XA2S200E-6FT256I - 200K Gate FPGA | AMD | 256-FTBGA
MPN: XA2S200E-6FT256I β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45 | $45.00 |
| 10 | $40.5 | $405.00 |
| 100 | $36 | $3,600.00 |
| 500 | $32.4 | $16,200.00 |
| 1,000 | $29 | $29,000.00 |
Drop-in alternatives for XA2S200E-6FT256I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC2S200E-6FT256I
β Drop-Inπ Reference alternative (not in catalog)
XC2S200E-7FTG256C
β Drop-Inπ Reference alternative (not in catalog)
XA2S300E-6FT256I
β Drop-Inπ Reference alternative (not in catalog)
XC2S200E-5FT256C
β Drop-Inπ Reference alternative (not in catalog)
XC2S200E-6FTG256I
β Drop-Inπ Reference alternative (not in catalog)
XA2S200E-6FT256I Maximum Ratings & Electrical Characteristics
| Family | Spartan-IIE XA |
| Number of System Gates | 200000 |
| Number of Logic Elements/Cells | 5292 |
| Number of LABs/CLBs | 1176 |
| Total RAM Bits | 57344 |
| Number of I/O | 182 |
| Package | 256-FTBGA (17x17 mm) |
| Terminal Form | BALL |
| Number of Terminals | 256 |
| Package Code | BGA |
| Package Shape | SQUARE |
| Nominal Supply Voltage | 1.8 V |
| Supply Voltage Range | 1.71 V to 1.89 V |
| Operating Temperature Range | -40Β°C to 100Β°C (TJ) |
| Mounting Type | SMD (SMT) |
| Speed Grade | -6 |
| RoHS Status | Compliant |
| REACH Status | REACH211 Cert |
| Lifecycle Status | Obsolete (EOL) |
XA2S200E-6FT256I Pin Configuration
| Pin A1 | IO β User I/O pin |
| Pin A2 | IO β User I/O pin |
| Pin B1 | IO β User I/O pin |
| Pin B2 | VCCINT β Internal core supply 1.8V |
| Pin C1 | GND β Ground |
| Pin C2 | IO β User I/O pin |
| Pin D1 | IO β User I/O pin |
| Pin D2 | VCCAUX β Auxiliary supply 2.5V |
| Pin E1 | IO β User I/O pin |
| Pin E2 | GND β Ground |
| Pin F1 | IO β User I/O pin |
| Pin F2 | IO β User I/O pin |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XA2S200E-6FT256I is suitable for 6 applications: Automotive Infotainment, Industrial Motor Control, Test and Measurement Equipment, Networking and Communication, Aerospace and Defense, Medical Monitoring Devices.
Automotive Infotainment
The XA2S200E-6FT256I is ideal for automotive infotainment systems due to its automotive-grade temperature range (-40Β°C to 100Β°C) and 182 I/O pins for interfacing with displays, audio codecs, and CAN transceivers. Its 200K gates provide sufficient logic for video processing and user interface control. The 1.8V core reduces power consumption in battery-powered vehicles. Designers can implement custom display controllers or protocol bridges, leveraging the FPGA's reconfigurability for firmware updates. The 57,344 RAM bits support frame buffering for small displays. This FPGA meets AEC-Q100 reliability expectations, ensuring long-term operation in harsh automotive environments.
Recommended
Industrial Motor Control
In industrial motor control, the XA2S200E-6FT256I provides 200K gates for implementing PWM generation, encoder interfaces, and PID control loops. Its 182 I/O pins connect directly to gate drivers and current sensors, while the 1.8V core with 3.3V I/O tolerance simplifies interfacing. The -40Β°C to 100Β°C range suits factory floor environments. The FPGA's parallel processing enables multiple motor axes to be controlled simultaneously without CPU bottlenecks. The 57,344 RAM bits can store lookup tables for sensor linearization. Its reconfigurability allows in-field firmware updates for new motor profiles, reducing downtime. This makes it a cost-effective alternative to ASICs for low-to-medium volume production.
Recommended
Test and Measurement Equipment
The XA2S200E-6FT256I is well-suited for test and measurement equipment such as logic analyzers and signal generators. Its 200K gates enable custom digital signal processing, pattern generation, and data acquisition logic. The 182 I/O pins provide ample connectivity for ADC/DAC interfaces and trigger inputs. The 1.8V core with low power dissipation is beneficial for portable instruments. The -6 speed grade supports sampling rates up to 200 MHz, adequate for many mid-range applications. The FPGA's reconfigurability allows the same hardware to support multiple instrument modes via different bitstreams. The 57,344 RAM bits can buffer captured data before transfer to a host processor, enhancing throughput.
