FPGA & CPLD
Products (6,800+)
RTAX4000SL-CQ352E - 4M-Gate Rad-Tolerant FPGA, 352-CQFP | Microchip
The Microchip Technology (Actel/Microsemi) RTAX4000SL-CQ352E is a radiation-tolerant FPGA from the RTAX-SL family offering 4 million equivalent system gates, 40,320 logic cells, and a 1.5V core supply in a 352-terminal CQFP ceramic package. It is built on 0.15 um CMOS technology and is designed specifically for space-flight systems where single-event effects and total ionizing dose must be tolerated. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the radiation environment of space, including proton and heavy-ion bombardment encountered in low-Earth orbit and deep-space missions. Within the programmable logic hierarchy, the RTAX4000SL sits at the top tier of the RTAX-S/SL family (semiconductor -> programmable logic device -> FPGA -> radiation-tolerant FPGA), one step above the mid-density RTAX2000S/SL and sharing its architecture with the commercial Axcelerator family from which it was derived. Key features include densities of up to four million system gates, embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and dedicated carry logic for arithmetic datapaths. The anti-fuse-based fabric is live-at-power-up, eliminating the need for external configuration flash and reducing boot-time risk in orbit. The ceramic CQFP package provides the hermeticity required for space qualification flows. Architecturally, the RTAX4000SL derives from the commercial Axcelerator family, so designers can prototype using low-cost, reprogrammable equivalents and then migrate the EDIF netlist and pinout to the radiation-tolerant device using Microchip's documented prototyping methodology and footprint-compatible adaptor boards. Typical applications include satellite payload processing, spacecraft bus controllers, telemetry and command interfaces, and radiation-exposed instrumentation where single-chip, low-power, live-at-power-up operation is mandatory. A critical design consideration is the use of Triple-Module Redundancy (TMR) in the RTL for flip-flops sensitive to single-event upsets, since anti-fuse FPGAs tolerate configuration upsets well but user flip-flops still require mitigation. This page synthesizes distributor data, drop-in alternative analysis, and practical space-design notes not found in the manufacturer datasheet, with pricing and stock signals refreshed as of 2026-09-01.
RTAX4000SL-CQ352V - 4M-Gate Rad-Tolerant FPGA | Microchip
The Microchip Technology RTAX4000SL-CQ352V is a radiation-tolerant, CMOS field-programmable gate array (FPGA) delivering 4,000,000 equivalent system gates in a 352-pin ceramic column grid array (CQ352) package, designed specifically for space-flight applications. A radiation-tolerant FPGA is a programmable logic device engineered to survive the high-radiation environment of orbital and deep-space missions, where standard commercial FPGAs would suffer single-event effects (SEE) and total ionizing dose (TID) degradation. Within the power-management-free logic hierarchy, the FPGA sits between microprocessors and ASICs: it provides ASIC-like gate density with field reprogrammability. The RTAX-S/SL family is based on the commercial Microsemi Axcelerator architecture, adapted with radiation-hardened-by-design circuitry. Key features of the RTAX4000SL-CQ352V include 40,320 configurable logic blocks (CLBs) organized as 60,480 logic cells, embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and dedicated carry logic for arithmetic functions. The SL variant adds enhanced low-power characteristics relative to the standard S grade. Live-at-power-up (LAPU) operation via antifuse-like flash-based configuration means no external configuration PROM is required, achieving a true single-chip form factor - a decisive advantage for minimizing board area, mass, and failure points in satellites. Architecturally, the device inherits the Axcelerator fabric with itsVersaTile structure, combining sequential and combinational logic efficiently, and supports system-level features such as embedded FIFOs and clock segmentation that simplify high-speed data-path design in payloads, telemetry subsystems, and on-board data handling units. Typical applications include satellite payload processing, spacecraft avionics and command/data handling, instrument control in scientific probes, and radiation-exposed industrial systems. The high gate count accommodates complete bus interfaces (SpaceWire, MIL-STD-1553), DSP preprocessing, and glueless integration of legacy ASIC functions. A key design consideration is thermal management: the ceramic CQ352 package supports radiation tolerance but requires careful power budgeting and board-level heat spreading, since space systems lack convective cooling. Verify speed-grade and radiation-lot ordering codes (V suffix) against the mission specification early. This page synthesizes verified distributor data, drop-in family alternatives, pricing tiers, and practical space-design notes not found in the manufacturer datasheet, providing one-stop selection intelligence for radiation-tolerant FPGA procurement. Pricing shown is as of 2026-09-01.
RTAX4000SL-LG1272B - 4M Gate Rad-Tolerant FPGA, 1.5V LGA | Microchip
The Microchip Technology RTAX4000SL-LG1272B is a radiation-tolerant FPGA from the RTAX-SL family offering 4 million equivalent system gates with 40320 logic cells, fabricated on a 0.15 um CMOS process and operating at a nominal 1.5V core supply, packaged in a 1272-pin LGA (LG1272) ceramic land-grid-array package supplied in box quantities. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the total ionizing dose (TID) and single-event effects (SEE) encountered in orbital and deep-space environments. Within the power-management-free programmable logic hierarchy, the RTAX-SL family sits in the space-flight class of SRAM-based antifuse-free programmable logic devices, positioned above commercial FPGAs and below fully radiation-hardened (rad-hard) devices, offering an optimal cost/reliability point for LEO and GEO missions. Key features include 4M system gates across 40320 cells, embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and carry logic for arithmetic chains. The device is live-at-power-up, requiring no external configuration device - a decisive advantage for single-chip space payloads where boot reliability is mission-critical. Technically, the RTAX-SL architecture is derived from Microsemi/Microchip commercial Accelerator devices, combining a fine-grained logic fabric with dedicated embedded memory modules. The 0.15 um metal-to-metal antifuse-based process supports a supply range of 1.425V to 1.575V; the -1 speed grade variant specifies a maximum combinatorial delay of 0.99 ns per logic cell. Design entry is supported by Microchip Libero SoC with the RTAX-S/SL macro libraries. Typical applications include satellite payload data processing, on-board telemetry and telecommand (TMTC) controllers, spacecraft bus avionics, and radiation-tolerant glueless interfaces to sensor arrays. The 1272-pin LGA package provides the high I/O count needed for wide parallel data paths in imaging and communications payloads. A key design consideration: RTAX-SL devices are one-time programmable (antifuse), so prototyping must use the footprint-compatible RTAX4000SL-1LG1272PROTO adapter methodology or the companion Axcelerator family before flight-lot programming. This page synthesizes distributor pricing intelligence, same-family drop-in alternatives, and practical space-design notes not found in the manufacturer datasheet.
