XA7A50T-1CSG325Q - Automotive Artix-7 FPGA, 52K LC | AMD
MPN: XA7A50T-1CSG325Q ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $270 | $2,700.00 |
| 100 | $245 | $24,500.00 |
| 500 | $218 | $109,000.00 |
| 1,000 | $195 | $195,000.00 |
XA7A50T-1CSG325Q Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon IP blocks such as transceivers, block RAM, and DSP slices. Within the broader programmable logic hierarchy, the Artix-7 family sits at the low-power, cost-optimized tier below Kintex-7 and Virtex-7, targeting high-volume, power-sensitive applications. The XA7A50T occupies the mid-density position in the XA Artix-7 lineup and is engineered to replace discrete ASICs and ASSPs in automotive driver assistance, infotainment, and industrial control systems.
Key features include 2,764,800 system gates, 52,160 logic cells, 2,700 Kbits of block RAM distributed across 75 36-Kbit BRAMs, 120 DSP48 slices for fixed- and floating-point arithmetic, and 4 GTP transceivers capable of up to 6.6 Gb/s line rate. The fabric supports clock management tiles (CMTs) for high-precision frequency synthesis, with up to 64 I/O standards including LVDS, HSTL, SSTL, and 1.5V/1.8V/2.5V/3.3V LVCMOS. Programmable logic resources are accompanied by an integrated configuration controller that supports master/slave SelectMAP, JTAG, and SPI flash boot modes.
Architecturally, the device leverages 6-input LUTs for logic optimization and dedicated carry chains for high-speed arithmetic. The XA qualification adds extended temperature testing, PPAP documentation, and longevity support matching automotive program lifecycles. Power is managed through a dedicated core voltage rail (1.0V VCCINT) and separate I/O bank supplies (VCCO), enabling mixed-voltage interfacing on a single die.
Typical applications include automotive driver assistance (ADAS) sensor fusion, surround-view camera processing, vehicle networking gateways, industrial motor control, factory automation, and portable medical imaging. The wide operating temperature and automotive qualification make it particularly suited for under-hood ECUs and zonal architectures.
When designing with the XA7A50T-1CSG325Q, follow AMD's Kintex/Artix-7 PCB layout guidelines for power decoupling — at least 24 low-ESL 0.1µF capacitors around the BGA, plus bulk 47–100µF ceramic on each power rail. The 324-LFBGA requires microvia or via-in-pad PCB technology for reliable assembly.
This page synthesizes distributor pricing, AEC-Q100 automotive qualification details, drop-in Artix-7 alternatives, and PCB design guidance not aggregated in the manufacturer datasheet.
Drop-in alternatives for XA7A50T-1CSG325Q — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XA7A50T-2CSG325Q
✅ Drop-In📋 Reference alternative (not in catalog)
XA7A50T-1CSG325I
✅ Drop-In📋 Reference alternative (not in catalog)
XA7A75T-1CSG325Q
✅ Drop-In📋 Reference alternative (not in catalog)
XA7A35T-1CSG325Q
✅ Drop-In📋 Reference alternative (not in catalog)
XC7A50T-1CSG325I
✅ Drop-In📋 Reference alternative (not in catalog)
XC7A50T-2CSG325C
✅ Drop-In📋 Reference alternative (not in catalog)
XA7A50T-1CSG325Q Maximum Ratings & Electrical Characteristics
| Family | Artix-7 XA (Automotive) |
| Manufacturer | AMD (formerly Xilinx) |
| Logic Cells | 52,160 |
| System Gates | 2,764,800 |
| Block RAM (Total) | 2,700 Kbit |
| Block RAM Blocks (36 Kbit) | 75 |
| DSP Slices (DSP48E1) | 120 |
| User I/O | 150 |
| GTP Transceivers | 4 (up to 6.6 Gb/s) |
| Package | 324-ball LFBGA, CSPBGA (CSG325) |
| Speed Grade | -1 |
| Process Technology | 28nm HKMG low-power |
| Operating Temperature | -40C to +100C (automotive Q grade) |
| Automotive Qualification | AEC-Q100 |
| Configuration Memory | Volatile (external SPI flash boot) |
| Core Voltage (VCCINT) | 1.0 V |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
XA7A50T-1CSG325Q 324-ball lfbga, cspbga (csg325) Pin Configuration Guide
Pin configuration for XA7A50T-1CSG325Q (324-ball lfbga, cspbga (csg325) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XA7A50T-1CSG325Q.
