5CGXBC9D6F27C7N vs 5CGXBC5C7F27C8N 비교

다음의 상세 나란히 비교: 5CGXBC9D6F27C7N 제조: Intel 및 5CGXBC5C7F27C8N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

사양 비교

파라미터 5CGXBC9D6F27C7N 5CGXBC5C7F27C8N
브랜드 Intel Intel
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 활성 활성
재고 상태 In Stock In Stock
단가 (USD) $289.00 $54.18
Family Cyclone V GX Cyclone® V GX
Logic Elements 301,000 —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory 14,251,008 bits —
Memory Blocks (M20K) [DATA_NEEDED: M20K count] —
Embedded Multipliers (18x18) 336 —
Transceivers GX family transceivers (per package variant) 6 × 3.125 Gbps (GX)
Transceiver Data Rate Up to 3.125 Gbps —
PCIe Hard IP Yes, Gen1/Gen2 Yes (Gen1/Gen2)
Core Voltage 1.1 V 1.1 V
I/O Voltage Support 1.2 V to 3.3 V (bank-dependent) —
User I/O Pins [DATA_NEEDED: user I/O count for FBGA-672] —
Process Technology 28 nm TSMC low-power —
패키지 672-ball FBGA 672-pin FBGA (F27, 27 mm × 27 mm)
Speed/Grade C7 (commercial, speed grade 7) —
실장 유형 Surface Mount (BGA) Surface Mount (BGA)
MSL 레벨 [DATA_NEEDED: MSL rating] —
RoHS 상태 Compliant Compliant
Logic Elements (LE) — 77,000
Adaptive Logic Modules (ALM) — 29,080
Total Embedded Memory — 5,001,216 bits (4,884 Kbits usable)
Embedded Memory Blocks (M10K + MLAB) — 446 × M10K + 231 × MLAB (approx.)
18 × 18 Multipliers — 364
PLLs — 6
Global Clock Networks — 16
Maximum User I/O — [DATA_NEEDED: maximum user I/O count]
Process Node — 28 nm TSMC low-power
동작 온도 — 0 °C to +85 °C (commercial, C8)
Configuration — JTAG (IEEE 1149.1) + Active Serial

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