RTAX4000SL-LG1272E - 4M-Gate Rad-Tolerant FPGA LGA-1272 | Microchip
The Microchip Technology (Actel/Microsemi) RTAX4000SL-LG1272E is a radiation-tolerant FPGA from the RTAX-SL family offering 4,000,000 equivalent gates, 40,320 CLBs (60,480 logic cells), and 1.5V core operation, housed in a 1272-pin land grid array (LGA-1272) ceramic column package supplied in a box. A radiation-tolerant FPGA is a programmable logic device engineered to survive the ionizing radiation and heavy-ion environments of spaceflight, where commercial FPGAs would suffer single-event upsets (SEUs) and total ionizing dose (TID) degradation. Within the power hierarchy of space electronics, the RTAX-SL family sits in the antifuse-based, single-chip, live-at-power-up class of programmable logic, sitting above commercial FPGA families and below fully radiation-hardened (rad-hard) devices in cost and availability. Key features include the RTAX-SL 0.15um CMOS process, a 1.425V to 1.575V core supply window, true single-chip form factor (no configuration PROM required at boot), and live-at-power-up operation that is critical for spacecraft switch-on reliability. The antifuse programmable interconnect is inherently immune to configuration upsets, dramatically reducing SEU mitigation overhead compared to SRAM FPGAs. Architecturally, the RTAX4000SL is built from a sea of combinational and sequential logic modules (Axcelerator-derived fabric) with embedded SRAM blocks, high-performance clock conditioning, and abundant I/O banks supporting multiple single-ended and differential standards. The 0.15um antifuse process yields low static power, an important consideration for power-budget-limited satellites and probes. Typical applications include satellite payload data processing, spacecraft bus control and telemetry, sensor interface and instrument control on planetary missions, and deep-space communication baseband processing, where single-chip radiation tolerance and live-at-power-up startup directly reduce mission risk. Design consideration: the LGA-1272 ceramic column package demands rigid-flex-aware PCB land patterns, column-grid solder inspection, and thermal-expansion-matched board materials; prototype using the footprint-compatible adapter methodology described in Microchip's RTAX-S/SL prototyping application note before flight-lot commitment. This page synthesizes verified distributor data, same-package drop-in family variants, and practical design notes not found in the manufacturer datasheet alone.
RTPF500ZT - RT PolarFire FPGA 481k LE Rad-Tolerant | Microchip
The Microchip Technology RTPF500ZT is a radiation-tolerant (RT) PolarFire FPGA featuring 481,000 logic elements, 33 Mbits of embedded SRAM, and 1,480 math (DSP) blocks, housed in a hermetically sealed 1,509-column ceramic column grid array (CG1509) package with 1.00 mm pitch and integrated decoupling capacitors. It operates from a nominal 1.0 V core supply (0.97 V to 1.03 V) and is qualified to QML Class Q for mission-critical space systems. A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks, programmable interconnects, and embedded memory that designers configure in the field. Within the power-management-free hierarchy of programmable logic, FPGAs sit between fixed-function ASICs and software-programmable processors, offering hardware parallelism with reprogrammability. Key features include robust total ionizing dose (TID) tolerance of 100 krad, immunity to configuration upsets at LET 80 MeV-cm2/mg with fluence greater than 5E8 ions/cm2, and enhanced single-event latch-up (SEL) performance compared with the earlier RTPF500T. SEFI events in the reset circuit are statistically estimated at approximately 1 in 187 years in GEO orbit. The device derives from the commercial PolarFire family built on 28 nm SONOS process technology, which is non-volatile and reprogrammable. Flip-chip bump spacing was modified relative to commercial PolarFire silicon to enable integration into the hermetically sealed ceramic package, and RTPF500ZT adds enhanced on-orbit programming methodology and a low-cost plastic package option over RTPF500T. Typical applications include satellite payload processing, on-board data handling, spaceflight image and signal processing, and reconfigurable computing in LEO, MEO, and GEO missions where low static power and radiation tolerance are critical. A key design consideration is supply integrity: the 1.0 V core rail must be held within 0.97 V to 1.03 V under all load transients, so designers should budget decoupling and regulator droop carefully; the integrated package decoupling capacitors assist with high-frequency transient response. This page synthesizes verified distributor and manufacturer data, radiation performance figures, drop-in family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
TDA54-Q1 - Premium ADAS SoC with C7 NPU | Texas Instruments
The TDA54-Q1 is a premium System-on-Chip (SoC) from Texas Instruments' Jacinto™ family, designed for advanced driver assistance systems (ADAS) and software-defined vehicles. It integrates a next-generation C7™ neural processing unit (NPU) for high-performance edge AI inference, along with multiple specialized subsystems for vision processing, display rendering, networking, and security. The TDA54-Q1 is part of the TDA5x series, which builds on two decades of TI's leadership in automotive processors, offering scalable high-performance solutions. The TDA5x architecture is an upgrade from the TDA4x series, allowing software developed for TDA4x to be easily ported to TDA5x with minimal rework, thus reusing software assets and enabling more complex applications. A System-on-Chip (SoC) integrates a processor, memory, and peripherals on a single die, serving as the central compute engine for embedded systems. In automotive ADAS, the SoC is the core of the electronic control unit (ECU), handling sensor fusion, object detection, and decision-making. The TDA54-Q1 sits at the top of the ADAS compute hierarchy, alongside other automotive SoCs like the NVIDIA Orin and Mobileye EyeQ, but is distinguished by its dedicated C7 NPU and TI's robust safety and security features. Key features of the TDA54-Q1 include the C7 NPU for AI acceleration, multiple high-performance CPU cores (likely Arm Cortex-A series, though exact configuration is [DATA_NEEDED]), and dedicated hardware accelerators for vision and deep learning. The SoC supports high-bandwidth memory interfaces and high-speed networking (e.g., Ethernet, PCIe) for data-intensive applications. It is designed to meet automotive-grade quality standards, including AEC-Q100 qualification, ensuring reliable operation in harsh environments. Technically, the TDA54-Q1 leverages advanced process technology to deliver high compute density while managing power consumption. The integration of specialized subsystems offloads tasks from the main CPU, improving efficiency and real-time performance. The C7 NPU is optimized for convolutional neural networks (CNNs) and transformer models, enabling real-time object detection, lane detection, and driver monitoring. Typical applications include autonomous driving (Level 2+ to Level 4), ADAS features like automatic emergency braking and adaptive cruise control, and in-cabin monitoring systems. The TDA54-Q1 is also suitable for domain controllers that aggregate data from multiple sensors (cameras, radar, LiDAR) and run fusion algorithms. When designing with the TDA54-Q1, engineers must consider power delivery, thermal management, and signal integrity. The SoC requires multiple power rails with precise sequencing, and a robust PCB layout with adequate decoupling is essential. TI provides reference designs and evaluation modules to accelerate development.