Refer to the datasheet for full pin configuration.
Typical Applications
XA7A50T-1CSG325Q is suitable for 6 applications: Automotive ADAS Sensor Fusion, Automotive Surround-View Camera ECU, Vehicle Zonal Gateway / Network Aggregator, Industrial Motor Control and Servo Drive, Automotive Infotainment Head Unit, Factory Automation PLC Backplane.
Automotive ADAS Sensor Fusion
The XA7A50T-1CSG325Q delivers 52,160 logic cells, 120 DSP48E1 slices, and 4 GTP transceivers (6.6 Gb/s) in an AEC-Q100 qualified 324-LFBGA package, making it ideal for sensor fusion in ADAS electronic control units. The device fuses 2-4 megapixel camera streams with radar/lidar preprocessed data, executing ISP, object detection CNNs, and tracking algorithms at 30 fps with sub-100 ms latency. The XA automotive qualification, -40C to +100C operation, and PPAP support satisfy ISO 26262 ASIL-B program requirements when paired with proper safety mechanisms and AMD's SEM IP.
Recommended
Automotive Surround-View Camera ECU
The XA7A50T-1CSG325Q serves as the central processor in 4-camera surround-view systems, stitching 2MP streams from each camera into a top-down bird's-eye view. The 120 DSP slices handle real-time lens distortion correction and image warping while 2,700 Kbit block RAM buffers multi-frame composition. Its 150 user I/O connect directly to four MIPI-CSI2 deserializer ICs and a CAN-FD vehicle network bridge, with AEC-Q100 qualification ensuring 15-year automotive longevity under hood and cabin thermal stress.
Recommended
Vehicle Zonal Gateway / Network Aggregator
In modern zonal E/E architectures, the XA7A50T-1CSG325Q aggregates CAN-FD, LIN, FlexRay, and 100BASE-T1 Ethernet traffic between domain ECUs. The 4 GTP transceivers (6.6 Gb/s) carry automotive Ethernet at 1 Gbps while 150 user I/O handle multiple CAN-FD channels via external transceivers. AEC-Q100 grade-2 qualification, 28nm low-power silicon, and AMD's longevity commitment make it a stable choice for OEM platform programs running 7-10 years.
Recommended
Industrial Motor Control and Servo Drive
The XA7A50T-1CSG325Q's 120 DSP slices and 52K logic cells execute Field-Oriented Control (FOC) loops at 50 µs cycle time for industrial servo drives up to 15 kW. Its 28nm low-power process enables fanless operation, while the AEC-Q100 qualification provides headroom for factory-floor thermal exposure and vibration stress. The 324-LFBGA package fits compact IP65-sealed drives for robotics and CNC machinery, and AMD's 15-year longevity program matches industrial OEM production runs.
Recommended
Automotive Infotainment Head Unit
The XA7A50T-1CSG325Q powers next-generation automotive head units by handling H.265 video decode, display composition, and multi-zone audio mixing. With 2,700 Kbit block RAM and 120 DSP slices, it drives dual 1080p displays while bridging LVDS to the central SoC. The device's -40C to +100C operating range covers cabin and dashboard mounting positions, and AEC-Q100 PPAP documentation accelerates OEM qualification under IATF 16949 process requirements.
Recommended
Factory Automation PLC Backplane
The XA7A50T-1CSG325Q integrates into industrial PLC and PAC backplanes, implementing EtherCAT master, PROFINET IRT, and OPC-UA protocols with deterministic cycle times below 250 µs. Its 4 GTP transceivers aggregate multiple fieldbus segments while 150 user I/O interface to digital and analog I/O cards. AEC-Q100 qualification exceeds typical industrial -25C to +85C requirements, ensuring reliability in harsh factory environments with extended thermal and vibration stress.
