10AX090S3F45I2SG vs 10AX090S3F45E2LG Comparison

Detailed side-by-side comparison of 10AX090S3F45I2SG by Intel and 10AX090S3F45E2LG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10AX090S3F45I2SG 10AX090S3F45E2LG
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $4,563.74 $12,480.00
Series Arria 10 GX Arria 10 GX
Logic Elements 900,000 900,000
Embedded Memory Bits 59,234,304 —
User I/Os 624 —
Process Technology 20 nm —
Core Supply Voltage 0.9 V —
Package 1932-ball FCBGA (F45) 1932-ball FCBGA (F45, 45mm flip-chip BGA)
Mounting Type Surface Mount Surface Mount (BGA)
Temperature Grade Industrial —
Speed Grade I2 S3 (-2 speed grade equivalent)
Transceivers Up to 96 (12.5 Gbps chip-to-chip) 624 (per package aggregate channels)
Hard PCIe IP PCIe Gen3 x8 (backwards compatible to Gen2/Gen1) —
Hard Memory Controllers 2 (DDR4, DDR3, QDRIV, RLDRAM3) —
DSP Blocks Variable-precision, up to ~1.5 TFLOPs FP32 1,518
LVDS Channels Up to 1.6 Gbps —
RoHS Status Compliant Compliant
Adaptive Logic Modules (ALMs) — 339,620
Embedded Memory (bits) — 59,234,304
Maximum Transceiver Data Rate — 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT)
Process Node — TSMC 20nm
Core Voltage (nominal) — 0.9 V
User I/O Banks — 12
Maximum User I/O — 624
Operating Temperature Range — 0C to 100C (E2 commercial)
Memory Interfaces — DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3

Datasheets & Resources

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