TIBPAL16R8-25CFN - 25ns 8-Macrocell Impact PAL, 20-PLCC | TI
The Texas Instruments TIBPAL16R8-25CFN is a high-performance, low-power IMPACT-X PAL (Programmable Array Logic) device from Texas Instruments, delivering 25 ns maximum propagation delay and an 8-macrocell registered architecture in a 20-pin PLCC (9x9 mm) J-leaded package. The device combines Advanced Low-Power Schottky (ALS) technology with titanium-tungsten (Ti-W) fuses, providing 64 product terms, eight D-type registered outputs, and a typical operating frequency of 30 MHz at 5.25 V supply. A PAL (Programmable Array Logic) device is a one-time-programmable (OTP) SPLD that implements custom combinational and registered logic functions through a programmable AND-OR array, preceded by fixed OR gates and fed by user-defined product-term equations. Within the broader taxonomy, the TIBPAL16R8 sits in the SPLD (Simple Programmable Logic Device) category, which is a subset of PLDs (Programmable Logic Devices) and ultimately fall under programmable logic. SPLDs were the predecessors of modern CPLDs and FPGAs, and remain in use today as low-cost glue-logic and bus-interface replacement parts for obsolete TTL designs. Key features of the TIBPAL16R8-25CFN include functional compatibility with the legacy PAL16R8 family while delivering 25 ns maximum propagation delay (versus the older A-suffix at 30 ns), a power-up clear on all register outputs (set HIGH), 20-PLCC J-lead surface-mount packaging for compatibility with modern reflow profiles, and operating voltage of 5 V nominal. Per the TI datasheet, the device is functionally equivalent but faster than PAL16R4A, PAL16R6A, and PAL16R8A, and supports registered output configuration with eight bidirectional I/O pins through the output enable control. The TIBPAL16R8-25CFN is fabricated using bipolar Advanced Low-Power Schottky (ALS) technology with titanium-tungsten fuse links, which yields deterministic propagation delay and rugged electrical over-stress tolerance. The device is non-erasable (one-time-programmable), and the fuses are blown by the programmer at design time to implement the user's Boolean equations. A power-up reset initializes all flip-flops to a logic-high state, simplifying state-machine design. Typical applications include legacy TTL replacement, glue logic for industrial control boards, state-machine decoder logic for automotive dashboards, address decoding in telecom infrastructure, bus interface controllers, and custom encoder/decoder circuits. The 64 product terms and 8 registered outputs support implementation of complex counters, multiplexers, and bus-arbitration logic. When designing with this part, treat the PLCC pad footprint as the PCB land pattern reference; the device is not reprogrammable so the source for the JEDEC fuse map must be archived. Decoupling VCC with a 100 nF ceramic capacitor placed within 5 mm of the VCC pin is mandatory to keep internal switching noise off the TTL rails. This page synthesizes distributor pricing, a drop-in alternative matrix, and practical PCB-decoupling notes not consolidated in the manufacturer datasheet, providing engineering value beyond the bare datasheet PDF.
TPLD2001 - 18-GPIO PLD with I2C/SPI | Texas Instruments
The TPLD2001 is a programmable logic device (PLD) from Texas Instruments featuring 18 GPIOs and a selectable I2C/SPI interface. It is supplied in a 20-VSSOP package and integrates configurable macro-cells built from 2-, 3-, and 4-bit lookup tables (LUTs) together with sequential logic and analog blocks. The device operates from 1.71V to 5.5V over -40°C to 125°C and is qualified for automotive applications. A programmable logic device is an integrated circuit whose logic function is defined by the user after manufacturing. In the TPLD family, InterConnect Studio is used to configure the non-volatile memory, either by emulating OTP memory or permanently programming the one-time programmable fuse. PLDs sit between standard fixed-function logic and large CPLDs/FPGAs, providing a compact, low-power way to integrate glue logic, timing, reset, power sequencing, and I/O expansion functions. Key features include 18 GPIOs, 14 macrocells, and a configurable I2C/SPI port for system communication and in-system configuration. The 2/3/4-bit LUT macrocells allow flexible combinatorial logic; sequential blocks support timers, delays, and state machines. The wide 1.71V to 5.5V supply range permits operation from Li-ion batteries, 3.3V rails, or 5V industrial buses, and the -40°C to 125°C temperature range covers automotive and industrial environments. The device's analog blocks provide voltage monitoring and reset generation, eliminating external supervisor ICs. Its low power and compact 20-VSSOP package make it suitable for space-constrained designs. Because logic functions are configured in the OTP memory and the same base part can be used across many designs, inventory can be consolidated. The selectable I2C/SPI port also allows integration into microcontroller-based systems for status readback or dynamic reconfiguration when the non-volatile logic is emulated. Typical applications include timing delay generation, voltage monitoring and reset generation, power sequencing, I/O expansion, and glue logic consolidation in automotive body electronics, industrial sensors, and consumer devices. Designers can use InterConnect Studio to implement and simulate logic before programming. When designing with TPLD2001, plan the OTP programming step during production and verify I/O assignments before programming, because OTP cannot be changed after the permanent fuse is blown.
VM2152 - Versal Prime Adaptive SoC, 757K Logic Cells | AMD
The AMD VM2152 is a mid-range adaptive SoC from the Versal Prime series, integrating dual-core ARM Cortex-A72 application processors and dual-core ARM Cortex-R5F real-time processors with programmable logic. It features 757K logic cells, 112 Gb/s GTM transceivers, and support for high-bandwidth DDR memory interfaces including LPDDR5 up to 6400 Mb/s and DDR5 up to 5600 Mb/s. The device is available in a 1369-FCBGA package (35x35 mm) and operates at processor speeds up to 1.4 GHz for the A72 cores and 600 MHz for the R5F cores. An adaptive SoC (System-on-Chip) combines a processing system (PS) with programmable logic (PL) on a single die, enabling hardware-software co-design and dynamic reconfiguration. The Versal Prime series is the foundational family of AMD's adaptive compute acceleration platform (ACAP), targeting applications that require high data throughput, low latency, and flexibility. The VM2152 specifically uses the Processing System Wizard IP instead of the CIPS IP for configuring the processing system, a unique feature among Versal Prime devices. Key features of the VM2152 include 112 Gb/s GTM transceivers supporting 600 GbE networking, increased DSP capability compared to previous Versal Prime devices, and support for LPDDR5/DDR5 memory interfaces. The device also integrates a programmable network-on-chip (NoC) for efficient data movement between the PS, PL, and memory interfaces. These features make it suitable for high-speed connectivity, data center networking, and wired communications. From a technical perspective, the VM2152 leverages AMD's 7nm process technology, offering a balance of performance and power efficiency. The dual-core A72 cluster provides high-performance general-purpose computing, while the R5F cores handle real-time tasks. The programmable logic fabric supports custom accelerators and protocol implementations, and the integrated NoC simplifies system integration by providing a standardized interconnect. Typical applications include data center networking (600 GbE switches), storage controllers, wired communications (400G connectivity), and high-performance embedded computing. The device's high-bandwidth memory interfaces and transceivers enable it to handle massive data streams with low latency. When designing with the VM2152, careful attention must be paid to power delivery and thermal management due to its high performance. The 1369-FCBGA package requires a robust PCB layout with adequate decoupling and thermal vias. Additionally, the Processing System Wizard IP should be used for PS configuration, as the traditional CIPS IP is not supported on this device.