Recommended
Recommended Products Summary
Engineering reference data for XA7A50T-1CSG325Q — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XA7A50T-2CSG325Q | XA7A50T-1CSG325I | XA7A75T-1CSG325Q | XA7A35T-1CSG325Q | XC7A50T-1CSG325I |
|---|---|---|---|---|---|---|
| Package | 324-ball LFBGA (CSG325) | 324-ball LFBGA (CSG325) - same | 324-ball LFBGA (CSG325) - same | 324-ball LFBGA (CSG325) - same | 324-ball LFBGA (CSG325) - same | 324-ball LFBGA (CSG325) - same |
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | |
| Logic Cells | 52,160 | 52,160 (same) | 75,520 (+45%) | 33,280 (-36%) | 52,160 (same) | |
| Speed Grade | -1 | -2 (faster) | -1 (same) | -1 (same) | ||
| Automotive Qualification | AEC-Q100 (Q-grade -40C to +100C) | AEC-Q100 (Q-grade) | Industrial only (-40C to +100C, no AEC-Q100) | Industrial only (no AEC-Q100) | ||
| DSP48E1 Slices | 120 | 120 (same) | 180 (+50%) | 90 (-25%) | ||
| Block RAM (Kbit) | 2,700 | 2,700 (same) | 3,780 (+40%) | 1,800 (-33%) | ||
| User I/O | 150 | 150 (same) | 210 (different CSG package variant needed) | 150 (same) | ||
| GTP Transceivers | 4 (up to 6.6 Gb/s) | 4 (same) | 4 (same) | 4 (same) | ||
| Approx. Unit Price (1k qty) | $195 | $215 (faster grade, +10%) | $245 (+25%) | $155 (-20%) |
Key Differentiators
- AEC-Q100 automotive qualification with PPAP support (vs XC7A50T-1CSG325I)
- Mid-density sweet spot in Artix-7 XA family (vs XA7A35T-1CSG325Q / XA7A75T-1CSG325Q)
- Speed-grade -1 with automotive Q temperature (vs XA7A50T-2CSG325Q)
Design Notes
The XA7A50T-1CSG325Q requires a 1.0V VCCINT core supply and a separate VCCO supply (1.2V-3.3V) for each I/O bank. AMD recommends at least 24 low-ESL 0.1µF ceramic capacitors distributed around the BGA perimeter, plus 47-100µF bulk ceramic on each rail. Estimated: at 50% toggle rate with all 4 GTP transceivers active, quiescent current is approximately 1.2A on VCCINT, requiring a switching regulator with at least 3A peak capability for inrush margin.
The 324-ball LFBGA (CSG325) at 0.8mm pitch requires microvia or via-in-pad PCB technology for reliable assembly. Use ENIG surface finish and 0.4mm laser-drilled microvias with copper-filled plating. Match all high-speed GTP serial pairs to 100 ohm differential impedance with 4-mil trace width on 0.2mm dielectric, and keep pair skew below 1 ps to meet 6.6 Gb/s compliance. AMD UG483 provides detailed routing guidelines.
At full fabric utilization (80% LUTs + 120 DSPs + 4 GTP at 6.6 Gb/s), the XA7A50T-1CSG325Q dissipates approximately 3.5W. With the CSG325 LFBGA package at typical 14 C/W theta_JA (4-layer PCB with thermal vias under center balls), junction temperature rise is about 49C above ambient. The -40C to +100C automotive Q-grade allows up to 125C junction, giving 26C design margin. Add thermal vias (0.3mm pitch, 25 per Xilinx-recommended pattern) to maximize heat transfer to inner copper planes.
Do not migrate from the commercial XC7A50T-1CSG325I to the XA7A50T-1CSG325Q assuming bitstream compatibility. While the silicon die is identical, AMD's XA silicon revisions include updated bitstream CRC validation and temperature-grade authentication blocks that require recompiling the bitstream with Vivado 2023.2 or later using the XA device target. Older ISE 14.7 bitstreams will fail configuration on XA parts.
Compliance Information
AEC-Q100 automotive qualified per AMD XA product family. RoHS and REACH compliant per Digikey and Avnet compliance data. DRC Conflict Free per AMD's Conflict Minerals Report. Halogen-free status not explicitly stated in the provided web data.
