5CGXBC9D6F27C7N vs 5CGXBC5C7F27C8N 对比
详细并排对比 5CGXBC9D6F27C7N 出自 Intel 和 5CGXBC5C7F27C8N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | 5CGXBC9D6F27C7N | 5CGXBC5C7F27C8N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $289.00 | $54.18 |
| Family | Cyclone V GX | Cyclone® V GX |
| Logic Elements | 301,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 14,251,008 bits | — |
| Memory Blocks (M20K) | [DATA_NEEDED: M20K count] | — |
| Embedded Multipliers (18x18) | 336 | — |
| Transceivers | GX family transceivers (per package variant) | 6 × 3.125 Gbps (GX) |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| PCIe Hard IP | Yes, Gen1/Gen2 | Yes (Gen1/Gen2) |
| Core Voltage | 1.1 V | 1.1 V |
| I/O Voltage Support | 1.2 V to 3.3 V (bank-dependent) | — |
| User I/O Pins | [DATA_NEEDED: user I/O count for FBGA-672] | — |
| Process Technology | 28 nm TSMC low-power | — |
| 封装 | 672-ball FBGA | 672-pin FBGA (F27, 27 mm × 27 mm) |
| Speed/Grade | C7 (commercial, speed grade 7) | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL 等级 | [DATA_NEEDED: MSL rating] | — |
| RoHS 状态 | Compliant | Compliant |
| Logic Elements (LE) | — | 77,000 |
| Adaptive Logic Modules (ALM) | — | 29,080 |
| Total Embedded Memory | — | 5,001,216 bits (4,884 Kbits usable) |
| Embedded Memory Blocks (M10K + MLAB) | — | 446 × M10K + 231 × MLAB (approx.) |
| 18 × 18 Multipliers | — | 364 |
| PLLs | — | 6 |
| Global Clock Networks | — | 16 |
| Maximum User I/O | — | [DATA_NEEDED: maximum user I/O count] |
| Process Node | — | 28 nm TSMC low-power |
| 工作温度 | — | 0 °C to +85 °C (commercial, C8) |
| Configuration | — | JTAG (IEEE 1149.1) + Active Serial |