XA2S200E-6FT256I - 200K Gate FPGA | AMD | 256-FTBGA
The AMD XA2S200E-6FT256I is a member of the Spartan-IIE XA family of Field Programmable Gate Arrays (FPGAs), designed for automotive and industrial applications requiring high performance, abundant logic resources, and a rich feature set at a low cost. This device provides 200,000 system gates, 5,292 logic cells, and 1,176 Configurable Logic Blocks (CLBs), operating from a nominal 1.8V supply. It is housed in a 256-ball FTBGA (17x17 mm) package with 182 user I/O pins. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence "field-programmable." FPGAs are part of the broader programmable logic device (PLD) family, which sits above ASICs in flexibility but below them in unit cost at high volume. The Spartan-IIE family is a superior alternative to mask-programmed ASICs, avoiding the initial cost, lengthy development cycles, and inherent risk of conventional ASICs. FPGA programmability permits design upgrades in the field with no hardware replacement necessary. Key features of the XA2S200E-6FT256I include 57,344 total RAM bits, support for 1.71V to 1.89V supply voltage, and a -40°C to 100°C junction temperature range. The device uses a 0.15-micron CMOS process and supports I/O standards including LVCMOS, LVTTL, and HSTL. The -6 speed grade indicates a maximum internal clock frequency of approximately 200 MHz, suitable for moderate-speed control and data processing tasks. Technically, the Spartan-IIE architecture combines a configurable logic fabric with block RAM and dedicated routing resources. The 256-ball FTBGA package provides excellent thermal and electrical performance, with a compact 17x17 mm footprint. The device is lead-free and RoHS compliant, meeting modern environmental standards. Typical applications include automotive infotainment, motor control, industrial networking, and test equipment. The 182 I/O pins allow flexible interfacing with sensors, ADCs, and communication transceivers. The wide temperature range and automotive qualification make it suitable for under-hood and harsh-environment deployments. When designing with this FPGA, ensure adequate decoupling on the 1.8V core supply and separate I/O supply rails. The device is now obsolete (EOL), so plan for last-time buy or consider pin-compatible alternatives for new designs.
XA3S1000-4FTG256Q - 1M Gate Automotive FPGA | AMD Xilinx
The AMD Xilinx XA3S1000-4FTG256Q is an automotive-grade Field Programmable Gate Array (FPGA) from the Spartan-3 XA family, designed for high-volume, cost-sensitive automotive electronic applications. It delivers 1,000,000 system gates, 17,280 logic cells, and 442,368 total RAM bits in a 256-ball FTBGA package. This device operates with a nominal supply voltage of 1.2V (range 1.14V to 1.26V) and supports 173 user I/O pins, making it suitable for a wide range of automotive control and interface tasks. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the hardware to be reprogrammed to perform any digital logic function. The Spartan-3 XA family is specifically optimized for automotive applications, meeting the rigorous AEC-Q100 qualification standard for reliability across extended temperature ranges (-40°C to +125°C). Key features of the XA3S1000-4FTG256Q include its automotive qualification (AEC-Q100), 173 user I/O pins, 1920 Configurable Logic Blocks (CLBs), and 442,368 total RAM bits. The device is built on 90nm technology and supports a maximum operating frequency of 125MHz. The FTG256 package (256-ball FTBGA) provides a compact footprint suitable for space-constrained automotive PCBs while offering adequate thermal performance for the device's power dissipation. From a technical architecture perspective, the Spartan-3 XA family uses a 90nm process technology with a 1.2V core voltage, enabling low power consumption while maintaining high logic density. The device includes dedicated multipliers, block RAM, and digital clock managers (DCMs) that support complex digital designs. The automotive-grade variant ensures operation across the full -40°C to +125°C temperature range, making it reliable for under-hood and in-cabin automotive electronics. Typical applications include automotive infotainment systems, engine control units (ECUs), advanced driver-assistance systems (ADAS), and industrial motor control. The device's 173 I/O pins and 1M gate capacity make it ideal for glue logic, sensor interfacing, and display control in automotive environments. When designing with this device, ensure proper power supply decoupling with 0.1uF and 10uF capacitors placed close to the VCC pins. The 1.2V core supply must be clean and stable; consider using a dedicated LDO or DC-DC converter with adequate ripple rejection to maintain reliable FPGA operation.
XA3S50-4PQG208I - 50K-Gate Automotive Spartan-3A FPGA | Xilinx
The Xilinx XA3S50-4PQG208I is an automotive Spartan-3A field-programmable gate array with 50,000 system gates, 1,728 logic elements, 124 user I/O, and 73,728 RAM bits in a 208-pin PQFP package. It operates from a 1.2 V core supply with 3.3 V I/O, uses 90 nm FPGA technology, and supports data rates up to 622 Mb/s per I/O. An FPGA is a programmable digital-logic device whose lookup tables, flip-flops, routing, block RAM, and I/O blocks are configured after manufacture. Within the semiconductor hierarchy, the XA3S50-4PQG208I is an FPGA and programmable-logic device. It sits between fixed-function logic and larger application-specific programmable arrays, allowing automotive and industrial designs to implement parallel processing, control, communication, and interface logic on one device. The device provides 192 configurable logic blocks, 124 user I/O, 73,728 RAM bits, and support for 17 single-ended and seven differential I/O standards, including LVDS. Digitally controlled termination supports signal-integrity control on suitable interfaces. The -4 speed designation identifies the device performance grade, while the I suffix identifies the supplied industrial-temperature configuration for demanding automotive and embedded environments. The Spartan-3A XA architecture combines programmable logic resources with automotive-oriented product construction. A 90 nm process supports a compact, cost-sensitive implementation, while the 208-pin PQFP exposes more I/O than smaller FPGA packages. The 1.2 V core and 3.3 V I/O arrangement separates the low-voltage internal logic supply from the higher-voltage external interface supply, allowing I/O standards to be selected according to board-level requirements. Typical uses include automotive body and chassis control modules, sensor aggregation, actuator control, gateway and communication logic, industrial automation controllers, and low-cost embedded signal-processing systems. The 124 I/O make the device useful for parallel sensor, control, communications, and debug interfaces, while 73,728 RAM bits support buffering, packet handling, and stateful control functions. Designers should verify the complete PQFP-208 footprint, pin assignments, supported I/O standards, configuration interface, clocking, power sequencing, and decoupling against the manufacturer datasheet. Because automotive qualification and deployment depend on the complete product qualification record, engineers must also validate the applicable certification evidence for their specific production program. This page combines the verified device specifications with practical selection guidance, sourcing context, package limitations, and clearly qualified replacement analysis. It distinguishes confirmed pin-compatible same-family options from unsupported cross-brand substitutions, helping engineers avoid assuming that a shared package alone guarantees a drop-in replacement.
