10AX090S3F45I2SG vs 10AX090S3F45E2LG Comparación
Comparación detallada lado a lado de 10AX090S3F45I2SG por Intel y 10AX090S3F45E2LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX090S3F45I2SG | 10AX090S3F45E2LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4.563,74 | $12.480,00 |
| Series | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Embedded Memory Bits | 59,234,304 | — |
| User I/Os | 624 | — |
| Process Technology | 20 nm | — |
| Core Supply Voltage | 0.9 V | — |
| Encapsulado | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45, 45mm flip-chip BGA) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperature Grade | Industrial | — |
| Speed Grade | I2 | S3 (-2 speed grade equivalent) |
| Transceivers | Up to 96 (12.5 Gbps chip-to-chip) | 624 (per package aggregate channels) |
| Hard PCIe IP | PCIe Gen3 x8 (backwards compatible to Gen2/Gen1) | — |
| Hard Memory Controllers | 2 (DDR4, DDR3, QDRIV, RLDRAM3) | — |
| DSP Blocks | Variable-precision, up to ~1.5 TFLOPs FP32 | 1,518 |
| LVDS Channels | Up to 1.6 Gbps | — |
| Estado RoHS | Compliant | Compliant |
| Adaptive Logic Modules (ALMs) | — | 339,620 |
| Embedded Memory (bits) | — | 59,234,304 |
| Maximum Transceiver Data Rate | — | 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT) |
| Process Node | — | TSMC 20nm |
| Core Voltage (nominal) | — | 0.9 V |
| User I/O Banks | — | 12 |
| Maximum User I/O | — | 624 |
| Rango de temperatura de funcionamiento | — | 0C to 100C (E2 commercial) |
| Memory Interfaces | — | DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3 |