XA3S1000-4FTG256Q - 1M Gate Automotive FPGA | AMD Xilinx
MPN: XA3S1000-4FTG256Q β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45.32 | $45.32 |
| 10 | $41.87 | $418.70 |
| 100 | $36.55 | $3,655.00 |
| 500 | $32.18 | $16,090.00 |
| 1,000 | $28.94 | $28,940.00 |
Drop-in alternatives for XA3S1000-4FTG256Q β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XA3S1000-4FTG256I
β Drop-Inπ Reference alternative (not in catalog)
XC3S1000-4FTG256C
β Drop-Inπ Reference alternative (not in catalog)
XC3S1000-4FTG256I
β Drop-Inπ Reference alternative (not in catalog)
XA3S400A-4FTG256Q
β Drop-Inπ Reference alternative (not in catalog)
XA3S1000-4FTG256Q Maximum Ratings & Electrical Characteristics
| Family | Spartan-3 XA |
| Number of Logic Cells | 17280 |
| Number of CLBs | 1920 |
| Total RAM Bits | 442368 |
| Number of I/O | 173 |
| Number of Gates | 1000000 |
| Supply Voltage - Nominal | 1.2 V |
| Supply Voltage - Min | 1.14 V |
| Supply Voltage - Max | 1.26 V |
| Operating Temperature - Min | -40 C |
| Operating Temperature - Max | 125 C |
| Package | 256-FTBGA |
| Mounting Style | Surface Mount |
| Technology | 90nm |
| Maximum Operating Frequency | 125 MHz |
| Qualification | AEC-Q100 |
XA3S1000-4FTG256Q Pin Configuration
| Pin A1 | IO_L01P_0 β User I/O bank 0, differential pair P |
| Pin A2 | IO_L01N_0 β User I/O bank 0, differential pair N |
| Pin B1 | IO_L02P_0 β User I/O bank 0, differential pair P |
| Pin B2 | IO_L02N_0 β User I/O bank 0, differential pair N |
| Pin C1 | VCCAUX β Auxiliary supply voltage (2.5V) |
| Pin C2 | GND β Ground |
| Pin D1 | IO_L03P_0 β User I/O bank 0, differential pair P |
| Pin D2 | IO_L03N_0 β User I/O bank 0, differential pair N |
| Pin E1 | VCCINT β Core supply voltage (1.2V) |
| Pin E2 | GND β Ground |
| Pin F1 | IO_L04P_0 β User I/O bank 0, differential pair P |
| Pin F2 | IO_L04N_0 β User I/O bank 0, differential pair N |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XA3S1000-4FTG256Q is suitable for 6 applications: Automotive Infotainment Systems, Engine Control Units (ECUs), Advanced Driver-Assistance Systems (ADAS), Industrial Motor Control, Test and Measurement Equipment, Aerospace and Defense Electronics.
Automotive Infotainment Systems
The XA3S1000-4FTG256Q is ideal for automotive infotainment systems due to its AEC-Q100 qualification and 173 I/O pins. It can interface with multiple display controllers, audio codecs, and communication interfaces simultaneously. The 1M gate capacity supports complex video processing and user interface logic, while the -40Β°C to +125Β°C range ensures reliable operation in cabin environments. Its 442,368 RAM bits provide adequate buffering for display data and audio streams.
Recommended
Engine Control Units (ECUs)
In engine control units, the XA3S1000-4FTG256Q provides reliable logic implementation for sensor interfacing, actuator control, and communication protocols. Its 173 I/O pins connect to multiple sensors and actuators, while the 1M gate capacity handles complex control algorithms. The automotive temperature range and AEC-Q100 qualification ensure dependable operation under hood, where temperatures can exceed 100Β°C. The 90nm technology offers low power consumption critical for automotive power budgets.
Recommended
Advanced Driver-Assistance Systems (ADAS)
The XA3S1000-4FTG256Q supports ADAS applications by providing flexible logic for sensor fusion, image preprocessing, and decision-making algorithms. Its 17,280 logic cells and 442,368 RAM bits enable real-time processing of camera and radar data. The 125MHz maximum frequency allows high-speed data handling, while the 173 I/O pins interface with multiple sensors. The automotive qualification ensures compliance with safety standards required for ADAS systems.