XA3S50-4PQG208Q - 125 MHz Spartan-3 XA FPGA | AMD
The AMD XA3S50-4PQG208Q is a Spartan-3 XA field-programmable gate array with 50,000 system gates, 192 configurable logic blocks, 1,728 logic cells, and a maximum operating frequency of 125 MHz. The device provides 124 user I/O pins in a 208-pin PQFP package and operates from a 1.2 V supply. A field-programmable gate array is a semiconductor whose digital logic, memory, and I/O behavior are defined after manufacture through a configuration bitstream. Within the product hierarchy, the XA3S50-4PQG208Q is a Spartan-3 XA FPGA, combining configurable logic blocks, block RAM, programmable I/O standards, and dedicated configuration resources on one integrated device. This makes it useful when a fixed logic design must be updated without replacing the PCB. Key features include support for 17 single-ended I/O standards and seven differential standards, including LVDS. The advance product specification lists a maximum data-transfer rate of 622 Mb/s per I/O. Digitally controlled on-chip termination is also identified in the supplied specification data, helping reduce external termination components on suitable high-speed interfaces. The -4 speed designation corresponds to the verified 125 MHz maximum operating frequency. The device includes 73,728 bits of RAM, providing dedicated storage alongside the 1,728 logic cells. Its 124 user I/O pins provide substantial connectivity for control logic, data acquisition, communications, and general-purpose embedded processing. As an AEC-Q100-qualified automotive FPGA, it supports designs requiring a qualified programmable logic platform rather than a fixed-function controller. Typical uses include automotive body and chassis electronics, industrial control modules, data-acquisition equipment, communication gateways, and embedded control systems. The combination of 125 MHz operation, 124 I/O, 73,728 RAM bits, and broad I/O-standard support suits designs that interface multiple external signal domains while retaining field-updatable configuration. Designers should verify every voltage bank, I/O standard, clocking requirement, configuration interface, and power-budget assumption against the manufacturer datasheet before layout release. Because the supplied data does not provide a complete pin table, this page does not publish an inferred 208-pin mapping; use the manufacturer documentation for board-level implementation. This page consolidates verified distributor specifications, automotive qualification information, sourcing data, and selection guidance. It also distinguishes available same-family alternatives by package and qualification, while explicitly identifying missing technical details instead of estimating unpublished pinout, timing, or power values.
XA7A100T-1FGG484Q - Automotive Artix-7 FPGA, 101K LE, 484-FCBGA | AMD
The AMD XA7A100T-1FGG484Q is an automotive-qualified Artix-7 XA Field-Programmable Gate Array (FPGA) with 101,440 logic cells, 4,976,640 system gates, and 4.75 Mbit of block RAM, housed in a 484-ball Fine-Pitch Chip-Scale BGA (FCBGA / FGG484) package. It integrates 15850 Adaptive Logic Modules (ALMs) and 285 user I/Os, supporting up to 4 transceivers at 6.25 Gb/s for high-speed serial links. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect fabric, and dedicated silicon blocks (DSP, BRAM, transceivers, clock management) that designers program via HDL to implement custom digital logic, DSP pipelines, or interface bridges. FPGAs sit within the broader semiconductor hierarchy: programmable logic device -> logic IC -> integrated circuit -> semiconductor. The Artix-7 XA sub-family is AMD's automotive-temp (-40C to +125C) extension of the cost-optimized Artix-7 line, targeting AEC-Q100 Grade 2 qualified designs. Key features include 28 nm TSMC HPL process technology, 1.0 V core voltage (0.95 V Vccint option), support for DDR3-1066 memory interfaces, integrated PCIe Gen2 hard cores, and dedicated DSP48E1 slices for high-throughput arithmetic. The XA family adds automotive-grade qualification and extended temperature operation beyond the commercial XC7A100T. Architecturally, the device uses a 6-input LUT-based ALM fabric fed by a hierarchy of regional, horizontal, and clock backbone routing. 240 DSP48E1 slices deliver up to 528 GMACs of fixed or floating-point throughput at 28 nm, and integrated GTX transceivers support CPRI, 7-Series PCIe Gen2, and SRIO protocols up to 6.25 Gb/s. Typical applications include automotive driver-assistance (ADAS) sensor fusion, in-vehicle networking bridges (CAN/Ethernet/LIN), body-electronics controllers, infotainment video preprocessing, and industrial machine-vision pipelines. The XA prefix signals compliance with ISO 26262-relevant automotive design flows when used with the Vivado Design Suite. When designing with the XA7A100T-1FGG484Q, plan thermal dissipation for the 484-FCBGA (theta_JA around 14 C/W with proper airflow) and follow AMD UG475 pinout guidelines to avoid signal-integrity issues on GTX transceiver lanes. Use IBIS models and Vivado's power estimation before tape-out. This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the same Artix-7 XA family, and practical design notes not found in the manufacturer datasheet alone.
XA7A12T-1CPG238I - Automotive Artix-7 FPGA | AMD
The AMD XA7A12T-1CPG238I is an automotive-qualified Artix-7 XA Field Programmable Gate Array (FPGA) with 12,800 logic cells, 737,280 bits of block RAM, and 112 user configurable I/O pins. It is supplied in a 238-ball LFBGA/CSPBGA (CSBGA-238) package with a -1 speed grade and is designed for cost-sensitive automotive and industrial applications where low power, small footprint, and reprogrammable hardware logic are essential. An FPGA (Field Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks connected through programmable interconnects; the array can be reprogrammed in the field to implement user-defined digital logic circuits. FPGAs sit between fixed-function ASICs and software processors in the digital system hierarchy, giving engineers the ability to iterate hardware designs without silicon respin. The Artix-7 XA family is specifically screened for automotive quality, bringing FPGA flexibility to vehicle systems. Key features of the XA7A12T-1CPG238I include 12,800 logic elements, 737,280 total block RAM bits, and 112 user I/O in a compact 238-ball CSPBGA. The -1 speed grade offers an entry-level performance point that minimizes cost and power while supporting moderate clock rates for control, interface, and image-processing tasks. The device is RoHS compliant per LCSC listing, and the XA prefix indicates automotive-grade screening. Architecturally, Artix-7 devices integrate a high-performance programmable logic fabric, embedded block RAM, and DSP slices for arithmetic operations. The 737,280-bit block RAM supports distributed FIFOs and line buffers, while the flexible I/O cells connect to a wide range of single-ended and differential signalling standards. These capabilities enable deterministic hardware processing in ADAS, motor control, display bridging, and industrial logic applications. Typical applications include automotive ADAS sensor fusion, electric pump and fan motor control, industrial machine vision, in-vehicle display bridges, battery management safety logic, and UAV flight controllers. The 112 I/O and automotive qualification make the XA7A12T suitable for replacing multiple discrete logic and microcontroller tasks with one programmable device. When designing with the XA7A12T-1CPG238I, pay careful attention to multi-rail power sequencing requirements and the exact CPG238 pinout file. Multiple supply rails, BGA decoupling, and configuration flash selection are critical for first-pass success.
