10M50DCF484I7G vs 10M50DAF484I7G Comparison

Detailed side-by-side comparison of 10M50DCF484I7G by Intel and 10M50DAF484I7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10M50DCF484I7G 10M50DAF484I7G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $99.60 $58.20
Family MAX 10 MAX 10
Logic Elements 50,000 —
Embedded SRAM 1,677,312 bits (1.6 Mb) —
User Flash Memory Up to 5,888 Kb (on-chip dual configuration) —
Maximum User I/O Pins 360 —
LVDS Channels (dedicated) 160 (rx + tx) —
PLLs 4 4
18x18 Hardware Multipliers 144 —
Package 484-ball FBGA (F484), 23x23 mm, 1.0 mm pitch 484-ball FBGA (F484)
Core Voltage 1.2 V (internal) —
Process Technology TSMC 55 nm embedded flash TSMC 55 nm
Operating Junction Temperature -40C to +100C (industrial, 'I' suffix) —
Speed Grade 7 (fastest commercial/industrial) —
Configuration Mode On-chip flash + JTAG Single-chip (no external boot device required)
Integrated ADC 12-bit, up to 17 channels, 1 MSPS 12-bit, 1 MSPS, up to 18 channels
Mounting Type Surface Mount (BGA) Surface Mount (FBGA)
RoHS Status Compliant Compliant
Logic Elements (LE) — 50,000
Embedded Memory (bits) — 1,677,312
Embedded User Flash (bits) — 1,677,312 (dual configuration)
User I/O Count — 360
Package Pitch — 1.0 mm
Package Body Size — 23 x 23 mm
Supply Voltage - Core — 1.2 V
Operating Temperature Grade — Industrial (-40C to +100C)
On-die Configuration Flash — Yes (dual-boot)
DSP Blocks — 144 (18x18 multipliers)
MSL Level — 3 (per JEDEC J-STD-020)
Lead-free / Halogen-free — Yes / Yes

Datasheets & Resources

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