10M50DCF484I7G vs 10M50DAF484I7G 对比
详细并排对比 10M50DCF484I7G 出自 Intel 和 10M50DAF484I7G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | 10M50DCF484I7G | 10M50DAF484I7G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $99.60 | $58.20 |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 50,000 | — |
| Embedded SRAM | 1,677,312 bits (1.6 Mb) | — |
| User Flash Memory | Up to 5,888 Kb (on-chip dual configuration) | — |
| Maximum User I/O Pins | 360 | — |
| LVDS Channels (dedicated) | 160 (rx + tx) | — |
| PLLs | 4 | 4 |
| 18x18 Hardware Multipliers | 144 | — |
| 封装 | 484-ball FBGA (F484), 23x23 mm, 1.0 mm pitch | 484-ball FBGA (F484) |
| Core Voltage | 1.2 V (internal) | — |
| Process Technology | TSMC 55 nm embedded flash | TSMC 55 nm |
| 工作结温 | -40C to +100C (industrial, 'I' suffix) | — |
| Speed Grade | 7 (fastest commercial/industrial) | — |
| Configuration Mode | On-chip flash + JTAG | Single-chip (no external boot device required) |
| Integrated ADC | 12-bit, up to 17 channels, 1 MSPS | 12-bit, 1 MSPS, up to 18 channels |
| 安装类型 | Surface Mount (BGA) | Surface Mount (FBGA) |
| RoHS 状态 | Compliant | Compliant |
| Logic Elements (LE) | — | 50,000 |
| Embedded Memory (bits) | — | 1,677,312 |
| Embedded User Flash (bits) | — | 1,677,312 (dual configuration) |
| User I/O Count | — | 360 |
| Package Pitch | — | 1.0 mm |
| Package Body Size | — | 23 x 23 mm |
| Supply Voltage - Core | — | 1.2 V |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| On-die Configuration Flash | — | Yes (dual-boot) |
| DSP Blocks | — | 144 (18x18 multipliers) |
| MSL 等级 | — | 3 (per JEDEC J-STD-020) |
| Lead-free / Halogen-free | — | Yes / Yes |