage legacy line cards demand. Instant-on flash configuration lets a card become active within milliseconds of shelf insertion, an operational benefit in hot-swap slots where SRAM FPGA boot delay would delay service bring-up. Designers should budget I/O bank voltages early since bank grouping constrains which signals can co-locate on the same VCCI rail.
Recommended
Medical Equipment Control Logic
Medical imaging and diagnostic equipment benefit from the A3PE3000-2FGG484I's deterministic instant-on behavior and large I/O count. Patient-positioning controllers, detector interface boards, and front-end timing systems use the 3M-gate fabric for sensor aggregation and safety interlock logic, while the flash configuration survives power cycling without a bootloader - important in equipment that must be ready on demand in clinical settings. The industrial -40C to +100C temperature range comfortably covers medical equipment ambient requirements, and single-chip operation without external configuration memory simplifies design-in of failure-mode documentation for regulatory submissions. Field upgrades via live programming support in-service software revisions.
Recommended
Secure Single-Chip Embedded Systems
Applications requiring configuration confidentiality choose the A3PE3000-2FGG484I because the bitstream never leaves the chip: flash cells are programmed in-system and encrypted load paths typical of SRAM FPGAs are unnecessary. Anti-tamper-sensitive and IP-protected designs in payment terminals, industrial licensing, and proprietary instruments use the 3M-gate fabric to embed soft ARM processors (family-documented optional soft ARM support) alongside custom logic, achieving system-on-chip integration. With 341 I/Os the part absorbs memory controllers, sensor buses, and host interfaces, and the absence of an external configuration device removes a physical attack surface. Designers should pair the FPGA with secure storage for application data only.
Recommended
Test and Measurement Instrumentation
Bench and automated test instruments use the A3PE3000-2FGG484I for timing generation, trigger distribution, and instrument bus interfacing. The -2 speed grade provides the fabric performance needed for fine-grained timing adjustments across the 341 I/Os, which easily cover multi-channel digital probe interfaces and relay-control matrices. Because the design reprograms in-system, instrument manufacturers ship one PCB and differentiate SKUs in firmware - the flash configuration updates live in the field. Instant-on startup means the instrument front panel is responsive immediately after power-on, and no configuration PROM adds a failure point in environments with frequent power cycling such as manufacturing test stations.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000-2FGG484I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1A3PE3000-2FGG484I | A3PE3000-2FG484I | A3PE3000-FGG484I | A3PE3000L-FGG484I | A3PE1500-2FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-Ball FBGA | 484-Ball FBGA - same | 484-BGA (FG code) - same footprint | 484-Ball FBGA - same | 484-Ball FBGA - same | 484-Ball FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3000000 | 3000000 | 3000000 | 3000000 | 3000000 | 1500000 (-50%) |
| User I/O | 341 | 341 | 341 | 341 | 341 | [DATA_NEEDED] |
| Speed Grade | -2 | -2 | -2 | -1 (slower) | -1 (low power) | -2 |
| Configuration | Nonvolatile on-chip Flash | Nonvolatile on-chip Flash | Nonvolatile on-chip Flash | Nonvolatile on-chip Flash | Nonvolatile on-chip Flash | Nonvolatile on-chip Flash |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (I suffix) | Industrial (I suffix) | Industrial (I suffix) | Industrial (I suffix) | Industrial (I suffix) |
| Power Profile | Standard | Standard | Standard | Standard | Low power (reduced static) | Standard (smaller fabric, less total power) |
| Soft ARM Support | Optional soft ARM support | Yes (same family) | Yes | Yes | Yes | Yes (reduced fabric headroom) |
Key Differentiators
- Highest fabric capacity in the 484-ball package options on this page (vs A3PE1500-2FGG484I)
- Faster speed grade than the standard non-2 variant (vs A3PE3000-FGG484I)
- Lower static power option available on the same die (vs A3PE3000-2FG484I)
- Identical-die high-reliability supply path (vs M1A3PE3000-2FGG484I)
Design Notes
The 484-ball FBGA uses a 1.0 mm ball pitch in a 23 x 23 mm body, so plan fanout with via-in-pad or dogbone escapes on 0.3-0.4 mm microvias for inner-row balls. Group power/ground ball clusters to create via farms under the package center, and reserve at least two full signal layers for fabric I/O escape before routing the -2 speed grade timing-critical nets first. Verify the exact mechanical drawing and ball A1 orientation in the ProASIC3E datasheet package section before generating the land pattern.
Plan I/O bank voltages before pin assignment: the 341 user I/Os are organized in banks that share a common VCCI rail, so mixed 3.3V/2.5V/1.8V interfaces must be mapped to matching banks in Libero SoC, not adjusted later. Estimated: with a typical 1.5V core rail and multiple I/O rails, generate clean rails with sequenced DC-DC converters and add 100 uF bulk plus 0.1 uF per bank decoupling; confirm exact core current figures in the manufacturer datasheet power calculator rather than from estimates.
Do not treat the FGG and FG package codes as freely interchangeable without checking the mechanical drawing - lead finish and orderable-code conventions differ between Microsemi-legacy and current Microchip part numbers. Also confirm speed grade compatibility when migrating designs: a -2 design compiled for timing may fail static timing on a -1 part (e.g., A3PE3000-FGG484I). Always re-run timing analysis in Libero SoC after any MPN change, even for pin-identical variants.
At -2 speed grade, preserve setup/hold margins by keeping clock distribution symmetric: use the on-chip PLL and global routing resources rather than cascading fabric logic in clock paths, and length-match source-synchronous bus groups on the PCB. Estimated: keep single-ended stubs under 10 mm and add 22-33 ohm series termination on fast output banks to control reflections into the BGA field. Reference the manufacturer datasheet I/O section for bank-specific drive and slew settings.
Compliance Information
FGG package code denotes lead-free green package per Microchip distributor listings. Verify REACH and full material declarations on the Microchip product page.
