10AX090S3F45E2LG vs 10AX090S2F45E2SG Comparison
Detailed side-by-side comparison of 10AX090S3F45E2LG by Intel and 10AX090S2F45E2SG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10AX090S3F45E2LG | 10AX090S2F45E2SG |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $12,480.00 | $2,050.00 |
| Series | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Adaptive Logic Modules (ALMs) | 339,620 | — |
| Embedded Memory (bits) | 59,234,304 | 59,234,304 |
| DSP Blocks | 1,518 | [DATA_NEEDED: variable-precision DSP count] |
| Transceivers | 624 (per package aggregate channels) | [DATA_NEEDED: number of transceiver channels] |
| Maximum Transceiver Data Rate | 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT) | — |
| Package | 1932-ball FCBGA (F45, 45mm flip-chip BGA) | — |
| Process Node | TSMC 20nm | 20nm TSMC |
| Core Voltage (nominal) | 0.9 V | — |
| User I/O Banks | 12 | — |
| Maximum User I/O | 624 | — |
| Operating Temperature Range | 0C to 100C (E2 commercial) | — |
| Speed Grade | S3 (-2 speed grade equivalent) | -2 (mid) |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| RoHS Status | Compliant | Compliant |
| Memory Interfaces | DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3 | — |
| User I/O Count | — | 624 |
| Logic Blocks | — | [DATA_NEEDED: ALM count] |
| Package Type | — | 1932-BBGA, FCBGA |
| Operating Temperature | — | -40C to +100C (E2 = extended) |
| MSL Level | — | [DATA_NEEDED: moisture sensitivity level] |
| Lead-Free | — | Yes |
| Family | — | Arria 10 |
| Device Variant | — | GX (transceiver-equipped) |
| Ball Count | — | 1932 |