10AX090S1F45E1SG vs 10AX090S3F45E2LG Comparison

Detailed side-by-side comparison of 10AX090S1F45E1SG by Intel and 10AX090S3F45E2LG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10AX090S1F45E1SG 10AX090S3F45E2LG
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $8,200.00 $12,480.00
Family Arria 10 GX —
Logic Elements (LE) 900,000 —
Embedded Memory Bits 59,234,304 bits —
User I/Os 624 —
Package 1932-BBGA, FCBGA 1932-ball FCBGA (F45, 45mm flip-chip BGA)
Speed Grade -1 S3 (-2 speed grade equivalent)
Transceiver Data Rate (max) 28.05 Gbps —
Process Node 20 nm TSMC 20nm
Hardened PCI Express Gen3 Yes —
Hardened DDR4 Controller Yes —
Operating Temperature Range [DATA_NEEDED: operating temperature range] 0C to 100C (E2 commercial)
Supply Voltage (Core) 0.85 V (typ) —
Supply Voltage (I/O) [DATA_NEEDED: VCCIO voltage] —
Configuration Mode JTAG / Active Serial / Active Parallel —
RoHS Status Compliant Compliant
Series — Arria 10 GX
Logic Elements — 900,000
Adaptive Logic Modules (ALMs) — 339,620
Embedded Memory (bits) — 59,234,304
DSP Blocks — 1,518
Transceivers — 624 (per package aggregate channels)
Maximum Transceiver Data Rate — 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT)
Core Voltage (nominal) — 0.9 V
User I/O Banks — 12
Maximum User I/O — 624
Mounting Type — Surface Mount (BGA)
Memory Interfaces — DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3

Datasheets & Resources

Browse All Products Create BOM Request Quote