XA7A12T-2CSG325I - Automotive Artix-7 FPGA 12.8K LC | AMD
The AMD Xilinx XA7A12T-2CSG325I is an automotive-qualified Artix-7 field programmable gate array (FPGA) in a 324-ball LFBGA/CSPBGA (CSG325) package. It provides 12,800 logic cells, 150 user I/O, and 737,280 bits of block RAM, with a -2 speed grade that supports high-performance, real-time processing in harsh environments. As part of the XA Artix-7 automotive family, this device delivers AEC-Q100-grade dependability and operates over an industrial temperature range. An FPGA (field-programmable gate array) is a semiconductor integrated circuit whose logic fabric can be configured after manufacturing using hardware description languages such as Verilog or VHDL. FPGAs occupy a unique position in the programmable logic hierarchy, combining hardware-level parallelism with reconfigurability and low-latency I/O. The Artix-7 architecture targets power-conscious, high-volume applications that need moderate logic density, rich I/O flexibility, and deterministic timing. Key feature highlights include 40 DSP48E1 slices for high-throughput multiply-accumulate signal processing, three clock management tiles (CMTs), and a 1.0 V core supply that reduces dynamic power. The -2 speed grade is ideal for 100-300 MHz interface and logic designs. The CSG325 package measures only 15 x 15 mm, with a 0.8 mm ball pitch that allows cost-effective 4-layer PCB routing. The device is JESD-609 e1 lead-free (SnAgCu finish), RoHS compliant, and MSL-3 rated with a 260 C peak reflow temperature. Architecturally, the device uses the proven 7-series SRAM-based fabric with 6-input LUTs, dual flip-flops per slice, and cascade chains for arithmetic. The internal block RAM can be configured as 36 Kb or 18 Kb primitives with multiple parity bits. The configuration engine supports master SPI, master BPI, slave SelectMAP, slave serial, and JTAG modes, providing flexible boot options for automotive and industrial systems. Typical applications are automotive ADAS pre-processing, sensor fusion gateways, industrial motor control, medical ultrasound front ends, networking line cards, broadcast video interfaces, and test equipment. The 150 user I/O with HR (high-range, 1.2 V to 3.3 V) capability lets designers interface directly to many sensors, ADCs, and memory devices without external level shifters. When designing with this device, follow AMD/Xilinx UG583 recommendations for BGA power decoupling: place 1.0 uF and 0.1 uF capacitors under the package on VCCINT, and ensure a monotonic, sequenced power-up of VCCINT, VCCBRAM, and VCCO for reliable configuration.
XA7A50T-1CSG325Q - Automotive Artix-7 FPGA, 52K LC | AMD
The AMD XA7A50T-1CSG325Q is an automotive-grade Artix-7 XA Field Programmable Gate Array (FPGA) IC delivering 52,160 logic cells, 150 user I/O, and 2,764,800 system gates in a 324-ball LFBGA (CSPBGA) package. The "XA" prefix designates AMD's automotive-qualified Artix-7 family, qualified per AEC-Q100 for harsh-environment deployments, while the "-1" speed grade and "Q" suffix denote the standard temperature tier with automotive qualification. The device is fabricated on a 28nm high-k metal-gate (HKMG) low-power process, balancing performance-per-watt with cost-effectiveness for volume automotive and industrial designs. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon IP blocks such as transceivers, block RAM, and DSP slices. Within the broader programmable logic hierarchy, the Artix-7 family sits at the low-power, cost-optimized tier below Kintex-7 and Virtex-7, targeting high-volume, power-sensitive applications. The XA7A50T occupies the mid-density position in the XA Artix-7 lineup and is engineered to replace discrete ASICs and ASSPs in automotive driver assistance, infotainment, and industrial control systems. Key features include 2,764,800 system gates, 52,160 logic cells, 2,700 Kbits of block RAM distributed across 75 36-Kbit BRAMs, 120 DSP48 slices for fixed- and floating-point arithmetic, and 4 GTP transceivers capable of up to 6.6 Gb/s line rate. The fabric supports clock management tiles (CMTs) for high-precision frequency synthesis, with up to 64 I/O standards including LVDS, HSTL, SSTL, and 1.5V/1.8V/2.5V/3.3V LVCMOS. Programmable logic resources are accompanied by an integrated configuration controller that supports master/slave SelectMAP, JTAG, and SPI flash boot modes. Architecturally, the device leverages 6-input LUTs for logic optimization and dedicated carry chains for high-speed arithmetic. The XA qualification adds extended temperature testing, PPAP documentation, and longevity support matching automotive program lifecycles. Power is managed through a dedicated core voltage rail (1.0V VCCINT) and separate I/O bank supplies (VCCO), enabling mixed-voltage interfacing on a single die. Typical applications include automotive driver assistance (ADAS) sensor fusion, surround-view camera processing, vehicle networking gateways, industrial motor control, factory automation, and portable medical imaging. The wide operating temperature and automotive qualification make it particularly suited for under-hood ECUs and zonal architectures. When designing with the XA7A50T-1CSG325Q, follow AMD's Kintex/Artix-7 PCB layout guidelines for power decoupling — at least 24 low-ESL 0.1µF capacitors around the BGA, plus bulk 47–100µF ceramic on each power rail. The 324-LFBGA requires microvia or via-in-pad PCB technology for reliable assembly. This page synthesizes distributor pricing, AEC-Q100 automotive qualification details, drop-in Artix-7 alternatives, and PCB design guidance not aggregated in the manufacturer datasheet.
XA7A75T-2CSG324I - Automotive Artix-7 FPGA | AMD
AMD XA7A75T-2CSG324I is an automotive-grade Artix-7 field-programmable gate array in a 324-terminal LFBGA package, with 210 I/O, 75,520 logic cells, and a 387,072-bit fabric presented in the verified distributor data. The device combines programmable logic, fixed resources, and automotive-oriented temperature grading in a 28 nm FPGA platform. Its -2 speed grade favors performance over the -1 grade, while the XA prefix identifies the automotive Artix-7 family. An FPGA is a semiconductor whose digital function is configured after manufacture. A field-programmable gate array belongs to the broader logic-device hierarchy: FPGA, programmable-logic IC, digital semiconductor, and embedded computing component. Instead of relying solely on fixed application-specific logic, an FPGA integrates configurable lookup logic, programmable routing, block resources, memory, and I/O into one reconfigurable device. Verified listings identify 210 I/O, 75,520 logic cells, and 387,072 fabric bits. The searchable Artix-7 product page states that the family uses a 28 nm process and targets high performance per watt. Additional performance figures such as clock rate, block-RAM capacity, DSP resources, power, and temperature limits were not supplied in the verified input and therefore are not inferred here. The 324-LFBGA package supports dense PCB integration but requires exact land-pattern, ball-map, and assembly-process control. Verified distributor data separately describes the package as 324-LFBGA or CSPBGA. AMD publishes package pinout files in TXT and CSV formats, giving engineers the authoritative ball assignments needed for PCB and design-signoff work. Potential uses include automotive sensing, vehicle communication, industrial image processing, embedded control, and high-throughput digital logic. Suitability depends on the complete AMD Artix-7 datasheet, selected tools, automotive qualification requirements, temperature grade, resource utilization, timing closure, and system power budget. A robust design should begin with the AMD package-pinout files, preserve all required power and configuration pins, and constrain every interface against the appropriate device-speed and automotive qualification constraints. Use Vivado or another AMD-supported implementation flow for constraints, synthesis, implementation, timing analysis, and bitstream generation. This page consolidates verified distributor identity, package, resource, and sourcing data with replacement analysis and implementation guidance. It does not infer unprovided electrical ratings, pricing, stock status, or full ball assignments; those fields remain explicitly separated from verified facts.
