5CSEBA4U19C7N vs 5CSEBA4U19A7N Comparison

Detailed side-by-side comparison of 5CSEBA4U19C7N by Intel and 5CSEBA4U19A7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 5CSEBA4U19C7N 5CSEBA4U19A7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $36.92 $99.90
Series Cyclone V SE SoC FPGA —
Family 5CSEBA4 (U19 device) Cyclone V SE SoC FPGA
Logic Elements 40 K 40 K
HPS Cores Dual ARM Cortex-A9 MPCore with CoreSight —
HPS Max Frequency 800 MHz —
DSP Blocks Variable-precision DSP (number not specified in data) —
Embedded Memory [DATA_NEEDED: total Kbits of embedded RAM] 3.4 Mbits (M9K)
Embedded Multipliers 56 (18x18) —
PLLs 4 [DATA_NEEDED: PLL count]
Hard Memory Controllers 2 —
Hard USB 2.0 OTG Yes —
Hard PCIe Gen2 Yes (rootport/endpoint configurable) —
Core Voltage 1.1 V 1.1 V (typical)
Process Technology 28 nm low-power —
Operating Temperature 0 C to +85 C (commercial) —
Package 484-pin UBG A (UBGA), 19x19 mm 484-UBGA (U19), 19x19 mm, 1.0 mm pitch
AES Encryption Supported —
SEU Error Detection/Correction Supported —
Configuration Interface JTAG —
RoHS Status Compliant Compliant
Hard Processor System — Dual ARM Cortex-A9 MPCore with CoreSight
Adaptive Logic Modules — [DATA_NEEDED: ALM count]
DSP Blocks (18x18 Multipliers) — 224
HPS Maximum Application Clock — 925 MHz
Memory Interfaces — DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA
User I/O — 161
Mounting Type — Surface Mount (BGA)
Operating Junction Temperature — -40C to +125C (automotive) / -40C to +100C (industrial)
Process Node — TSMC 28 nm low-power
MSL Level — 3 (168 hours)

Datasheets & Resources

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