10AX090S3F45E2LG vs 10AX090S2F45E2SG Comparación
Comparación detallada lado a lado de 10AX090S3F45E2LG por Intel y 10AX090S2F45E2SG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX090S3F45E2LG | 10AX090S2F45E2SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $12.480,00 | $2.050,00 |
| Series | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Adaptive Logic Modules (ALMs) | 339,620 | — |
| Embedded Memory (bits) | 59,234,304 | 59,234,304 |
| DSP Blocks | 1,518 | [DATA_NEEDED: variable-precision DSP count] |
| Transceivers | 624 (per package aggregate channels) | [DATA_NEEDED: number of transceiver channels] |
| Maximum Transceiver Data Rate | 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT) | — |
| Encapsulado | 1932-ball FCBGA (F45, 45mm flip-chip BGA) | — |
| Process Node | TSMC 20nm | 20nm TSMC |
| Core Voltage (nominal) | 0.9 V | — |
| User I/O Banks | 12 | — |
| Maximum User I/O | 624 | — |
| Rango de temperatura de funcionamiento | 0C to 100C (E2 commercial) | — |
| Speed Grade | S3 (-2 speed grade equivalent) | -2 (mid) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Memory Interfaces | DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3 | — |
| User I/O Count | — | 624 |
| Logic Blocks | — | [DATA_NEEDED: ALM count] |
| Package Type | — | 1932-BBGA, FCBGA |
| Temperatura de funcionamiento | — | -40C to +100C (E2 = extended) |
| Nivel MSL | — | [DATA_NEEDED: moisture sensitivity level] |
| Lead-Free | — | Yes |
| Family | — | Arria 10 |
| Device Variant | — | GX (transceiver-equipped) |
| Ball Count | — | 1932 |