5CGXBC9D6F27C7N vs 5CGXBC5C7F27C8N Comparison

Detailed side-by-side comparison of 5CGXBC9D6F27C7N by Intel and 5CGXBC5C7F27C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 5CGXBC9D6F27C7N 5CGXBC5C7F27C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $289.00 $54.18
Family Cyclone V GX Cyclone® V GX
Logic Elements 301,000 —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory 14,251,008 bits —
Memory Blocks (M20K) [DATA_NEEDED: M20K count] —
Embedded Multipliers (18x18) 336 —
Transceivers GX family transceivers (per package variant) 6 × 3.125 Gbps (GX)
Transceiver Data Rate Up to 3.125 Gbps —
PCIe Hard IP Yes, Gen1/Gen2 Yes (Gen1/Gen2)
Core Voltage 1.1 V 1.1 V
I/O Voltage Support 1.2 V to 3.3 V (bank-dependent) —
User I/O Pins [DATA_NEEDED: user I/O count for FBGA-672] —
Process Technology 28 nm TSMC low-power —
Package 672-ball FBGA 672-pin FBGA (F27, 27 mm × 27 mm)
Speed/Grade C7 (commercial, speed grade 7) —
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
MSL Level [DATA_NEEDED: MSL rating] —
RoHS Status Compliant Compliant
Logic Elements (LE) — 77,000
Adaptive Logic Modules (ALM) — 29,080
Total Embedded Memory — 5,001,216 bits (4,884 Kbits usable)
Embedded Memory Blocks (M10K + MLAB) — 446 × M10K + 231 × MLAB (approx.)
18 × 18 Multipliers — 364
PLLs — 6
Global Clock Networks — 16
Maximum User I/O — [DATA_NEEDED: maximum user I/O count]
Process Node — 28 nm TSMC low-power
Operating Temperature — 0 °C to +85 °C (commercial, C8)
Configuration — JTAG (IEEE 1149.1) + Active Serial

Datasheets & Resources

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