XA7A12T-2CSG325I - Automotive Artix-7 FPGA 12.8K LC | AMD
MPN: XA7A12T-2CSG325I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $61.2 | $612.00 |
| 100 | $54.8 | $5,480.00 |
| 500 | $49.3 | $24,650.00 |
| 1,000 | $44.9 | $44,900.00 |
XA7A12T-2CSG325I Overview
An FPGA (field-programmable gate array) is a semiconductor integrated circuit whose logic fabric can be configured after manufacturing using hardware description languages such as Verilog or VHDL. FPGAs occupy a unique position in the programmable logic hierarchy, combining hardware-level parallelism with reconfigurability and low-latency I/O. The Artix-7 architecture targets power-conscious, high-volume applications that need moderate logic density, rich I/O flexibility, and deterministic timing.
Key feature highlights include 40 DSP48E1 slices for high-throughput multiply-accumulate signal processing, three clock management tiles (CMTs), and a 1.0 V core supply that reduces dynamic power. The -2 speed grade is ideal for 100-300 MHz interface and logic designs. The CSG325 package measures only 15 x 15 mm, with a 0.8 mm ball pitch that allows cost-effective 4-layer PCB routing. The device is JESD-609 e1 lead-free (SnAgCu finish), RoHS compliant, and MSL-3 rated with a 260 C peak reflow temperature.
Architecturally, the device uses the proven 7-series SRAM-based fabric with 6-input LUTs, dual flip-flops per slice, and cascade chains for arithmetic. The internal block RAM can be configured as 36 Kb or 18 Kb primitives with multiple parity bits. The configuration engine supports master SPI, master BPI, slave SelectMAP, slave serial, and JTAG modes, providing flexible boot options for automotive and industrial systems.
Typical applications are automotive ADAS pre-processing, sensor fusion gateways, industrial motor control, medical ultrasound front ends, networking line cards, broadcast video interfaces, and test equipment. The 150 user I/O with HR (high-range, 1.2 V to 3.3 V) capability lets designers interface directly to many sensors, ADCs, and memory devices without external level shifters.
When designing with this device, follow AMD/Xilinx UG583 recommendations for BGA power decoupling: place 1.0 uF and 0.1 uF capacitors under the package on VCCINT, and ensure a monotonic, sequenced power-up of VCCINT, VCCBRAM, and VCCO for reliable configuration.
Drop-in alternatives for XA7A12T-2CSG325I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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XC7A12T-2CSG325I
✅ Drop-In📋 Reference alternative (not in catalog)
XC7A12T-1CSG325I
✅ Drop-In📋 Reference alternative (not in catalog)
XA7A12T-1CSG325I
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XC7A12T-2CSG325C
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XC7A12T-1CSG325C
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XA7A12T-2CSG325I Maximum Ratings & Electrical Characteristics
| Family | Artix-7 XA (Automotive) |
| Logic Cells | 12800 |
| Configurable Logic Blocks (Slices) | 2000 |
| Distributed RAM | 125 Kb |
| DSP48E1 Slices | 40 |
| Block RAM Blocks | 20 x 36 Kb |
| Total Block RAM | 737280 bits |
| User I/O | 150 |
| Package | 324-LFBGA, CSPBGA (CSG325) |
| Speed Grade | -2 |
| Core Supply Voltage (VCCINT) | 1.0 V |
| I/O Voltage Range (HR Banks) | 1.2 V to 3.3 V |
| Operating Temperature (Tj) | -40 C to +100 C (Industrial) |
| Moisture Sensitivity Level (MSL) | 3 |
| Peak Reflow Temperature | 260 C |
| Maximum Time at Peak Reflow | 30 s |
| Terminal Finish | Tin/Silver/Copper (JESD-609 e1) |
| Automotive Qualification | AEC-Q100 (XA flow) |
| Configuration Modes | Master SPI, Master BPI, Slave SelectMAP, Slave Serial, JTAG |
XA7A12T-2CSG325I 324-lfbga, cspbga (csg325) Pin Configuration Guide
Pin configuration for XA7A12T-2CSG325I (324-lfbga, cspbga (csg325) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XA7A12T-2CSG325I.
Refer to the datasheet for full pin configuration.
Typical Applications
XA7A12T-2CSG325I is suitable for 6 applications: Automotive ADAS and Sensor Fusion, Industrial Motor Control, Medical Ultrasound and Imaging, Wired and Wireless Networking, Broadcast Video and Display Interfaces, Test and Measurement Instrumentation.
Automotive ADAS and Sensor Fusion
The XA7A12T-2CSG325I is well suited for automotive ADAS and sensor-fusion front ends because its 150 user I/O can interface simultaneously with multiple camera, radar, and LiDAR interfaces, while 737,280 bits of block RAM buffer image data without external memory latency. Its 40 DSP48E1 slices execute early-stage filtering and normalization in parallel, reducing sensor-fusion latency compared with MCU-only implementations. The automotive XA qualification (AEC-Q100) and -40 C to +100 C junction temperature range guarantee operation in under-hood and cabin environments. Pair the FPGA with an STM32 MCU for application-level fusion and a DDR4 memory for large frame buffers.
Recommended
Industrial Motor Control
In industrial motor control, the XA7A12T-2CSG325I provides deterministic parallel logic for PWM generation, encoder decoding, and current-loop processing. The 40 DSP48E1 slices implement high-speed PI/PR controllers with low latency, while 150 I/O connect to gate drivers, current sensors, and resolver interfaces. The -2 speed grade supports 100-200 MHz control loops, and the Artix-7 architecture delivers predictable timing compared to sequential MCUs. Industrial users benefit from wide-temperature operation and the ability to integrate multiple motor axes in one device. A host MCU handles safety and HMI functions while the FPGA executes hard real-time torque control.