XA7S25-1CSGA324I - Spartan-7 FPGA, 150 I/O | AMD
The AMD XA7S25-1CSGA324I is a member of the Spartan-7 XA family of Field Programmable Gate Arrays (FPGAs), designed for automotive and industrial applications requiring high performance and reliability. It features 23,360 logic cells, 3,650 adaptive logic modules (ALMs), and 1.58 Mbit of block RAM, providing ample resources for moderate-complexity digital designs. The device is housed in a 324-ball CSGA (Chip-Scale BGA) package with 150 user I/O pins, supporting a core voltage of 0.95V to 1.05V and operating over a temperature range of -40°C to +100°C. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence "field-programmable." FPGAs consist of an array of programmable logic blocks, interconnects, and I/O blocks, allowing them to implement any digital logic function. They are a subset of programmable logic devices (PLDs) and sit within the broader category of embedded processors and controllers. FPGAs are distinct from microcontrollers and ASICs because they offer reconfigurability, enabling rapid prototyping and in-field updates. Key features of the XA7S25-1CSGA324I include 150 user I/Os, 1.58 Mbit of block RAM, and support for various I/O standards such as LVCMOS, LVDS, and SSTL. The device is AEC-Q100 qualified, making it suitable for automotive electronics. It also supports partial reconfiguration and has built-in security features like AES bitstream encryption. The CSGA-324 package offers a compact footprint with a 0.8mm ball pitch, ideal for space-constrained designs. Technically, the Spartan-7 family is built on a 28nm process, balancing performance and power efficiency. The XA7S25 includes DSP slices for signal processing, clock management tiles (CMT) with PLLs and MMCMs, and high-speed transceivers (though this specific variant does not include GTP transceivers). The device supports configuration via JTAG, SPI, or BPI interfaces, and can be programmed using AMD's Vivado Design Suite. Typical applications include automotive driver assistance systems (ADAS), industrial motor control, machine vision, and communication interfaces. The XA7S25's combination of logic density, I/O count, and automotive qualification makes it ideal for these environments. When designing with this FPGA, ensure proper decoupling of the core and I/O supplies, and follow the layout guidelines in UG475 for the CSGA package. The device requires a 1.0V core supply and 1.8V/2.5V/3.3V I/O supplies, depending on the bank configuration.
XA7Z020-1CLG400Q - Automotive Zynq-7000 SoC with Artix-7 FPGA | AMD
The AMD XA7Z020-1CLG400Q is an automotive-grade Zynq-7000 XA System-on-Chip (SoC) integrating a dual-core ARM Cortex-A9 MPCore processor with CoreSight debug, an Artix-7 FPGA fabric containing 85K logic cells, and 6.25 Gb/s transceivers, packaged in a 400-ball CSPBGA (CLG400, 17x17 mm, 0.8 mm pitch). It targets AEC-Q100 Grade 2 operating conditions (-40C to +105C Tj) for automotive driver assistance, infotainment, and industrial vision systems. An SoC FPGA (System-on-Chip with FPGA fabric) is a class of heterogeneous computing device that combines a hardened Application Processor (APU) subsystem with programmable logic on a single die. The ARM Cortex-A9 cluster runs up to 667 MHz in this speed grade, executing an OS (typically Linux or AUTOSAR) while the Artix-7 PL accelerates parallel DSP, sensor fusion, and custom interfaces. This architecture sits within the broader hierarchy of embedded processors -> microcontroller/MPU -> SoC FPGA -> heterogeneous compute platform. Key device highlights include 53,200 LUTs, 560 Kbit block RAM, 220 DSP48E1 slices, and 200 user I/O pins. The processing system adds a NEON media engine, single/double-precision FPU, L1/L2 caches, and a rich peripheral set (USB 2.0, Gigabit Ethernet, SD/SDIO, CAN 2.0B, UART, SPI, I2C). Hard PCIe Gen2 x4 controllers, 32-bit DDR3/DDR3L memory controller, and 4 high-speed serial transceivers enable high-bandwidth interfaces. From an architectural perspective, the device is built on a 28 nm HPL process with separate PS and PL power domains, allowing the processor to operate while the FPGA fabric is held in reset (or vice versa). The 667 MHz Cortex-A9 in the -1 speed grade is the slowest in the Zynq family (versus the -2 grade at 866 MHz), trading some CPU throughput for cost savings in non-throughput-critical designs. Typical automotive applications include surround-view ADAS camera fusion, automotive Ethernet gateways, HMI/infotainment controllers, and motor-control servo drives. Industrial uses range from machine vision over GigE Vision to deterministic EtherCAT controller nodes. A key design consideration is power-tree sequencing - PS and PL each require dedicated 1.0V core and 1.8V/2.5V/3.3V auxiliary rails, and the PS must boot first through a dedicated configuration process. This page synthesizes DigiKey distributor pricing, parametric cross-references, and practical design notes not found in the standalone datasheet PDF.
XC2C256-7TQG144C - 256-Macrocell 6.7 ns CPLD | AMD
The AMD XC2C256-7TQG144C is a CoolRunner-II complex programmable logic device with 256 macrocells, a 6.7 ns propagation delay, and 118 I/O pins in a 144-pin TQFP package. It provides approximately 6000 gates of logic for compact programmable control, interface, and signal-routing designs. A complex programmable logic device, or CPLD, is a programmable-logic semiconductor that combines interconnected macrocells with programmable interconnect. In the broader hierarchy, a CPLD is a programmable logic device and an FPGA alternative. Unlike mask-programmed logic, a CPLD permits design changes without fabricating a new integrated circuit. The CoolRunner-II architecture also uses nonvolatile configuration storage, allowing the programmed logic to remain available after power is removed. The XC2C256 family provides 16 logic array blocks and 256 macrocells according to the available product data. Its -7 speed designation corresponds to the reported 6.7 ns propagation-delay class. With 118 user I/O pins, it supports parallel external interfaces and board-level control functions. The 1.7 V to 1.9 V internal supply range is suitable for systems designed around the device's documented core operating conditions. Typical uses include industrial control, communications equipment, portable electronics, programmable interface logic, bus arbitration, and compact control-plane functions. The CPLD can consolidate multiple fixed-function gates into one programmable device, reducing board area compared with a larger gate-array implementation when the required logic is modest. Designers should still verify timing, power, I/O standards, and pin constraints against the complete CoolRunner-II datasheet and their specific design. The principal design consideration is tool and configuration compatibility. Existing CoolRunner-II projects depend on supported AMD or Xilinx programming tools, device support, and verified bitstream compatibility. Before replacing an installed device, engineers must check the exact package, speed grade, temperature grade, power behavior, and pin assignment rather than relying only on the family name. This page consolidates the supplied distributor and manufacturer information, distinguishes verified facts from unavailable specifications, and adds selection and sourcing guidance. Because the provided data does not include a complete pin table, electrical limit table, or qualified replacement list, those fields remain explicitly marked for engineering review.