Recommended
Networking and Communication
In networking and communication systems, the XA2S200E-6FT256I can implement protocol bridges, packet processing, and interface conversion. Its 200K gates support Ethernet MAC, UART, and SPI controllers, while 182 I/O pins connect to PHYs and connectors. The 1.8V core with 3.3V I/O tolerance simplifies level shifting. The -40Β°C to 100Β°C range is suitable for outdoor networking equipment. The FPGA's parallel architecture enables low-latency packet forwarding, critical for real-time industrial networks. The 57,344 RAM bits can buffer packets or store routing tables. Its reconfigurability allows support for multiple protocols (e.g., Modbus, PROFINET) with the same hardware, reducing inventory costs.
Recommended
Aerospace and Defense
The XA2S200E-6FT256I is suitable for aerospace and defense applications requiring radiation-tolerant or wide-temperature FPGAs. Its automotive-grade temperature range (-40Β°C to 100Β°C) and robust packaging make it suitable for avionics and unmanned aerial vehicles (UAVs). The 200K gates can implement sensor fusion, motor control for actuators, and communication interfaces. The 182 I/O pins connect to GPS modules, IMUs, and telemetry radios. The 1.8V core reduces power consumption, critical for battery-powered UAVs. The FPGA's reconfigurability allows in-flight firmware updates for mission-specific tasks. While not radiation-hardened, it can be used in non-critical subsystems with appropriate shielding.
Recommended
Medical Monitoring Devices
The XA2S200E-6FT256I can be used in medical monitoring devices such as patient vital sign monitors and portable diagnostic tools. Its 200K gates enable custom signal processing for ECG, EEG, or pulse oximetry, while 182 I/O pins interface with analog front-ends and displays. The 1.8V core with low power consumption is ideal for battery-operated devices. The -40Β°C to 100Β°C range exceeds typical medical requirements, ensuring reliability. The FPGA's parallel processing allows real-time filtering and feature extraction without loading a host CPU. The 57,344 RAM bits can store patient data temporarily. Its reconfigurability enables firmware updates for new monitoring algorithms, extending device lifespan.
Recommended
Recommended Products Summary
Engineering reference data for XA2S200E-6FT256I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC2S200E-6FT256I | XC2S200E-7FTG256C | XA2S300E-6FT256I |
|---|---|---|---|---|
| Package | 256-FTBGA | 256-FTBGA | 256-FTBGA | 256-FTBGA |
| Brand | AMD | AMD | AMD | AMD |
| System Gates | 200000 | 200000 | 200000 | 300000 |
| Logic Cells | 5292 | 5292 | 5292 | 6912 |
| RAM Bits | 57344 | 57344 | 57344 | 73728 |
| Number of I/O | 182 | 182 | 182 | 182 |
| Speed Grade | -6 | -6 | -7 | -6 |
| Temperature Range | -40Β°C to 100Β°C | 0Β°C to 85Β°C | 0Β°C to 85Β°C | -40Β°C to 100Β°C |
Key Differentiators
- Automotive-grade temperature range (vs XC2S200E-6FT256I)
- Higher gate density option (vs XA2S300E-6FT256I)
- Faster speed grade available (vs XC2S200E-7FTG256C)
Design Notes
The XA2S200E-6FT256I requires a 1.8V core supply (VCCINT) and a 2.5V auxiliary supply (VCCAUX). Use separate low-impedance power planes and place 0.1uF and 10uF decoupling capacitors close to each supply pin. The I/O banks can operate at 3.3V or 2.5V depending on VCCO connections. Ensure the power-up sequence meets the datasheet requirements to avoid latch-up.
The 256-FTBGA package has a 17x17 mm footprint with 0.8mm ball pitch. Use a 4-layer or more PCB with dedicated ground and power planes. Route high-speed I/O signals with controlled impedance (50 ohm single-ended, 100 ohm differential). Place the FPGA away from noisy switching regulators. Follow Xilinx PCB design guidelines for BGA escape routing and via placement.
Since the XA2S200E-6FT256I is obsolete, avoid designing it into new products. If using existing stock, verify the configuration bitstream is compatible with the -6 speed grade. Ensure the JTAG interface is accessible for programming and debugging. Do not exceed the absolute maximum ratings of 2.0V on VCCINT and 3.6V on I/O pins. Use pull-up resistors on unused I/O pins to prevent floating inputs.
Compliance Information
RoHS compliant and REACH211 certified per components-house.com. Automotive-grade XA family but AEC-Q100 qualification not explicitly stated in available data.
