5CGXBC9D6F27C7N vs 5CGXBC5C7F27C8N Vergleich

Detaillierter Direktvergleich von 5CGXBC9D6F27C7N von Intel und 5CGXBC5C7F27C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 5CGXBC9D6F27C7N 5CGXBC5C7F27C8N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $289,00 $54,18
Family Cyclone V GX Cyclone® V GX
Logic Elements 301,000 —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory 14,251,008 bits —
Memory Blocks (M20K) [DATA_NEEDED: M20K count] —
Embedded Multipliers (18x18) 336 —
Transceivers GX family transceivers (per package variant) 6 × 3.125 Gbps (GX)
Transceiver Data Rate Up to 3.125 Gbps —
PCIe Hard IP Yes, Gen1/Gen2 Yes (Gen1/Gen2)
Core Voltage 1.1 V 1.1 V
I/O Voltage Support 1.2 V to 3.3 V (bank-dependent) —
User I/O Pins [DATA_NEEDED: user I/O count for FBGA-672] —
Process Technology 28 nm TSMC low-power —
Gehäuse 672-ball FBGA 672-pin FBGA (F27, 27 mm × 27 mm)
Speed/Grade C7 (commercial, speed grade 7) —
Montageart Surface Mount (BGA) Surface Mount (BGA)
MSL-Level [DATA_NEEDED: MSL rating] —
RoHS-Status Compliant Compliant
Logic Elements (LE) — 77,000
Adaptive Logic Modules (ALM) — 29,080
Total Embedded Memory — 5,001,216 bits (4,884 Kbits usable)
Embedded Memory Blocks (M10K + MLAB) — 446 × M10K + 231 × MLAB (approx.)
18 × 18 Multipliers — 364
PLLs — 6
Global Clock Networks — 16
Maximum User I/O — [DATA_NEEDED: maximum user I/O count]
Process Node — 28 nm TSMC low-power
Betriebstemperatur — 0 °C to +85 °C (commercial, C8)
Configuration — JTAG (IEEE 1149.1) + Active Serial

Datenblätter & Ressourcen

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