Recommended
Industrial Motor Control
For industrial motor control, the XA3S1000-4FTG256Q provides precise PWM generation and encoder interfacing. Its 173 I/O pins connect to gate drivers and current sensors, while the 1M gate capacity implements complex control loops like FOC (Field-Oriented Control). The -40Β°C to +125Β°C range suits harsh industrial environments. The 90nm technology ensures low latency for real-time control, and the 442,368 RAM bits support data logging and parameter storage.
Recommended
Test and Measurement Equipment
The XA3S1000-4FTG256Q is well-suited for test and measurement equipment requiring high-speed data acquisition and processing. Its 173 I/O pins interface with ADCs and DACs, while the 1M gate capacity implements digital signal processing algorithms. The 125MHz clock rate supports high-throughput data streams, and the 442,368 RAM bits provide buffering for captured data. The extended temperature range allows operation in various lab and field environments.
Recommended
Aerospace and Defense Electronics
In aerospace and defense applications, the XA3S1000-4FTG256Q offers reliable logic implementation for mission-critical systems. Its AEC-Q100 qualification and -40Β°C to +125Β°C range ensure operation in extreme environments. The 173 I/O pins interface with various sensors and communication systems, while the 1M gate capacity supports complex processing tasks. The 90nm technology provides a balance of performance and power efficiency suitable for avionics.
Recommended
Recommended Products Summary
Engineering reference data for XA3S1000-4FTG256Q β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XA3S1000-4FTG256I | XC3S1000-4FTG256C | XC3S1000-4FTG256I | XA3S400A-4FTG256Q |
|---|---|---|---|---|---|
| Package | 256-FTBGA | 256-FTBGA - same | 256-FTBGA - same | 256-FTBGA - same | 256-FTBGA - same |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Number of Gates | 1000000 | 1000000 | 1000000 | 1000000 | 400000 |
| Number of Logic Cells | 17280 | 17280 | 17280 | 17280 | 8064 |
| Number of I/O | 173 | 173 | 173 | 173 | 173 |
| Total RAM Bits | 442368 | 442368 | 442368 | 442368 | 294912 |
| Operating Temperature Range | -40C to +125C | -40C to +100C | 0C to +85C | -40C to +100C | -40C to +125C |
| AEC-Q100 Qualified | Yes | No | No | No | Yes |
Key Differentiators
- Automotive AEC-Q100 qualification (vs XC3S1000-4FTG256C)
- Extended temperature range (vs XA3S1000-4FTG256I)
- Higher logic density (vs XA3S400A-4FTG256Q)
Design Notes
The XA3S1000-4FTG256Q requires a clean 1.2V core supply (VCCINT) and 2.5V auxiliary supply (VCCAUX). Use a low-noise LDO or DC-DC converter with adequate ripple rejection. Place 0.1uF ceramic capacitors close to each VCC pin and a 10uF bulk capacitor near the power entry point. According to the Spartan-3 datasheet (DS099), proper decoupling is critical for reliable FPGA operation at 125MHz.
The 256-FTBGA package has a thermal resistance that requires careful PCB design for heat dissipation. Ensure adequate copper pour on the PCB layers connected to the thermal pad. For automotive applications with ambient temperatures up to 125Β°C, consider adding thermal vias under the package to improve heat transfer to inner layers. The 90nm process dissipates moderate power, but thermal management is essential for long-term reliability.
For the 256-FTBGA package, use a 4-layer or more PCB with dedicated power and ground planes. Route high-speed I/O signals with controlled impedance (50 ohm single-ended, 100 ohm differential). Keep trace lengths matched for differential pairs. Place the FPGA close to its associated memory and interface components to minimize trace lengths and reduce signal integrity issues. Follow Xilinx PCB design guidelines for BGA packages.
Compliance Information
AEC-Q100 qualified per Microchip USA product page. RoHS compliant per Xilinx/AMD standard compliance. Lead-free finish on FTBGA package.