XC2C32A-4CP56C - 32-Macrocell 450 MHz CPLD | AMD Xilinx
The AMD Xilinx XC2C32A-4CP56C is a 32-macrocell CoolRunner-II complex programmable logic device with a 450 MHz internal frequency, up to 33 user I/Os, and a 3.8 ns propagation delay. It is optimized for 1.8 V systems and supplied in a compact 56-pin CSPBGA package measuring 6 x 6 mm with a 0.50 mm ball pitch. These specifications make the CPLD suitable for space-constrained embedded systems requiring deterministic programmable logic, compact PCB routing, and low-power operation. A CPLD is a programmable logic device that combines multiple macrocells and programmable interconnect resources into a deterministic logic fabric. Its hierarchy is CPLD > complex programmable logic device > programmable logic device > programmable logic semiconductor. Unlike a soft-core processor or FPGA, a CPLD is generally configured from a stored bitstream and is selected when relatively modest logic density, predictable timing, low static power, and simple implementation are more important than very high programmable-resource counts. The XC2C32A-4CP56C provides 32 macrocells, 33 user I/Os, a 450 MHz internal frequency, and a 3.8 ns rated propagation delay. The device uses 0.18 µm CMOS technology, supports 1.8 V operation, and can reach 3.0 ns pin-to-pin logic delays. A reported quiescent current as low as 12 µA is particularly useful in portable or power-managed equipment where the logic remains active or intermittently enabled. The 56-pin CSPBGA package reduces board area relative to larger leaded or plastic packages, but its 0.50 mm pitch requires careful PCB layout, fine-pitch assembly, and appropriate land-pattern validation. Ball-level solder inspection and adequate thermal-via placement should be considered during hardware qualification. The commercial temperature designation indicated in the verified listings should also be checked against the complete ordering information and end-product environmental requirements. Typical uses include interface control, protocol bridging, data acquisition, industrial control, embedded glue logic, and general-purpose compact control systems. In each case, designers should verify I/O standard, timing, power rails, and pin assignment against the AMD DS310 datasheet before releasing a PCB or production design. The primary engineering trade-off is that the 56-ball footprint saves area but complicates assembly compared with a leaded package. Design for the specified 1.8 V supply, preserve the recommended decoupling and layout geometry, validate worst-case timing, and confirm programming-tool and device support before committing to production. This page consolidates verified device specifications, source links, package constraints, and practical CPLD-selection guidance. It also distinguishes directly evidenced drop-in information from substitutions that still require manufacturer pinout and timing verification.
XC2C32A-4VQ44C - 32-Macrocell 1.8V CPLD | AMD | TQFP-44
The AMD/Xilinx XC2C32A-4VQ44C is a CoolRunner-II complex programmable logic device with 32 macrocells, 750 equivalent gates, 33 user I/Os, and a 1.8 V supply in a 44-pin TQFP package. It combines a 450 MHz internal frequency with a listed 4 ns propagation delay, providing reconfigurable hardware for glue logic, control, decoding, and interface bridging. A CPLD is a user-programmable semiconductor that belongs to the programmable-logic hierarchy alongside FPGAs. Unlike a fixed combinational or sequential logic circuit, a CPLD allows logic assignments to be changed through programming. The CoolRunner-II architecture combines programmable logic with I/O resources, making the XC2C32A useful where deterministic short propagation delays, compact implementation, and nonvolatile configuration are important. Key features include 32 macrocells, 750 equivalent gates, 33 user I/O pins, 3.0 ns pin-to-pin logic delays, and low quiescent current as low as 12 uA. The -4 speed designation identifies the manufacturer's speed grade, while the C suffix identifies the stated commercial operating-temperature variant. The device uses 0.18 um CMOS technology and is optimized for 1.8 V systems. The XC2C32A architecture is intended for designs requiring moderate logic density rather than FPGA-scale processing. Its macrocell-based structure can support control logic, state machines, bus decoding, address decoding, and protocol interface glue. Available operating specifications include a 6 x 6 mm package body, 0.50 mm pitch, and 44 pins, although the complete physical package drawing is identified by conflicting secondary listings. Typical applications include industrial control and automation, embedded system support logic, communication-interface glue, legacy peripheral interconnection, and compact programmable control modules. The 33 user I/Os allow the device to connect external sensors, memory interfaces, status indicators, and peripheral control signals while keeping the design compact. Designers should verify the exact pinout, I/O standards, power requirements, configuration interface, and timing constraints in AMD document DS310 before layout. Because secondary sources disagree on whether the physical package is a 44-pin TQFP or a 56-contact CSP representation, the manufacturer pinout drawing is the controlling reference. Do not substitute a similarly named XC2C32A speed grade without reviewing its timing grade and temperature suffix. This page combines verified manufacturer and distributor information with price references as of 2026-10-28, same-family drop-in candidates, comparison parameters, and practical selection guidance. It also distinguishes directly supported facts from specification fields that require confirmation from the manufacturer datasheet.
XC2C32A-6CP56C - 32-Macrocell 200MHz CPLD | Xilinx
Xilinx XC2C32A-6CP56C is a CoolRunner-II complex programmable logic device with 750 logic gates, 32 macrocells, 33 user I/O pins, and a maximum operating frequency of 200 MHz. It is built with 0.18 µm CMOS technology, optimized for 1.8 V systems, and supplied in a 56-ball CSP package measuring 6 x 6 mm with 0.50 mm pitch. The -6 speed designation corresponds to a listed propagation delay of 4 ns in the verified distributor specifications. A CPLD is a programmable logic device that combines nonvolatile configuration memory, programmable AND logic, and programmable OR interconnect. Within the broader semiconductor hierarchy, a CPLD is a user-programmable digital IC, complementing FPGA and ASIC technologies. The XC2C32A belongs to the CoolRunner-II family and provides deterministic logic implementation for glue logic, control, decoding, state-machine, and interface-adaptation circuits. Key device characteristics include 32 macrocells, 750 gates, 33 user I/O pins, and two logic array blocks. The verified data also reports a 4 ns propagation delay, an internal frequency of 450 MHz, CMOS logic-family construction, and a 0.18 µm CMOS process. A pin-to-pin delay as low as 3.0 ns is also listed in the component feature summary, while quiescent current is reported as low as 12 µA. The device architecture combines configurable logic with low-power 1.8 V operation. Its 32 macrocells provide moderate logic density for compact control logic rather than high-volume parallel processing. The reported 450 MHz internal frequency should not be confused with the 200 MHz maximum device operating frequency: the latter is the more conservative figure presented in the verified component specifications and is the appropriate basis for initial timing design. Typical uses include boot and power sequencing, peripheral interfacing, protocol and address decoding, industrial control logic, test-equipment control, and low-power embedded system support. The 33 user I/O pins make it useful for designs requiring moderate pin density without moving to a larger programmable-logic package. Its 56-ball CSP footprint also supports compact surface-mount assemblies when PCB-routing and assembly-process requirements are carefully observed. The primary design consideration is timing closure at the system level. Engineers should use the official AMD DS310 datasheet for pinout, bank voltage, AC timing, configuration, and absolute-maximum ratings because those details are not present in the supplied distributor excerpts. A 4 ns propagation delay supports timing-critical glue logic, but external setup, hold, skew, and routing margins still determine whether the complete interface meets its target clock. This page consolidates the verified distributor specifications, package information, sourcing data, and same-family drop-in alternatives. It also distinguishes the device's core architecture from cross-brand CPLD families that may be functionally comparable but cannot be treated as pin-compatible without an independent footprint and electrical verification.