Recommended
Medical Ultrasound and Imaging
The XA7A12T-2CSG325I supports medical ultrasound and imaging front ends with its 737,280 bits of block RAM for beamforming and demodulation data and 40 DSP48E1 slices for quadrature filtering and envelope detection. 150 user I/O connect to multichannel ADCs, time-gain amplifiers, and display interfaces. The deterministic fabric enables sample-accurate delay-and-sum beamforming. FPGA processing reduces host processor load and enables low-power portable ultrasound. The AEC-Q100-grade XA flow also provides robustness for medical carts and field environments. Coupled with a DDR4 memory for frame stores and an STM32 MCU for user interface, the FPGA enables real-time B-mode imaging.
Recommended
Wired and Wireless Networking
The XA7A12T-2CSG325I fits networking line cards and embedded switch designs that need flexible packet parsing and traffic shaping. 150 user I/O allow direct connection to RGMII, SGMII, and parallel system bus interfaces. The internal block RAM stores descriptors and packet buffers, while DSP48E1 slices implement checksums and rate limiting. The 1.0 V core reduces power in always-on edge routers. Industrial temperature range and robust configuration support non-stop network equipment. The FPGA can pre-process packets before forwarding to a host processor, improving throughput. Companion memory and MCUs provide control-plane management.
Recommended
Broadcast Video and Display Interfaces
The XA7A12T-2CSG325I is used in broadcast video processors and display controllers where 150 I/O connect to GMII, DVI, LVDS, and MIPI interfaces. The 737,280 bits of block RAM build line buffers for image scaling and deinterlacing, and the DSP48E1 slices perform color-space conversion and alpha blending. The -2 speed grade handles 1080p pixel clocks at typical operating frequencies. The industrial temperature range suits studio, kiosk, and digital signage equipment. FPGA flexibility allows support for multiple video standards in a single design. A companion MCU handles user configuration and EDID, while DDR4 memory stores reference frames.
Recommended
Test and Measurement Instrumentation
For test and measurement equipment, the XA7A12T-2CSG325I provides reconfigurable logic for arbitrary waveform generation, data acquisition, and digital triggering. 150 user I/O connect to ADCs, DACs, and PXI backplane buses. The 40 DSP48E1 slices handle digital down-conversion and FFT front-end processing, while 737,280 bits of block RAM support deep acquisition buffers. The industrial temperature rating ensures stable operation in bench and rack instruments. FPGAs in instruments allow in-field upgrade of measurement algorithms. The CSG325 package enables compact 3U board designs. Companion MCUs manage the user interface and remote communication.
Recommended
Recommended Products Summary
Engineering reference data for XA7A12T-2CSG325I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7A12T-2CSG325I | XC7A12T-1CSG325I | XA7A12T-1CSG325I |
|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | 324-LFBGA, CSPBGA (CSG325) | 324-LFBGA, CSPBGA (CSG325) | 324-LFBGA, CSPBGA (CSG325) | 324-LFBGA, CSPBGA (CSG325) |
| Automotive Grade | Yes (XA, AEC-Q100) | No | No | Yes (XA, AEC-Q100) |
| Speed Grade | -2 | -2 | -1 | -1 |
| Temperature Grade | I (-40 C to +100 C Tj) | I (-40 C to +100 C Tj) | I (-40 C to +100 C Tj) | I (-40 C to +100 C Tj) |
| Logic Cells | 12,800 | 12,800 | 12,800 | 12,800 |
| DSP48E1 Slices | 40 | 40 | 40 | 40 |
| Total Block RAM | 737,280 bits | 737,280 bits | 737,280 bits | 737,280 bits |
| User I/O | 150 | 150 | 150 | 150 |
Key Differentiators
- Automotive AEC-Q100 qualification (vs XC7A12T-2CSG325I)
- Higher -2 speed grade (vs XA7A12T-1CSG325I)
- Extended industrial temperature (vs XC7A12T-2CSG325C)
Design Notes
VCCINT is 1.0 V, VCCO can be 1.2-3.3 V per HR bank. Follow Xilinx 7 Series power sequencing: VCCINT and VCCBRAM should ramp before or simultaneously with VCCO and VCCAUX. Use a PMIC or power sequencer with monotonic ramp; uncontrolled power-up can cause false configuration or hot-carrier stress.
The CSG325 is a 15x15 mm, 0.8 mm pitch 324-ball LFBGA. Decouple VCCINT with a 1.0 uF plus 0.1 uF ceramic capacitor under each power pin region close to the ball field. Use via-in-pad for dense fanout and at least a 4-layer board with solid ground and power planes. Follow UG583 BGA decoupling and component placement guidance.
Do not leave PROGRAM_B floating; tie it high through a pull-up resistor. Monitor DONE and INIT_B for successful configuration. Failing to pull up PROGRAM_B or using a wrong configuration mode can cause device to appear dead. For automotive use, verify that the configuration bitstream is encrypted or authenticated when deploying in the field.
At full utilization, the XA7A12T can dissipate 1-3 W depending on logic density and I/O toggle rates. The 15x15 mm CSG325 package with thermal pad requires a thermal via array and connection to an internal GND or dedicated thermal plane. The -40 C to +100 C junction rating is generous, but derating is required if ambient exceeds 85 C.
Compliance Information
XA prefix indicates AEC-Q100 automotive qualification; JESD-609 e1 terminal finish (SnAgCu) confirms lead-free/RoHS-compliant plating. REACH and conflict mineral statements were not present in verified web data.
